Patents by Inventor Tiao Zhou
Tiao Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7294530Abstract: A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove formed therein. An adhesive partially fills the groove in the first encapsulation structure. A second integrated circuit is affixed to the first encapsulation structure by use of the adhesive in the groove. A second encapsulation structure at least partially encases the first encapsulation structure, the first integrated circuit, and the second integrated circuit.Type: GrantFiled: August 26, 2005Date of Patent: November 13, 2007Assignee: STMicroelectronics, Inc.Inventor: Tiao Zhou
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Publication number: 20070200224Abstract: A thermally-enhanced ball grid array package structure is provided that includes an integrated circuit chip, a heat spreader and a substrate. The integrated circuit chip has a specified surface area. The heat spreader is coupled to the integrated circuit chip. The substrate is coupled to the heat spreader. The substrate has a specified surface area. The heat spreader covers a specified portion of the surface area of the substrate that is greater than the surface area of the integrated circuit chip. The heat spreader is operable to dissipate heat from the integrated circuit chip over the specified portion of the surface area of the substrate.Type: ApplicationFiled: February 20, 2007Publication date: August 30, 2007Applicant: STMicroelectronics, Inc.Inventors: Tiao Zhou, Michael Hundt
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Patent number: 7244967Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor.Type: GrantFiled: July 13, 2004Date of Patent: July 17, 2007Assignee: STMicroelectronics, Inc.Inventors: Michael J. Hundt, Tiao Zhou
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Publication number: 20070085222Abstract: An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.Type: ApplicationFiled: December 14, 2006Publication date: April 19, 2007Applicant: STMICROELECTRONICS, INC.Inventors: Tiao Zhou, Michael Hundt
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Patent number: 7180175Abstract: A thermally-enhanced ball grid array package structure is provided that includes an integrated circuit chip, a heat spreader and a substrate. The integrated circuit chip has a specified surface area. The heat spreader is coupled to the integrated circuit chip. The substrate is coupled to the heat spreader. The substrate has a specified surface area. The heat spreader covers a specified portion of the surface area of the substrate that is greater than the surface area of the integrated circuit chip. The heat spreader is operable to dissipate heat from the integrated circuit chip over the specified portion of the surface area of the substrate.Type: GrantFiled: February 1, 2002Date of Patent: February 20, 2007Assignee: STMicroelectronics, Inc.Inventors: Tiao Zhou, Michael J. Hundt
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Patent number: 6998721Abstract: In one embodiment, a device includes but is not limited to: a first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first encapsulation structure; and a second encapsulation structure which at least partially encases the first encapsulation structure, the first integrated circuit, and the electronic component.Type: GrantFiled: November 8, 2002Date of Patent: February 14, 2006Assignee: STMicroelectronics, Inc.Inventor: Tiao Zhou
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Publication number: 20050282310Abstract: In one embodiment, a device includes but is not limited to: a first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first encapsulation structure; and a second encapsulation structure which at least partially encases the first encapsulation structure, the first integrated circuit, and the electronic component.Type: ApplicationFiled: August 26, 2005Publication date: December 22, 2005Applicant: STMicroelectronics Inc.Inventor: Tiao Zhou
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Patent number: 6900535Abstract: A ball or land grid array plastic substrate portion is formed with a hole therethrough in the region on which the integrated circuit die is to be formed, with a copper heat slug inserted within the opening having a bottom surface substantially aligned with the bottom surface of the plastic portion to allow molding tooling for conventional ball or land grid array packages to be employed. The integrated circuit die is mounted on the heat slug, which has a solderable bottom surface and is directly soldered to the PCB. An additional copper heat spreader region is formed on an upper surface of the plastic portion.Type: GrantFiled: May 1, 2002Date of Patent: May 31, 2005Assignee: STMicroelectronics, Inc.Inventor: Tiao Zhou
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Publication number: 20050082718Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.Type: ApplicationFiled: October 8, 2004Publication date: April 21, 2005Applicant: STMICROELECTRONICS, INC.Inventors: Michael Hundt, Tiao Zhou
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Publication number: 20040241905Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor.Type: ApplicationFiled: July 13, 2004Publication date: December 2, 2004Applicant: STMicroelectronics, Inc.Inventors: Michael J. Hundt, Tiao Zhou
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Patent number: 6817854Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.Type: GrantFiled: May 20, 2002Date of Patent: November 16, 2004Assignee: STMicroelectronics, Inc.Inventors: Michael J. Hundt, Tiao Zhou
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Patent number: 6815262Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor.Type: GrantFiled: July 22, 2002Date of Patent: November 9, 2004Assignee: STMicroelectronics, Inc.Inventors: Michael J. Hundt, Tiao Zhou
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Publication number: 20040089955Abstract: In one embodiment, a device includes but is not limited to: a first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first encapsulation structure; and a second encapsulation structure which at least partially encases the first encapsulation structure, the first integrated circuit, and the electronic component.Type: ApplicationFiled: November 8, 2002Publication date: May 13, 2004Applicant: STMicroelectronics, Inc.Inventor: Tiao Zhou
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Patent number: 6686227Abstract: A method for exposed die molding for integrated circuit packaging is provided that includes providing a mold comprising an upper mold with a flexible material, a lower mold, and a floating plunger. A substrate of an integrated circuit structure is clamped between the upper mold and the lower mold. An integrated circuit die of the integrated circuit structure is clamped between the floating plunger and the upper mold through the flexible material.Type: GrantFiled: February 1, 2002Date of Patent: February 3, 2004Assignee: STMicroelectronics, Inc.Inventors: Tiao Zhou, Michael J. Hundt
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Publication number: 20040012084Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor.Type: ApplicationFiled: July 22, 2002Publication date: January 22, 2004Applicant: STMicroelectronics, Inc.Inventors: Michael J. Hundt, Tiao Zhou
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Publication number: 20030214021Abstract: An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.Type: ApplicationFiled: May 20, 2002Publication date: November 20, 2003Applicant: STMICROELECTRONICS, INC.Inventors: Tiao Zhou, Michael J. Hundt
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Publication number: 20030214074Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.Type: ApplicationFiled: May 20, 2002Publication date: November 20, 2003Applicant: STMicroelectronics, INC.Inventors: Michael J. Hundt, Tiao Zhou
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Publication number: 20030206401Abstract: A ball or land grid array plastic substrate portion is formed with a hole therethrough in the region on which the integrated circuit die is to be formed, with a copper heat slug inserted within the opening having a bottom surface substantially aligned with the bottom surface of the plastic portion to allow molding tooling for conventional ball or land grid array packages to be employed. The integrated circuit die is mounted on the heat slug, which has a solderable bottom surface and is directly soldered to the PCB. An additional copper heat spreader region is formed on an upper surface of the plastic portion.Type: ApplicationFiled: May 1, 2002Publication date: November 6, 2003Applicant: STMICROELECTRONICS, INC.Inventor: Tiao Zhou
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Publication number: 20030151120Abstract: A lead frame of a plastic integrated circuit package is fabricated in two steps. First, from a rectangular sheet of metal, lead fingers of the lead frame are formed. Second, the die pad of the lead frame is clamped and is simultaneously separated and downset from the lead fingers of the lead frame by shearing the lead frame with a mated punch die pair. Performing the separation and downset of the die pad from the lead fingers results in essentially no horizontal gap between the lead fingers and the die pad. The downset of the die pad with respect to the lead fingers results in a vertical separation between the die pad and the lead fingers.Type: ApplicationFiled: December 10, 2002Publication date: August 14, 2003Inventors: Michael J. Hundt, Tiao Zhou
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Publication number: 20030148556Abstract: A method for exposed die molding for integrated circuit packaging is provided that includes providing a mold comprising an upper mold with a flexible material, a lower mold, and a floating plunger. A substrate of an integrated circuit structure is clamped between the upper mold and the lower mold. An integrated circuit die of the integrated circuit structure is clamped between the floating plunger and the upper mold through the flexible material.Type: ApplicationFiled: February 1, 2002Publication date: August 7, 2003Applicant: STMicroelectronics, Inc.Inventors: Tiao Zhou, Michael J. Hundt