Abstract: This invention relates to novel 2,3-dihydroimidazo[1,2-c]quinazoline compounds, pharmaceutical compositions containing such compounds and the use of those compounds or compositions for phosphotidylinositol-3-kinase (PI3K) inhibition and treating diseases associated with phosphotidylinositol-3-kinase (PI3K) activity, in particular treating hyper-proliferative and/or angiogenesis disorders, as a sole agent or in combination with other active ingredients.

Abstract: A method of producing optoelectronic components includes providing a carrier; arranging optoelectronic semiconductor chips on the carrier; forming a conversion layer for radiation conversion on the carrier, wherein the optoelectronic semiconductor chips are surrounded by the conversion layer; and carrying out a singulation process to form separate optoelectronic components, wherein at least the conversion layer is severed.

Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned.

Abstract: A multilayer electrode on a substrate (10) comprising titanium (20) and titanium-rich titanium nitride (30) and titanium-poor titanium nitride (40), particularly suitable for the application to thermoplastic substrates, in particular for the purpose of the impedance measurement in aqueous biological media, and method for the production thereof.

Abstract: The invention relates to a method for producing optoelectronic components. The invention comprises: provision of a metal substrate, the substrate having a front side and a rear side opposite the front side; front-side removal of substrate material such that the substrate comprises substrate sections protruding in the region of the front side and recesses arranged there between; formation of a plastic body adjacent to substrate sections; arrangement of optoelectronic semiconductor chips on substrate sections; rear-side removal of substrate material in the region of the recesses, such that the substrate is structured into separate substrate sections; and performance of a separation process. The plastic body is divided into separate substrate sections and individual optoelectronic components with at least one optoelectronic semiconductor chip are formed. The invention also relates to an optoelectronic component.

Abstract: A light-emitting component may include an IC chip and an LED chip arranged on a top surface of the IC chip and electrically coupled thereto. The LED chip may be electrically controllable by means of the IC chip. The IC chip may have at least two electrical connecting surface on a bottom surface remote from the LED chip. The light-emitting component is electrically contactable and operable by means of the connecting surfaces.

Abstract: A container for a packaging assembly can include a body having a base and a sidewall extending therefrom. The body can define an interior including a product space configured for housing at least one product, and can have an opening leading to the interior. The container can include an active agent located within a compartment that is provided within the interior. The compartment can be sealed by a sealing layer to encapsulate the active agent within the compartment so as to prevent fluid communication between the active agent and the product space.

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

Abstract: In a sales area, a method for checking the layout of articles in a gondola, the gondola comprising at least one electronic shelf label which corresponds to a matching area of a gondola, with a single product slot field comprising a gondola number, a row number and a shelf label number, the method comprising steps of: acquisition of an image of the gondola; automated detection of electronic shelf labels, and automated detection of rows; for at least one electronic shelf label, determination of the matching area of the gondola, and determination of the slot field; detection of layout information in said area of the gondola in the acquired image; identification of the associated article identifier in a realogram database; and check of compliance of detected layout information, with respect to expected layout information stored in the realogram database.

Abstract: An arrangement includes a semiconductor chip with a first and second electrode. The arrangement also includes a control unit for adjusting a current for operating the semiconductor chip, a first LED voltage input coupled to the first electrode, and a reference voltage input coupled to the second electrode. The arrangement further includes an LED data input coupled to the control unit, by which a data parameter representative of a current for operating the semiconductor chip is provided. The arrangement additionally includes a cycle input coupled to the control unit, by which a reference cycle signal is provided which is representative of an operating phase of the arrangement. The control unit includes a memory arranged to record the data parameter as a memory value depending on the reference cycle signal. The control unit is configured to adjust the current depending on the memory value.

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

Abstract: A semiconductor laser component including a semiconductor chip arranged to emit laser radiation, a cladding that is electrically insulating and covers the semiconductor chip in places, and a bonding layer that electrically conductively connects the semiconductor chip to a first connection point, wherein the semiconductor chip includes a cover surface, a bottom surface, a first front surface, a second front surface, a first side surface and a second side surface, the first front surface is arranged to decouple the laser beam, the cladding covers the semiconductor chip at least in places on the cover surface, the second front surface, the first side surface and the second side surface, and the bonding layer on the cladding extends from the cover surface to the first connection point.

Abstract: The present invention relates to a sorbent which is suitable for binding metals from solutions, the production of a corresponding sorbent as well as the use of the sorbent for binding metals from solutions.

Abstract: A component having a metal carrier and a method for producing a component are disclosed. In an embodiment the component includes a carrier having a metallic carrier layer, an insulating layer and a first through-contact extending in a vertical direction throughout the carrier layer, wherein the through-contact is electrically isolated from the carrier layer via the insulating layer. The component further includes a semiconductor body and a wiring structure arranged in the vertical direction between the carrier and the semiconductor body at least places and electrically contacting the semiconductor body, wherein the wiring structure has a first connection area and a second connection area, wherein the connection areas adjoin the carrier and are assigned to different electrical polarities of the component, wherein the first through-contact is in electrical contact with one of the connection areas, and wherein the component is configured to be externally electrically connectable via the carrier.

Abstract: An axle strut for a vehicle having a shaft and two bearing regions. The axle strut has a supporting profile and two load-introducing elements. The supporting profile is formed from fiber reinforced plastics composite material. A first load-introducing element and a second load-introducing element are arranged at respective bearing region, and the supporting profile is arranged spatially between the two bearing regions. The supporting profile has a first connection area facing the first bearing region and a second connection area facing the second bearing region. Every load-introducing element has a receptacle. The supporting profile is connected by its first connection area and by the receptacle of the first load-introducing element to the first load-introducing element by an adhesive connection, and the supporting profile is connected by its second connection area and by the receptacle of the second load-introducing element to the second load-introducing element by a further adhesive connection.

Abstract: The invention relates to a method for calibrating an eye tracker unit of an operating device, wherein at least one apparatus is controlled by means of the operating device depending on at least one user input and wherein, in the case of the method, at least one graphical element is displayed respectively by a control unit of the operating device in at least one predetermined usage step of the operating device and at least one piece of viewing direction information is determined by means of the eye tracker unit for the user viewing a screen. The invention provides that, from the at least one displayed element, an optically salient element, on which the user must focus with their eyes in order to successfully perform the usage step, is established, and calibration data for the calibration of the eye tracker unit is generated depending on a display position of the optically salient element on the screen and depending on the at least one piece of viewing direction information.

Abstract: A welding system includes a welder configured to output welding power to generate an arc between a welding electrode and a workpiece. The welding system also includes a power pin configured to be coupled to the welder in a first orientation or a second orientation. The power pin is configured to switch the welding power from a first polarity to a second polarity when the power pin is switched from being coupled to the welder in the first orientation to being coupled to the welder in the second orientation.

Abstract: A module for a video wall is disclosed. In an embodiment a module includes a carrier, a plurality of components comprising at least one light-emitting structural element arranged on the carrier and an optical element, wherein the components are arranged at a prespecified lateral distance in relation to one another, wherein a retaining recess is formed between at least two components, wherein the retaining recess comprises at least two component recesses of two components which are arranged next to one another, wherein a retaining pin is fastened in the retaining recess, wherein the retaining pin is connected to the optical element, and wherein the optical element is configured to influence light irradiation onto the components and/or light emission from the components.

Abstract: A module for a video wall includes a first light emitting chip of an image pixel connecting to a first power line by a first electrical terminal, the first light emitting chip connects to a third power line by a second electrical terminal, a second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first and/or the second power line are/is a surface metallization, including contact sections, a light emitting chip is arranged on a contact section, at least between contact sections of a first and of a second power line an insulation layer is provided on a carrier, the insulation layer includes openings above the contact sections, and the light emitting chips are arranged in the openings.

Abstract: A component includes a carrier having a front side facing towards a semiconductor body and a rear side facing away from the semiconductor body, each of which is formed at least in places by a surface of a shaped body, a metal layer contains a first sub-region and a second sub-region, wherein the first sub-region and the second sub-region adjoin the shaped body in a lateral direction, are electrically connectable in a vertical direction on the front side of the carrier, are assigned to different electrical polarities of the component and are thus configured to electrically contact the semiconductor body, and the carrier has a side face running perpendicularly or obliquely to the rear side of the carrier and is configured as a mounting surface of the component, wherein at least one of the sub-regions is electrically connectable via the side face and exhibits singulation traces.