Abstract: The specification describes a surface mount method for the manufacture of high device density circuit boards. The stand-off space of the components on the board can be enlarged significantly by selectively omitting, or selectively removing, the soldermask underneath the component package. This improves access of the cleaning fluid to the underside of the component during the cleaning operation.

Abstract: A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage base-sidewall interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.

Abstract: Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.

Abstract: Device packages often include walls build on a heat sink that surrounds a device die that thermally interacts with the heat sink. Use of raised or depressed feature on said heat sink that contacts the walls improves the cohesiveness of the package. By appropriately positioning these features contaminant infusion into the package is improved without degrading cohesiveness.

Abstract: An electronic module has a non-conducting substrate having at least one opening and a die/carrier assembly mounted within the opening in the substrate. The assembly has a conducting carrier and one or more integrated circuit (IC) dies mounted to the carrier. The invention may be implemented as an electronic system comprising a circuit board (CB) and at least one such electronic module mounted to the CB.

Abstract: A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage-base-sidewall interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.

Abstract: The specification describes a surface mount method for the manufacture of high device density circuit boards. The stand-off space of the components on the board can be enlarged significantly by selectively omitting, or selectively removing, the soldermask underneath the component package. This improves access of the cleaning fluid to the underside of the component during the cleaning operation.

Abstract: The present invention relates generally to bending a workpiece to form a desired configuration and, in particular, to a method and apparatus for forming bends "out of sequence," i.e., in a time sequence different from the spatial sequence of the bends on the workpiece. The apparatus of the present invention include a bending system for bending a workpiece and a positioning system for positioning the workpiece relative to a bending region so that bends can be formed in various locations across the bending region. By virtue of the disclosed structures, a series of bends can be formed on a workpiece at various locations within the bending region. Bends can be formed out sequence and without advancing the workpiece relative to the bending region.

Abstract: A new oiless air compressor and vacuum pump design features at least two synchronously rotating disks whose rotations are at intersecting angles of rotation. As each disk rotates, it carries at least one piston or cylinder alternatively to and from its mate. Therefore, a moving piston in a cylinder is used to compress the air. The resultant compressor ideally configured has two pair of six each centrally mounted opposing pistons. It can output 120 p.s.i.g. for 50,000 hours.

Abstract: A portable, lightweight bowel evacuation system is made up of a water bag which is elevated above the patient with a check valve in the delivery line from the water bag into a rectal insertion tube or speculum, a drain line leading from the speculum includes a disposable valve member for selectively opening and closing the drain line, and one or more pressurizing members in the form of manual squeeze bulbs are provided to simultaneously open the check valve for delivery of water from the water bag through the speculum and close the drain valve while the check valve is open and further is open to simultaneously close the check valve when the drain is opened. In a modified form, a flow control valve in communication with a source of air under pressure takes the place of the manual squeeze bulb to control opening and closing of the valve members.

Abstract: An improved drive head for use in transporting materials has a frame for mounting near a tubing orifice, a drive wheel and second wheel rotatably mounted on the frame. Each of the wheels are adaptable to receive a fluid entraining conveyor. The drive head causes the conveyor to move through a predetermined conveyor path on which the conveyor winds about the drive wheel through at least a majority of its surface, and preferably 330.degree.. The radius of a down-conveyor conveyor track of the second wheel is preferably slightly greater than the radius of the drive wheel conveyor track. Preferably, tires are provided which are mounted on wheel hubs of the drive and second wheels, and these tires may be made of an elastomer having a higher coefficient of friction than the preferably plastic drive and second wheel hubs. The preferred embodiment includes a third wheel which is disposed on the conveyor path to be closer to the orifice than the second wheel.

Abstract: A new oiless air compressor and vacuum pump design features at least two synchronously rotating disks whose rotations are at intersecting angles of rotation. As each disk rotates, it carries at least one piston or cylinder alternatively to and from its mate. Therefore, a moving piston in a cylinder is used to compress the air. The resultant compressor ideally configured has two pair of six each centrally mounted opposing pistons. It can output 120 p.s.i.g. for 50,000 hours.

Abstract: A bowel care apparatus is characterized by having a pump circuit for pumping water under pressure through a speculum, and the pumping circuit may be placed in a pulse mode to further stimulate the rectal and colon areas during each infusion cycle.

Abstract: A colonic lavage apparatus including a speculum (12) in which the speculum (12) takes the form of an elongated tubular body (29) having a tapered leading end (30) provided with a pair of diametrically opposed apertures (36). The major length of the body (29) tapers rearwardly from the leading end (30) into a trailing end (45) which is coupled to a liquid delivery line (L) from a source of liquid under pressure. A control line (L') is coupled to a valve assembly (16) at an opposite end of the speculum (12) to that of the delivery line (L), the valve assembly (16) including an elastic tubular liner (28) and a pressure port (24) positioned on an external surface of the valve (16) which is in communication with the source of liquid under pressure, the valve (16) being opened and closed in response to the differential pressure between the liquid in the pressure port (24) and the speculum (12).

Abstract: A bowel care system is made up of a wheeled cart unit so as to be readily transportable between a patient and bathroom for removal of waste matter from the patient by means of colonic lavage apparatus mounted on the unit, the apparatus including a fill container and waste reservoir with a fill line extending from the fill container into communication with a speculum which is insertable into the anal canal of the patient, a pump for pumping water under pressure through the speculum, a drain line also communicating with the speculum at a location downstream of the fill line with a valve between the speculum and drain line which is movable between open and closed positions in response to differential pressure between the pump and speculum, and a timer is provided for sequentially activating and deactivating the pump over predetermined time intervals so that water is supplied under pressure over a first predetermined time interval through the speculum followed by remobal of the water and waste matter via the drai