Patents by Inventor Tian Shi
Tian Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11972711Abstract: Provided are a display panel, a drive method thereof and a display apparatus. The display panel includes M*N display units disposed in an array defined by intersections of (M+1) gate lines and N pairs of data lines, and each pair of data lines include a first data line and a second data line; in an mth display row, display units of odd display columns are connected to an mth gate line, and display units of even display columns are connected to an (m+1)th gate line; in an nth display column, display units of odd display rows are connected to first data lines of an nth pair of data lines, and display units of even display rows are connected to second data lines of the nth pair of data lines.Type: GrantFiled: December 29, 2020Date of Patent: April 30, 2024Assignee: BOE Technology Group Co., Ltd.Inventors: Tian Dong, Shiming Shi, Bo Wang, Jingquan Wang
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Publication number: 20240121479Abstract: Embodiments of the present disclosure relate to multimedia processing method, apparatus, device and medium, wherein the method includes: presenting a first multimedia interface comprising first content; receiving an interface switching request of a user in the first multimedia interface; and switching from the first multimedia interface currently presented to a second multimedia interface, and presenting second content in the second multimedia interface, wherein the first content comprises the second content and other content associated with the second content, and the second content comprises a target audio and a target subtitle corresponding to the target audio.Type: ApplicationFiled: April 7, 2022Publication date: April 11, 2024Inventors: Kojung CHEN, Yinuo ZHOU, Biao GONG, Jingsheng YANG, Tian ZHAO, Jinghui LIU, Daqian LU, Yao YANG, Tao CHENG, Zaofeng PAN, Tianhui SHI, Rongyi TANG, Guodong GONG
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Patent number: 11954011Abstract: An apparatus and a method for executing a customized production line using an artificial intelligence development platform, a computing device and a computer readable storage medium are provided. The apparatus includes: a production line executor configured to generate a native form of the artificial intelligence development platform based on a file set, the native form to be sent to a client accessing the artificial intelligence development platform so as to present a native interactive page of the artificial intelligence development platform; and a standardized platform interface configured to provide an interaction channel between the production line executor and the artificial intelligence development platform. The production line executor is further configured to generate an intermediate result by executing processing logic defined in the file set and to process the intermediate result by interacting with the artificial intelligence development platform via the standardized platform interface.Type: GrantFiled: October 28, 2020Date of Patent: April 9, 2024Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.Inventors: Yongkang Xie, Ruyue Ma, Zhou Xin, Hao Cao, Kuan Shi, Yu Zhou, Yashuai Li, En Shi, Zhiquan Wu, Zihao Pan, Shupeng Li, Mingren Hu, Tian Wu
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Publication number: 20240103097Abstract: The present disclosure provides a direct current (DC) transformer error detection apparatus for a pulsating harmonic signal, including a DC and pulsating harmonic current output module and an external detected input module, where the DC and pulsating harmonic current output module outputs a DC and a DC superimposed pulsating harmonic current to an internal sampling circuit and a self-calibrated standard resistor array; and the internal sampling circuit converts the input DC and the input DC superimposed pulsating harmonic current into a voltage signal, and sends the voltage signal to an analog-to-digital (AD) sampling and measurement component through a front-end conditioning circuit and a detected input channel. The DC transformer error detection apparatus can complete self-calibration for measurement of the DC and the pulsating harmonic signal on a test site.Type: ApplicationFiled: August 17, 2022Publication date: March 28, 2024Inventors: Xin Zheng, Wenjing Yu, Tao Peng, Yi Fang, Ming Lei, Hong Shi, Ben Ma, Li Ding, Wei Wei, Linghua Li, He Yu, Tian Xia, Yingchun Wang, Sike Wang, Dongri Xie, Xin Wang, Bo Pang, Xianjin Rong
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Patent number: 11885830Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.Type: GrantFiled: June 28, 2021Date of Patent: January 30, 2024Assignee: Lumentum Operations LLCInventors: Sean Burns, Raman Srinivasan, Lucas Morales, Tian Shi, Yuanzhen Zhuang, Cho-Shuen Hsieh, Albert Huang
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Publication number: 20230421196Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.Type: ApplicationFiled: September 12, 2023Publication date: December 28, 2023Inventors: Daniel R. Bloom, Chelsea E. Wojeski, Edward Siahaan, Nathan Morris, Ryan S. Haley, Tian Shi Li, Toni Ristoski
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Patent number: 11784673Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.Type: GrantFiled: September 8, 2021Date of Patent: October 10, 2023Assignee: APPLE INC.Inventors: Daniel R. Bloom, Chelsea E. Wojeski, Edward Siahaan, Nathan Morris, Ryan S. Haley, Tian Shi Li, Toni Ristoski
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Publication number: 20230269513Abstract: A charging case for a pair of wireless earphones comprising: a housing having a peripheral wall that defines a shell; a frame insert coupled to the housing and extending into the shell, the frame insert having one or more insert walls that define first and second pockets sized and shaped to accept first and second wireless earphones, respectively, wherein the one or more insert walls cooperate with the housing primary wall to define a sealed chamber within the charging case; a lid coupled to the housing and operable between a closed position in which the lid covers the first and second pockets and an open position in which the first and second pockets are exposed; a speaker module disposed within the sealed chamber, the speaker module comprising an audio driver having a diaphragm that separates a front volume of the audio driver from a back volume of the audio driver and a speaker vent disposed within the back volume; one or more first openings formed through the peripheral wall and opening into the front volType: ApplicationFiled: August 24, 2022Publication date: August 24, 2023Applicant: APPLE INC.Inventors: Benjamin A. Cousins, Jarrett Lagler, Dirk Schmelzer, Sebastien D. de Rivaz, Tian Shi Li, Phillip Qian, Rebecca Russell, Jeyakkrishnan Chengleput Srinivasan, Jue Wang, Jerzy S. Guterman, Joel C. Yamasaki
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Publication number: 20230262375Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.Type: ApplicationFiled: April 24, 2023Publication date: August 17, 2023Applicant: Apple Inc.Inventors: Jason Joseph LeBlanc, Rohan Gupta, Robert D. Zupke, Todd K. Moyer, Cuneyt Bakan, Brooke L. Bunney, Justin T. Ng, Jeff A. Kalt, Tian Shi Li, Lionel B. Barrow
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Publication number: 20230199886Abstract: This application relates to the field of communications technologies, and provides a system and method for providing wireless network access, and an electronic device. The system includes a first electronic device and a second electronic device. The first electronic device receives a first operation of a user, where the first operation is used to share or project first data in the first electronic device to the second electronic device. The first electronic device establish a Wi-Fi direct connection to the second electronic device in response to the first operation; and receive a second operation of the user, where the second operation is used to enable a network sharing function of the first electronic device. The second electronic device receives the first data from the first electronic device; and performs data receiving and sending with a network side by using the network sharing function of the first electronic device.Type: ApplicationFiled: March 31, 2021Publication date: June 22, 2023Inventors: Tongbo WANG, Ji DING, Liping WANG, Guozhi DING, Tian SHI
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Patent number: 11665462Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.Type: GrantFiled: September 16, 2021Date of Patent: May 30, 2023Assignee: Apple Inc.Inventors: Jason Joseph LeBlanc, Rohan Gupta, Robert D. Zupke, Todd K. Moyer, Cuneyt Bakan, Brooke L. Bunney, Justin T. Ng, Jeff A. Kalt, Tian Shi Li, Lionel B. Barrow
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Patent number: 11450999Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.Type: GrantFiled: September 16, 2020Date of Patent: September 20, 2022Assignee: Apple Inc.Inventors: Eric T. SooHoo, Mahmoud R. Amini, Daniel R. Bloom, Sean T. McIntosh, Tian Shi Li, Jared M. Kole, Jason Joseph LeBlanc, Colin M. Ely, Peter J. Cameron, Michael A. Kinney, Eric S. Jol, Edward Siahaan, Robert D. Zupke, Rohan Gupta, Jordan J. Francis
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Publication number: 20220229091Abstract: In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.Type: ApplicationFiled: June 28, 2021Publication date: July 21, 2022Inventors: Sean BURNS, Raman SRINIVASAN, Lucas MORALES, Tian SHI, Yuanzhen ZHUANG, Cho-Shuen HSIEH, Albert HUANG
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Publication number: 20220085843Abstract: An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.Type: ApplicationFiled: September 8, 2021Publication date: March 17, 2022Inventors: Daniel R. Bloom, Chelsea E. Wojeski, Edward Siahaan, Nathan Morris, Ryan S. Haley, Tian Shi Li, Toni Ristoski
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Publication number: 20220085560Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.Type: ApplicationFiled: September 16, 2020Publication date: March 17, 2022Applicant: Apple Inc.Inventors: Eric T. SooHoo, Mahmoud R. Amini, Daniel R. Bloom, Sean T. McIntosh, Tian Shi Li, Jared M. Kole, Jason Joseph LeBlanc, Colin M. Ely, Peter J. Cameron, Michael A. Kinney, Eric S. Jol, Edward Siahaan, Robert D. Zupke, Rohan Gupta, Jordan J. Francis
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Patent number: 11252492Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: GrantFiled: May 19, 2020Date of Patent: February 15, 2022Assignee: Apple Inc.Inventors: Jared M. Kole, Daniel R. Bloom, Audrey L. Sheng, Tian Shi Li, Eugene Antony Whang
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Patent number: 11181572Abstract: A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.Type: GrantFiled: June 30, 2020Date of Patent: November 23, 2021Assignee: Lumentum Operations LLCInventors: Yuanzhen Zhuang, Lucas Morales, Raman Srinivasan, Sean Burns, Siu Kwan Cheung, Tian Shi, Tao Li
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Patent number: 11184696Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.Type: GrantFiled: September 16, 2020Date of Patent: November 23, 2021Assignee: Apple Inc.Inventors: Tian Shi Li, Daniel R. Bloom, Jerzy S. Guterman, Jue Wang, Toni Ristoski, Jared M. Kole, Edward Siahaan, Eugene Antony Whang
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Publication number: 20210325451Abstract: A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.Type: ApplicationFiled: June 30, 2020Publication date: October 21, 2021Inventors: Yuanzhen ZHUANG, Lucas MORALES, Raman SRINIVASAN, Sean BURNS, Siu Kwan CHEUNG, Tian SHI, Tao LI
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Patent number: 11134327Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: GrantFiled: May 19, 2020Date of Patent: September 28, 2021Assignee: Apple Inc.Inventors: Jason J. LeBlanc, Daniel R. Bloom, Edward Siahaan, Phillip Qian, Lee M. Panecki, Eugene Antony Whang, Jared M. Kole, Audrey L. Sheng, Tian Shi Li