Abstract: This invention involves a non-eutectic structure welded joint of copper-aluminum thin wall pipe and its manufacturing method. This welded joint includes a chemical bond directly formed between the cone welding section of the copper pipe and the inner wall of the aluminum pipe, to form a columnar grain crystal with a toothed profile. The method includes providing a metal rod in a nosing end of copper pipe welded part, and installing a felder at the corresponding position of fixed electrode group. During welding, a pushing cylinder pushes the travelling electrode group with copper pipe to the aluminum pipe. At the same time a circuit is connected/powered, so the copper-aluminum combined zone is heated by electric resistance heating. The copper pipe moves to the interior of aluminum pipe continuously at the role of the pushing cylinder. The cooled metal rod is drawn out after power-down. The chemical bond directly forms in copper-aluminum joint. The weld does not have eutectic structure.