Abstract: In one aspect, there is provided a heat pump system which comprises an enclosure and an electrostatic compressor. The enclosure is substantially filled with a first fluid and includes a plurality of compressor vanes, a heat exchanger, and a control module. The plurality of compressor vanes are responsive to electrical stimulus and are substantially separated from each other so that the first fluid extends to and at least partially occupies a space between adjoining pairs of the compressor vanes. The heat exchanger is thermally coupled to the first fluid in the space between the compressor vanes and to a second fluid substantially outside the enclosure. The control module is responsive to input information and includes an electrical circuit that provides the electrical stimulus to the compressor vanes. The compressor vanes respond to the electrical stimulus by compressing and releasing the first fluid between the adjoining pairs of compressor vanes.

Abstract: In one aspect, there is provided a heat pump system which comprises an enclosure and an electrostatic compressor. The enclosure is substantially filled with a first fluid and includes a plurality of compressor vanes, a heat exchanger, and a control module. The plurality of compressor vanes are responsive to electrical stimulus and are substantially separated from each other so that the first fluid extends to and at least partially occupies a space between adjoining pairs of the compressor vanes. The heat exchanger is thermally coupled to the first fluid in the space between the compressor vanes and to a second fluid substantially outside the enclosure. The control module is responsive to input information and includes an electrical circuit that provides the electrical stimulus to the compressor vanes. The compressor vanes respond to the electrical stimulus by compressing and releasing the first fluid between the adjoining pairs of compressor vanes.