Abstract: A method for mounting semiconductor chips on a substrate using flip-chip technology and a corresponding assembly are provided, which method includes the steps of: a) providing a semiconductor chip having a component region including components and an edge region, a mounting region containing a plurality of bonding pads being situated in the edge region; b) providing a substrate having a surface including a plurality of lands; c) applying soldering material to the bonding pads and/or to the lands; d) positioning the semiconductor chip on the substrate; and e) melting the soldering material by a soldering process in such a way that the mounting region of the semiconductor chip is moved towards the substrate due to the surface tension of the melting soldering material, and the component region is lifted away from the substrate by the resulting rotation around an axis of rotation or a pivot between the two regions.

Abstract: The invention relates to obtaining and to the topical use of homogenates, extracts and constituents therefrom (e.g. enzymes, lipids, low-molecular proportions) from pupae of diptera, in particular pupae of flies (e.g., the genera Sarcophaga, Musca, Lucilia, Phormia, Calliphora) for the treatment of open or poorly healing wounds of any origin.

Abstract: Disclosed is a wound healing composition comprising a mixture of substances that are obtained from diptera larvae, are heat-resistant at 100° C., and have molecular weights ranging from 500 to 10,000 Dalton. Also, disclosed are the use of said composition as well as a method for the production thereof.

Abstract: A method for mounting semiconductor chips on a substrate using flip-chip technology and a corresponding assembly are provided, which method includes the steps of: a) providing a semiconductor chip having a component region including components and an edge region, a mounting region containing a plurality of bonding pads being situated in the edge region; b) providing a substrate having a surface including a plurality of lands; c) applying soldering material to the bonding pads and/or to the lands; d) positioning the semiconductor chip on the substrate; and e) melting the soldering material by a soldering process in such a way that the mounting region of the semiconductor chip is moved towards the substrate due to the surface tension of the melting soldering material, and the component region is lifted away from the substrate by the resulting rotation around an axis of rotation or a pivot between the two regions.

Abstract: A method for connecting an electronic components to a carrier substrate is described. At least one pad of the component is connected electrically conductively to at least one pad on an upper surface of the carrier substrate. A solder bump is deposited on at least one of the pads to be connected, the component is alignedly mated with the carrier substrate, and the at least one solder bump is soldered in order to wet the contact surfaces. It is provided that during the soldering, the at least one solder bump is deformed within the contacting plane in such a way as to achieve a degree of deformation that permits the two-dimensional analysis of said degree of deformation by a radiograph of the interconnection site.

Abstract: The invention relates to the topical application of fly larval extracts obtainable from fly larvae which are killed and extracted with cooling in aqueous medium or in solvents and are freed of undissolved constituents. The fly larval extracts of various species are suitable for the treatment of superficial or deep chronic and acute wounds of any etiology. The fly larval extracts with a wound-healing effect are obtainable for example from fly larvae of the genera Sarcophaga or Lucilia.