Patents by Inventor Thomas P. Miltich
Thomas P. Miltich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20190090742Abstract: An embodiment of a sensor device includes a base substrate, a circuit pattern formed overlying the interior surface of the substrate, a physiological characteristic sensor element on the exterior surface of the substrate, conductive plug elements located in vias formed through the substrate, each conductive plug element having one end coupled to a sensor electrode, and having another end coupled to the circuit pattern, a multilayer component stack carried on the substrate and connected to the circuit pattern, the stack including features and components to provide processing and wireless communication functionality for sensor data obtained in association with operation of the sensor device, and an enclosure structure coupled to the substrate to enclose the interior surface of the substrate, the circuit pattern, and the stack.Type: ApplicationFiled: September 26, 2017Publication date: March 28, 2019Inventors: Daniel Hahn, David Probst, Randal Schulhauser, Mohsen Askarinya, Patrick W. Kinzie, Thomas P. Miltich, Mark D. Breyen, Santhisagar Vaddiraju
-
Publication number: 20190090743Abstract: Processes for fabricating physiological characteristic sensor devices are disclosed here. An embodiment of the fabrication process forms a circuit pattern on a base substrate, where the circuit pattern includes circuit layouts for multiple die locations. Component stacks are mounted to the circuit layouts. Each stack has features and components to provide processing and wireless communication functionality for obtained sensor data. An enclosure structure is formed overlying the base substrate to individually cover and enclose each of the component stacks. Sensor elements are fabricated on another surface of the substrate such that each sensor element has electrodes coupled to conductive plug elements formed through the substrate, and such that each sensor element corresponds to one die location. Next, the substrate is separated into physically discrete sensor device components.Type: ApplicationFiled: September 26, 2017Publication date: March 28, 2019Inventors: Daniel Hahn, David Probst, Randal Schulhauser, Mohsen Askarinya, Patrick W. Kinzie, Thomas P. Miltich, Mark D. Breyen, Santhisagar Vaddiraju
-
Patent number: 10201335Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.Type: GrantFiled: July 25, 2016Date of Patent: February 12, 2019Assignee: Medtronic, Inc.Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
-
Publication number: 20160331978Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.Type: ApplicationFiled: July 25, 2016Publication date: November 17, 2016Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
-
Patent number: 9398901Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.Type: GrantFiled: December 6, 2013Date of Patent: July 26, 2016Assignee: Medtronic, Inc.Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
-
Patent number: 9061161Abstract: In one example, a filtered feedthrough assembly for a medical device, such as, e.g., an implantable medical device, is described. The filtered feedthrough assembly may comprise a feedthrough comprising at least one feedthrough conductive pathway extending between a first feedthrough side and a second feedthrough side; a capacitive filter array comprising at least one filter array conductive pathway extending between a first filter array side and a second filter array side, and at least one capacitor filter substantially surrounding at least a portion the at least one filter array conductive pathway; and at least one electrically conductive member electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway.Type: GrantFiled: August 28, 2012Date of Patent: June 23, 2015Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Thomas P. Miltich, Gordon O. Munns, Simon E. Goldman
-
Publication number: 20140360748Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.Type: ApplicationFiled: August 22, 2014Publication date: December 11, 2014Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
-
Patent number: 8844103Abstract: Methods for making feedthrough assemblies including a capacitive filter array are disclosed. Methods disclosed include attaching a perimeter wall of the capacitor filter array to an interior wall of a ferrule, depositing a thick film conductive paste within at least one passageway to form a conductive pathway, and heating the ferrule, capacitor filter array and the thick film conductive paste to convert the paste to a relatively solid material.Type: GrantFiled: November 30, 2011Date of Patent: September 30, 2014Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
-
Patent number: 8849404Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a lead frame assembly. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. The lead frame assembly may include an electrically conductive lead electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway.Type: GrantFiled: November 30, 2011Date of Patent: September 30, 2014Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
-
Publication number: 20140163646Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.Type: ApplicationFiled: December 6, 2013Publication date: June 12, 2014Applicant: Medtronic, Inc.Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
-
Patent number: 8644936Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.Type: GrantFiled: January 9, 2012Date of Patent: February 4, 2014Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
-
Patent number: 8639341Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.Type: GrantFiled: August 9, 2013Date of Patent: January 28, 2014Assignee: Medtronic, Inc.Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K Yamamoto, Brad C Tischendorf, James D Reinke, Andrew J Thom, Thomas P Miltich, William John Taylor, Kenneth C Gardeski, Larry Earl Tyler, Jeffrey O York, Gordon O Munns
-
Publication number: 20130325086Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.Type: ApplicationFiled: August 9, 2013Publication date: December 5, 2013Applicant: Medtronic, Inc.Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
-
Patent number: 8509899Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.Type: GrantFiled: January 18, 2011Date of Patent: August 13, 2013Assignee: Medtronic, Inc.Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
-
Publication number: 20130176658Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.Type: ApplicationFiled: January 9, 2012Publication date: July 11, 2013Applicant: MEDTRONIC, INC.Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
-
Publication number: 20130138187Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening and attached to the ferrule, and a plurality of chip capacitors. In some examples, the feedthrough may include a plurality of feedthrough conductive pathways extending between an externally-facing side of the feedthrough and an internally-facing side of the feedthrough. In some examples, respective ones of the plurality of chip capacitors are electrically connected to respective ones of the plurality of feedthrough conductive pathways and electrically connected to the ferrule.Type: ApplicationFiled: November 30, 2011Publication date: May 30, 2013Applicant: MEDTRONIC, INC.Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
-
Publication number: 20130138186Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening and attached to the feedthrough, and a capacitor array. In some examples, the feedthrough may include a plurality of feedthrough conductive pathways extending between an externally-facing side of the feedthrough and an internally-facing side of the feedthrough. Additionally, the capacitor array may include a printed board and a plurality of capacitors disposed on the printed board. In some examples, respective ones of the plurality of feedthrough conductive pathways are electrically connected to respective ones of the plurality of capacitors.Type: ApplicationFiled: November 30, 2011Publication date: May 30, 2013Applicant: MEDTRONIC, INC.Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
-
Publication number: 20130127567Abstract: In one example, a filtered feedthrough assembly for a medical device, such as, e.g., an implantable medical device, is described. The filtered feedthrough assembly may comprise a feedthrough comprising at least one feedthrough conductive pathway extending between a first feedthrough side and a second feedthrough side; a capacitive filter array comprising at least one filter array conductive pathway extending between a first filter array side and a second filter array side, and at least one capacitor filter substantially surrounding at least a portion the at least one filter array conductive pathway; and at least one electrically conductive member electrically coupling the at least one filter array conductive pathway to the at least one feedthrough conductive pathway.Type: ApplicationFiled: August 28, 2012Publication date: May 23, 2013Applicant: MEDTRONIC, INC.Inventors: Rajesh V. Iyer, Thomas P. Miltich, Gordon O. Munns, Simon E. Goldman
-
Publication number: 20130058003Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.Type: ApplicationFiled: November 30, 2011Publication date: March 7, 2013Applicant: MEDTRONIC, INC.Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich
-
Publication number: 20130058004Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and an electrically insulating material disposed between an externally-facing filter array side and an internally-facing feedthrough side. In some examples, the feedthrough includes at least one feedthrough conductive pathway extending between an internally-facing feedthrough side and an externally-facing feedthrough side. In some examples, the capacitive filter array includes at least one filter array conductive pathway extending between an internally-facing filter array side and an externally-facing filter array side. In some examples, at least one of the ferrule, the feedthrough, or the capacitive filter array defines an underfill access channel through which the electrically insulating material is introduced.Type: ApplicationFiled: November 30, 2011Publication date: March 7, 2013Applicant: MEDTRONIC, INC.Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich