Abstract: A printed circuit board (20) includes a sub-assembly having dielectric (22) and conductive layers (24). A hole (26) extends into the sub-assembly. Metal plating (32) is applied on a barrel (27) of the hole (26). A conductive layer (32) and an etch resist (34) are applied to a first photoresist (30) on the hole barrel (27). The first photoresist (30) is removed and a second photoresist (36) is applied leaving areas to be controlled depth etched exposed. The exposed areas (38) are chemically etched. The second layer of photoresist (36) is removed and a second chemical etch operation is performed to define previously plated features (40) on the sub-assembly (20). The etch resist (34) is then removed.

Abstract: A product of and method for laminating and interconnecting multiple layer printed circuit boards (14) includes at least two complementary substrates (10 and 12) each having a solder bump (30) formed from conductive material (28) applied to a desired component (22). A dam network (34) is formed about the bumps (30) to prevent undesired spreading of the conductive material (28). Bonding material (36) between the surfaces (38a and 38b) of the substrates (10 and 12) bonds the multiple layers. The bonding material (36) has apertures through which the solder bumps (30) are connected.

Abstract: The present invention provides a flexible film antenna. The flexible film antenna includes a radiating element comprising a conductive trace on a flexible film. Flexible film is mounted on a core. The core comprises at least two parts that are releasably coupled together in snap or sliding relation. A feed post extends out a base of the core to connect to a power feed. Finally, a protective housing can be molded over the antenna.