Abstract: A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r1. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r2, wherein r1<r2?0.8 and r2?r1?0.025.

Abstract: A hydrophobic polyvinyl alcohol and a method for preparing hydrophobic polyvinyl alcohol are provided. The hydrophobic polyvinyl alcohol includes a first repeat unit represented by Formula (I), a second repeat unit represented by Formula (II), and a third repeat unit represented by Formula (III) wherein R1 is —Si(R2)3, R2 is independently C1-6 alkoxy group, C6-18 alkyl group, or C6-22 alkenyl group, and at least one R2 is C6-18 alkyl group or C6-22 alkenyl group; R3 and R4 are independently C6-18 alkyl group or C6-22 alkenyl group; j is 3 to 7; and k is 1 to 30.

Abstract: An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Abstract: A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r1. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r2, wherein r1<r2?0.8 and r2?r1?0.025.

Abstract: A hydrophobic polyvinyl alcohol and a method for preparing hydrophobic polyvinyl alcohol are provided. The hydrophobic polyvinyl alcohol includes a first repeat unit represented by Formula (I), a second repeat unit represented by Formula (II), and a third repeat unit represented by Formula (III) wherein R1 is —Si(R2)3, R2 is independently C1-6 alkoxy group, C6-18 alkyl group, or C6-22 alkenyl group, and at least one R2 is C6-18 alkyl group or C6-22 alkenyl group; R3 and R4 are independently C6-18 alkyl group or C6-22 alkenyl group; j is 3 to 7; and k is 1 to 30.

Abstract: An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Abstract: A light switchable device is provided. The light switchable device includes a first conductive layer, a second conductive layer disposed opposite the first conductive layer, and a sealant layer disposed between the first conductive layer and the second conductive layer. The first conductive layer, the second conductive layer, and the sealant layer form a closed space. The light switchable device also includes a light switchable layer disposed in the closed space, wherein the light switchable layer includes a plurality of alignment structures and polymer-stabilized liquid crystals (PSLC). The plurality of alignment structures is disposed on the first conductive layer or the second conductive layer, and the PSLC's are distributed between the plurality of alignment structures. A height of the plurality of alignment structures is less than a height of the sealant layer, and greater than or equal to 5% of the height of the sealant layer.

Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.

Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.

Abstract: A resin containing oxetane and epoxy groups is provided, being formed by reacting (a) a product of reacting 1 part by mole of a mono-oxetane with a hydroxyl group and 1.1 to 2.5 parts by mole of anhydride, and (b) 2.1 to 4.2 parts by mole of a diepoxy compound. The mono-oxetane with a hydroxyl group has a structure: wherein R1 is H, C1-6 alkyl group, C1-6 fluoroalkyl group, alkenyl group, or phenyl group, and R2 is C1-6 alkylene group or vinyl ether group.

Abstract: The present disclosure provides a top emitting organic electroluminescent device including a first scattering layer, and a first electrode, at least one organic material layer, a second electrode and a second scattering layer formed on the first scattering layer sequentially. The first scattering layer contains a plurality of micro-particles that are 10 to 90 wt % of the first scattering layer.

Abstract: The present disclosure provides a top emitting organic electroluminescent device including a first scattering layer, and a first electrode, at least one organic material layer, a second electrode and a second scattering layer formed on the first scattering layer sequentially. The first scattering layer contains a plurality of micro-particles that are 10 to 90 wt % of the first scattering layer.

Abstract: A resin containing oxetane and epoxy groups is provided, being formed by reacting (a) a product of reacting 1 part by mole of a mono-oxetane with a hydroxyl group and 1.1 to 2.5 parts by mole of anhydride, and (b) 2.1 to 4.2 parts by mole of a diepoxy compound. The mono-oxetane with a hydroxyl group has a structure: wherein R1 is H, C1-6 alkyl group, C1-6 fluoroalkyl group, alkenyl group, or phenyl group, and R2 is C1-6 alkylene group or vinyl ether group.

Abstract: A partially esterified epoxy resin and an epoxy resin composition applied with the same, and a method for preparing the composition are provided. The preparation method includes the following steps. A bifunctional epoxy resin and an anhydride are mixed and heated, wherein the number of equivalent moles of the bifunctional epoxy resin is greater than that of the anhydride, to form a partially esterified epoxy resin. A curing agent is mixed into the partially esterified epoxy resin to form a mixed solution. The mixed solution is cured to form the partially esterified epoxy resin composition.

Abstract: The disclosure provides a multilayer composition containing fluoropolymer and method for fabricating the same, and a solar cell module. The multilayer composition includes: a fluoropolymer layer; a non-fluorinated polymer layer; and an adhesion promoter layer formed between the fluoropolymer layer and the non-fluorinated polymer layer, wherein the adhesion promoter layer includes aromatic diamines or aromatic polyamines.

Abstract: A partially esterified epoxy resin and an epoxy resin composition applied with the same, and a method for preparing the composition are provided. The preparation method includes the following steps. A bifunctional epoxy resin and an anhydride are mixed and heated, wherein the number of equivalent moles of the bifunctional epoxy resin is greater than that of the anhydride, to form a partially esterified epoxy resin. A curing agent is mixed into the partially esterified epoxy resin to form a mixed solution. The mixed solution is cured to form the partially esterified epoxy resin composition.

Abstract: The disclosure provides a thermosetting composition, including: (a) about 1-35 wt % of an oligomer, wherein the oligomer is obtained by reacting a liquid epoxy resin with an aromatic primary amine having four active hydrogen atoms, and the liquid epoxy resin and the primary amine have an equivalent mole ratio of 1:0.15-1:2.50; (b) about 5-10 wt % of a long chain resin; (c) about 50-80 wt % of an epoxy resin having at least two functional groups; and (d) about 5-15 wt % of a plasticizer.

Abstract: The disclosure provides a multilayer composition containing fluoropolymer and method for fabricating the same, and a solar cell module. The multilayer composition includes: a fluoropolymer layer; a non-fluorinated polymer layer; and an adhesion promoter layer formed between the fluoropolymer layer and the non-fluorinated polymer layer, wherein the adhesion promoter layer includes aromatic diamines or aromatic polyamines.

Abstract: A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure.