Abstract: Hot wall bell-type furnaces and methods of treating metal and/or ceramic articles. A method of treating a metal/ceramic article includes placing the article with a tray/fixture on a furnace hearth. A retort bell can be placed over the fixture with the article. A furnace bell is then placed over the retort bell. A retort pressure in the retort bell can be reduced to a first vacuum pressure, and a support pressure in a plenum space between the retort bell and the furnace bell can be reduced to a second vacuum pressure. The article can be heated to a treatment temperature which can be maintained along with the first vacuum pressure and second vacuum pressure to treat the article to form a treated article. The article can be one or more of a green body to be sintered, a sintered article, and a cast article to be treated by any suitable heat treatment.

Abstract: A base component may be uses in a thermoprocessing system that includes the base component and at least one recipient enclosure for sealing a process chamber of the thermoprocessing system from an exterior thereof. The base component includes a main hub, and the main hub includes: an energy penetration for providing a heating or cooling energy from an exterior of the process chamber to the process chamber; a media inlet penetration for transporting a media from an exterior of the process chamber to the process chamber; and a media outlet penetration for transporting a media from the process chamber to an exterior of the process chamber.

Abstract: When communicating data between different voltage and frequency domains, for example chiplets, in an integrated circuit, the data signals can be formatted to compensate for propagation delays and different operating frequencies between the domains, and the signaling voltage level of the formatted data signals can then be changed from the operating voltage of the transmitting domain to the operating voltage of the receiving domain so that the formatted and changed data signals can be transmitted. As such, voltage crossings are combined with frequency crossings, which can have the effect of hiding the voltage shifting within the propagation delays.

Abstract: When communicating data between different voltage and frequency domains, for example chiplets, in an integrated circuit, the data signals can be formatted to compensate for propagation delays and different operating frequencies between the domains, and the signaling voltage level of the formatted data signals can then be changed from the operating voltage of the transmitting domain to the operating voltage of the receiving domain so that the formatted and changed data signals can be transmitted. As such, voltage crossings are combined with frequency crossings, which can have the effect of hiding the voltage shifting within the propagation delays.