Patents by Inventor Thoon Chang

Thoon Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming reinforced interconnects on a substrate
    Publication number: 20070207605
    Abstract: A method for forming reinforced interconnects or bumps on a substrate includes first forming a support structure on the substrate. A substantially filled capsule is then formed around the support structure to form an interconnect. The interconnect can reach a height of up to 300 microns.
    Type: Application
    Filed: March 6, 2006
    Publication date: September 6, 2007
    Inventors: Hei Shiu, On Chau, Gor Lai, Heng Yip, Thoon Chang, Lan Tan