Abstract: Acoustic imaging artifacts produced by imaging systems and devices can be reduced or eliminated by including a multisink medium in the systems or devices. The multisink material can be disposed between an acoustically reflective component of the imaging system or device and an ultrasound transducer of the imaging system or device. Inclusion of a multisink medium that is thermally conductive and acoustically non-conductive can reduce acoustic imaging artifacts while maintaining or improving heat management within imaging systems and devices.

Abstract: A biopsy needle for collecting tissue samples includes a needle having a first cavity adapted for accepting a first sample core, the needle having a second cavity adapted for accepting a second sample core and a sheath with a single slot or opening and positioned coaxially with the needle. The needle with the sheath may have a separate core extraction kit.

Abstract: An optical device with a non-rectilinearly shaped optical integrated circuit over a substantially flat portion of a riser, the riser also equipped with a relief structure that is in thermal contact with a stabilizing brace that is in turn connected to two portions of the non-rectilinearly shaped optical integrated circuit. The non-rectilinearly shaped optical integrated circuit exhibits reduced center wavelength drift.

Abstract: A linearized thermal and optical model of an optical integrated circuit can be used to temperature-stabilize one or more optical elements of the circuit using active temperature regulation. To stabilize a single optical element, such as an arrayed waveguide grating (AWG), a temperature sensor and a heater can be provided proximate to the grating. Thermal and optical coefficients can be then used to select an appropriate temperature set-point for the temperature controller that receives readings from the sensor and determines the power dissipated in the heater. Multiple AWG's can be stabilized individually, using the same process and lumping cross-heating factors together with other environmental factors. Alternatively, multiple AWG's can be stabilized using fewer sensors than AWG's, by stabilizing one of the AWG's in the same manner as in the case of a single AWG, and determining power dissipated in the heaters of the remaining AWG's based on the linearized model.

Abstract: Systems and methods for an isothermal thin film heater are provided. The isothermal thin film heater mitigates temperature variations in an optical circuit, such as an arrayed-waveguide grating. The thin film heater comprises a conductive plate and at least one heating element trace coupled to the conductive plate for heating the optical circuit. The heating element trace(s) is arranged around a periphery portion of the conductive plate such that concentric arcs are formed by the heating element trace(s). A sensor for sensing the temperature of the thin film heater and/or the optical circuit can also be provided.

Abstract: A lead cut and tape attach apparatus (10) for automatically cutting leads on one side of a semiconductor I.C. quad device and subsequently cutting and attaching a piece of tape over the gaps formed between the cut leads and for sequentially cutting the leads and attaching tape thereover on the remaining sides of the quad device includes a double-acting punch assembly (34) formed of an inner punch blade (58) and an outer punch (56). There is provided upper and lower cams (68, 78) for actuating the inner punch blade relative to the outer punch so that on a first downward stroke the inner punch blade is extended to cut the leads of the quad device. On a second downward stroke of the punch assembly, the inner punch blade is retracted and the outer punch cuts and attaches the tape.