Abstract: An apparatus, method, and program product are provided to predict yield loss associated with performance screens or leakage screens. A leakage model is correlated to an on-chip measurement. Current limited yields are determined from the leakage model. A database is formed relating performance sigma cut-points to the circuit limited yields. A product is quoted based on the circuit limited yield for one of the performance sigma cut-points taken from the database. The quote is tied to the product design and testing.

Abstract: An apparatus, method, and program product are provided to predict yield loss associated with performance screens or leakage screens. A leakage model is correlated to an on-chip measurement. Current limited yields are determined from the leakage model. A database is formed relating performance sigma cut-points to the circuit limited yields. A product is quoted based on the circuit limited yield for one of the performance sigma cut-points taken from the database. The quote is tied to the product design and testing.

Abstract: A storage medium including a method of modeling yield for semiconductor products includes determining expected faults for each of a plurality of library elements by running a critical area analysis on each of the library elements, and assessing, from the critical area analysis, an expected number of faults per unit area, and comparing the same to actual observed faults on previously manufactured semiconductor products. Thereafter, the expected number of faults for each library element is updated in response to observed yield. A database is established, which includes the die size and expected faults for each of the library elements. Integrated circuit product die size is estimated, and library elements to be used to create the integrated circuit die are selected. Fault and size data for each of the selected library elements are obtained, the adjusted estimated faults for each of the library elements are summed, and estimated yield is calculated.

Abstract: A method of modeling yield for semiconductor products includes determining expected faults for each of a plurality of library elements by running a critical area analysis on each of the library elements, and assessing, from the critical area analysis, an expected number of faults per unit area, and comparing the same to actual observed faults on previously manufactured semiconductor products. Thereafter, the expected number of faults for each library element is updated in response to observed yield. A database is established, which includes the die size and expected faults for each of the library elements. Integrated circuit product die size is estimated, and library elements to be used to create the integrated circuit die are selected. Fault and size data for each of the selected library elements are obtained, the adjusted estimated faults for each of the library elements are summed, and estimated yield is calculated.

Abstract: A system and method for determining the early life reliability of an electronic component, including classifying the electronic component based on an initial determination of a number of fatal defects, and estimating a probability of latent defects present in the electronic component based on that classification with the aim of optimizing test costs and product quality.

Abstract: The carpenter saw transporter assembly (20) includes a rectangular plate (32) with a flange (44) for supporting the saw machine (22). A plurality of wheel assemblies (46) are mounted on the flange (44) for transporting the saw machine (22). A mounting rail (52) has a width (Wt) less than the width (Wp) of the plate (32) and is disposed on the plate (32) and presents male or female undercuts (58) between a top portion (54) and a bottom portion (56). The saw machine (22) includes clamps (28) that can be inserted under and mechanically retained by the undercuts (58). A handle tunnel (62) extends into the mounting rail (52) for disposing a slidable handle (60). A locking mechanism (76) is disposed on the mounting rail (52) for locking the handle (60) in various positions. A plurality of docking strips (82) are disposed on the plate (32) for elevating the position of which the clamps (28) are received and eliminating mechanical contacts between the plate (32) and the cranks (30).

Abstract: A system and method for determining the early life reliability of an electronic component, including classifying the electronic component based on an initial determination of a number of fatal defects, and estimating a probability of latent defects present in the electronic component based on that classification with the aim of optimizing test costs and product quality.

Abstract: A system and method for determining the early life reliability of an electronic component, including classifying the electronic component based on an initial determination of a number of fatal defects, and estimating a probability of latent defects present in the electronic component based on that classification with the aim of optimizing test costs and product quality.

Abstract: A method and system for determining minimum post production test time on an integrated circuit device to achieve optimal reliability of that device utilizing defect counts. The number of defective cells or active elements with defective cells (DEFECTS) on the integrated circuit device are counted and this count serves as a basis for determining the minimum test time. A higher number of DEFECTS results in longer post production testing in order to achieve optimum reliability of the integrated circuit device. The number of DEFECTS can be counted on a device internal to the integrated circuit device and made available to determine the minimum required test time. The number of DEFECTS can also be obtained external to the integrated circuit device by intercepting information routed to another device. Information provided internally and externally can also reveal the physical location of DEFECTS to further refine the minimum required test time.

Abstract: A statistical method is described for reliability selection of dies on semiconductor wafers using critical wafer yield parameters. This is combined with other data from the wafer or module level reliability screens (such as voltage screen or burn-in) to obtain the relative latent defect density. Finally the modeled results are compared with actual results to demonstrate confidence in the model.

Abstract: Method for burn-in testing of a wafer having a plurality of dies where the reliability of the fail rate is matched to meet a predetermined criteria. This is accomplished by selecting a subset of dies to be tested and tests are used to weed out the highest number of failures.

Abstract: A system and method for determining the early life reliability of an electronic component, including classifying the electronic component based on an initial determination of a number of fatal defects, and estimating a probability of latent defects present in the electronic component based on that classification with the aim of optimizing test costs and product quality.

Abstract: A statistical method is described for reliability selection of dies on semiconductor wafers using critical wafer yield parameters. This is combined with other data from the wafer or module level reliability screens (such as voltage screen or burn-in) to obtain the relative latent defect density. Finally the modeled results are compared with actual results to demonstrate confidence in the model.