Patents by Inventor TIEN-MING WANG

TIEN-MING WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12002756
    Abstract: A method of forming a semiconductor structure includes first forming a metal gate (MG) over a semiconductor layer, a gate spacer on a sidewall of the MG, and a source/drain (S/D) feature disposed in the semiconductor layer and adjacent to the MG, forming an S/D contact (MD) over the S/D feature, forming a first ILD layer over the MG and the MD, and subsequently patterning the first ILD layer to form an opening. The method further includes forming a metal layer in the opening, such that the metal layer contacts both the MG and the MD, removing a top portion of the metal layer to form a trench, filling the trench with a dielectric layer, and subsequently forming a second ILD layer over the dielectric layer.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20240178069
    Abstract: Semiconductor device structures and method for forming the same are provided. The semiconductor device structure includes a substrate and a gate stack formed over the substrate. The semiconductor device structure further includes a source/drain structure formed adjacent to the gate stack and a contact structure vertically overlapping the source/drain structure. In addition, the contact structure has a first sidewall slopes downwardly from its top surface to its bottom surface, and an angle between the first sidewall and a bottom surface of the contact structure is smaller than 89.5°.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 30, 2024
    Inventors: Lin-Yu HUANG, Sheng-Tsung WANG, Jia-Chuan YOU, Chia-Hao CHANG, Tien-Lu LIN, Yu-Ming LIN, Chih-Hao WANG
  • Publication number: 20240162094
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate, a conductive feature on the substrate, and an electrical connection structure on the conductive feature. The electrical connection includes a first grain made of a first metal material, and a first inhibition layer made of a second metal layer that is different than the first metal material. The first inhibition layer extends vertically along a first side of a grain boundary of the first grain and laterally along a bottom of the grain boundary of the first grain.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 16, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Chuan CHIU, Jia-Chuan YOU, Chia-Hao CHANG, Chun-Yuan CHEN, Tien-Lu LIN, Yu-Ming LIN, Chih-Hao WANG
  • Patent number: 11978669
    Abstract: The present disclosure provides a semiconductor structure. The structure includes a semiconductor substrate, a gate stack over a first portion of a top surface of the semiconductor substrate; and a laminated dielectric layer over at least a portion of a top surface of the gate stack. The laminated dielectric layer includes at least a first sublayer and a second sublayer. The first sublayer is formed of a material having a dielectric constant lower than a dielectric constant of a material used to form the second sublayer and the material used to form the second sublayer has an etch selectivity higher than an etch selectivity of the material used to form the first sublayer.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Lin Chuang, Chia-Hao Chang, Sheng-Tsung Wang, Lin-Yu Huang, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20240096961
    Abstract: A contact stack of a semiconductor device includes a source/drain feature, a silicide layer wrapping around the source/drain feature, a seed metal layer in direct contact with the silicide layer, and a conductor in contact with the seed metal layer. The contact stack excludes a metal nitride layer in direct contact with the silicide layer.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Shih-Chuan CHIU, Tien-Lu LIN, Yu-Ming LIN, Chia-Hao CHANG, Chih-Hao WANG, Jia-Chuan YOU
  • Patent number: 10827293
    Abstract: A sound reproducing method used in sound reproducing apparatus that includes the steps outlined below is provided. A sound signal is generated with a 3D sound generating process according to listener data and sound data. Pre-recorded sound data is retrieved to further generate a target distance function corresponding to the sound distance. A fixed head-related transfer function corresponding to a fixed distance is retrieved. A target head-related transfer function corresponding to the sound distance is generated by adapting the target distance function to the fixed head-related transfer function. The sound signal is reproduced by multiplying the sound signal by the target head-related transfer function.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: November 3, 2020
    Assignee: HTC Corporation
    Inventors: Chun-Min Liao, Yan-Min Kuo, Li-Yen Lin, Chi-Tang Ho, Tien-Ming Wang, Tsung-Yu Tsai, Yen-Chieh Wang, Shuo-Yen Lin
  • Patent number: 10681486
    Abstract: A method for obtaining Hi-Res audio transfer information is provided. The method is applicable to the electronic device having a processor. In the method, a first audio signal is captured and converted from the time domain into in the frequency domain to generate a first signal spectrum. Then, a regression analysis is performed on an energy distribution of the first signal spectrum to predict an extended energy distribution according to the first signal spectrum, and head-related parameters are used to compensate for the extended energy distribution to generate an extended signal spectrum. Finally, the first signal spectrum and the extended signal spectrum are combined into a second signal spectrum which is converted from the frequency domain into the time domain to generate a second audio signal including Hi-Res audio transfer information.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: June 9, 2020
    Assignee: HTC Corporation
    Inventors: Tien-Ming Wang, Li-Yen Lin, Chun-Min Liao, Chi-Tang Ho, Yan-Min Kuo, Tsung-Yu Tsai
  • Patent number: 10382878
    Abstract: A sound reproducing method used in sound reproducing apparatus that includes the steps outlined below is provided. A sound signal with a three-dimensional (3D) sound generating process is generated according to listener data and sound data. Whether a sound source position is within a target region relative to a listener position within a virtual environment is determined according to the listener data and the sound data. The sound signal is multiplied by an adjusting function to enhance peaks and valleys of the sound signal while maintaining a behavior of the sound signal when the sound source position is within the target region. The sound signal is reproduced.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: August 13, 2019
    Assignee: HTC Corporation
    Inventors: Yan-Min Kuo, Chun-Min Liao, Li-Yen Lin, Chi-Tang Ho, Tien-Ming Wang, Tsung-Yu Tsai
  • Publication number: 20190158893
    Abstract: A video content integration system and method for converting an original video to a customized product video based on customer requirements thereof are disclosed. The original video has a first video file. The video content integration system has a video file receiving module, a customer requirement instruction generating module, a metadata information gathering module, a video code compressing module and a content integration module. The video file receiving module receives the original video. The customer requirement instruction generating module generates a requirement instruction based on customer requirements. The metadata information gathering module gathers metadata information related to the original video according to the requirement instruction. The video code compressing module compresses the first video file to a second video file according to the requirement instruction.
    Type: Application
    Filed: February 27, 2018
    Publication date: May 23, 2019
    Inventor: Tien-Ming Wang
  • Publication number: 20190149866
    Abstract: A streaming video management system is used between a video supply end and a video display end. The video supply end can output a streaming video signal. The streaming video management system includes a management module, a bandwidth detection module and a network delivery selection interface. The management module is used for receiving and managing the streaming video signal. The bandwidth detection module is used to detect a transmission bandwidth of the video display end. The network delivery selection interface has a plurality of content delivery network nodes. According to the transmission bandwidth, the management module is used to transmit the streaming video signal via one of the content delivery network nodes to the video display side by the network delivery selection interface.
    Type: Application
    Filed: March 22, 2018
    Publication date: May 16, 2019
    Inventor: Tien-Ming Wang
  • Publication number: 20190116441
    Abstract: A sound reproducing method used in sound reproducing apparatus that includes the steps outlined below is provided. A sound signal is generated with a 3D sound generating process according to listener data and sound data. Pre-recorded sound data is retrieved to further generate a target distance function corresponding to the sound distance. A fixed head-related transfer function corresponding to a fixed distance is retrieved. A target head-related transfer function corresponding to the sound distance is generated by adapting the target distance function to the fixed head-related transfer function. The sound signal is reproduced by multiplying the sound signal by the target head-related transfer function.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 18, 2019
    Inventors: Chun-Min LIAO, Yan-Min KUO, Li-Yen LIN, Chi-Tang HO, Tien-Ming WANG, Tsung-Yu TSAI, Yen-Chieh WANG, Shuo-Yen LIN
  • Publication number: 20190116446
    Abstract: A sound reproducing method used in sound reproducing apparatus that includes the steps outlined below is provided. A sound signal with a three-dimensional (3D) sound generating process is generated according to listener data and sound data. Whether a sound source position is within a target region relative to a listener position within a virtual environment is determined according to the listener data and the sound data. The sound signal is multiplied by an adjusting function to enhance peaks and valleys of the sound signal while maintaining a behavior of the sound signal when the sound source position is within the target region. The sound signal is reproduced.
    Type: Application
    Filed: October 17, 2018
    Publication date: April 18, 2019
    Inventors: Yan-Min KUO, Chun-Min LIAO, Li-Yen LIN, Chi-Tang HO, Tien-Ming WANG, Tsung-Yu TSAI
  • Publication number: 20190116447
    Abstract: A method for obtaining Hi-Res audio transfer information is provided. The method is applicable to the electronic device having a processor. In the method, a first audio signal is captured and converted from the time domain into in the frequency domain to generate a first signal spectrum. Then, a regression analysis is performed on an energy distribution of the first signal spectrum to predict an extended energy distribution according to the first signal spectrum, and head-related parameters are used to compensate for the extended energy distribution to generate an extended signal spectrum. Finally, the first signal spectrum and the extended signal spectrum are combined into a second signal spectrum which is converted from the frequency domain into the time domain to generate a second audio signal including Hi-Res audio transfer information.
    Type: Application
    Filed: October 18, 2018
    Publication date: April 18, 2019
    Applicant: HTC Corporation
    Inventors: Tien-Ming Wang, Li-Yen Lin, Chun-Min Liao, Chi-Tang Ho, Yan-Min Kuo, Tsung-Yu Tsai
  • Publication number: 20190069010
    Abstract: An online video and audio broadcasting system and method are disclosed. The online video and audio broadcasting system includes a first verification module, a second verification module, a management module, and a play module. The first and the second verification module is connected to a primary verification system and a backup verification system to correspond to a first set of digital rights and a second set of digital rights, respectively. The management module carries out the verification of the video and audio signal with the first set of digital rights corresponding to the first verification module. If an error occurs, the management module automatically switches to carry out the verification of the video and audio signal with the second set of digital rights corresponding to the second verification module. The play module is used for broadcasting the video and audio signal.
    Type: Application
    Filed: March 12, 2018
    Publication date: February 28, 2019
    Inventor: Tien-Ming Wang
  • Patent number: 9626949
    Abstract: A system for modifying an audio signal comprises a computer including a first digital signal processor (DSP). The first DSP includes a first module and a second module. The first module is coupled to the interface to provide a musical instrument with a set of testing input signals and obtain a set of testing output signals from the musical instrument via the interface. The second module is configured to perform functions including: analyzing the set of testing output signals to obtain a set of parameters, constructing an acoustic transducer to model characteristics of the musical instrument based on the set of parameters, and receiving the audio signal to modify the audio signal using the acoustic transducer, wherein the first DSP module obtains the set of parameters at least by identifying occurrences when an output level state determined at least based on the set of testing output signals significantly changes.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: April 18, 2017
    Assignee: POSITIVE GRID LLC
    Inventors: Tien-Ming Wang, Yi-Fan Yeh, Yi-Song Siao
  • Publication number: 20170024495
    Abstract: A method of modeling a characteristic of a non-linear system, comprises feeding testing input signals into the non-linear system to obtain testing output signals corresponding to the testing input signals, wherein the testing input signals include a first testing input signal and the testing output signals include a first testing output signal, identifying occurrences when an output level state in at least one specific frequency band of the first testing output signal significantly changes under the first testing input signal so as to obtain a first profile, and modeling the characteristic based on the first profile.
    Type: Application
    Filed: July 21, 2015
    Publication date: January 26, 2017
    Inventors: TIEN-MING WANG, YI-FAN YEH, YI-SONG SIAO
  • Publication number: 20170025111
    Abstract: A system for modifying an audio signal comprises a computer including a first digital signal processor (DSP). The first DSP includes a first module and a second module. The first module is coupled to the interface to provide a musical instrument with a set of testing input signals and obtain a set of testing output signals from the musical instrument via the interface. The second module is configured to perform functions including: analyzing the set of testing output signals to obtain a set of parameters, constructing an acoustic transducer to model characteristics of the musical instrument based on the set of parameters, and receiving the audio signal to modify the audio signal using the acoustic transducer, wherein the first DSP module obtains the set of parameters at least by identifying occurrences when an output level state determined at least based on the set of testing output signals significantly changes.
    Type: Application
    Filed: July 21, 2015
    Publication date: January 26, 2017
    Inventors: Tien-Ming Wang, YI-FAN YEH, YI-SONG SIAO
  • Patent number: 9215739
    Abstract: A method for pairing users of a wireless mobile communication device and a server thereof includes the following steps: (1) receiving the three-dimensional coordinates of a first wireless mobile communication device; (2) accessing a query database containing a piece of first relationship data and a plurality of pieces of second relationship data; (3) filtering at least one associated with the related attributes of the first relationship data from a plurality of pieces of second relationship data according to the related attributes of the first relationship data; (4) providing the three-dimensional coordinates of each said second wireless mobile communication device according to the filtered second relationship data; and (5) calculating the offset between the three-dimensional coordinates of the first wireless mobile communication device and the three-dimensional coordinates of each said second wireless mobile communication device.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: December 15, 2015
    Inventors: Tien-Ming Wang, Yi-Chien Chen
  • Publication number: 20140287680
    Abstract: A method for pairing users of a wireless mobile communication device and a server thereof includes the following steps: (1) receiving the three-dimensional coordinates of a first wireless mobile communication device; (2) accessing a query database containing a piece of first relationship data and a plurality of pieces of second relationship data; (3) filtering at least one associated with the related attributes of the first relationship data from a plurality of pieces of second relationship data according to the related attributes of the first relationship data; (4) providing the three-dimensional coordinates of each said second wireless mobile communication device according to the filtered second relationship data; and (5) calculating the offset between the three-dimensional coordinates of the first wireless mobile communication device and the three-dimensional coordinates of each said second wireless mobile communication device.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 25, 2014
    Inventors: Tien-Ming Wang, Yi-Chien Chen
  • Publication number: 20100098513
    Abstract: A self-locking fastener includes a head, and a solid shaft extending from the head. The shaft includes a threaded portion away from the head. A slot is defined in the threaded portion along the axis of the threaded portion to divide the threaded portion into two parts.
    Type: Application
    Filed: December 15, 2008
    Publication date: April 22, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: TIEN-MING WANG