Abstract: A light detection element, including a first light detection unit, a second light detection unit, and a driving transistor, is provided. The first light detection unit includes a first transistor and a first light sensing unit. The first transistor and the first light sensing unit are electrically connected. The second light detection unit and the first light detection unit are electrically connected. The second light detection unit includes a second light sensing unit and a second transistor. The second light sensing unit and the second transistor are electrically connected. The driving transistor has a gate terminal. The gate terminal is electrically connected to the first light sensing unit and the second light sensing unit. In a time interval, the first transistor is not turned on and the second transistor is turned on.

Abstract: A MEMS multiaxial angular rate sensor includes a substrate and a MEMS wafer layer correspondingly deposited and parallel to each other, and a plurality of anchors coupled to the MEMS wafer layer and fixing the MEMS wafer layer onto the substrate. The MEMS wafer layer includes at least two drive-sensing structures, a third driving ring and two pendulum masses. Each of the drive-sensing structures includes a driving ring, a plurality of driving comb pair structures and a plurality of sensing proof masses respectively coupled to the corresponding driving ring. A third driving ring is coupled to and deposited between the two driving rings of the two drive-sensing structures. In a driving mode, those driving comb pair structures drive the corresponding driving rings to perform periodical rotation motions, and the two driving rings in periodical rotation motions further actuate the third driving ring to perform periodical rotation motion together.

Abstract: A MEMS multiaxial angular rate sensor includes a substrate and a MEMS wafer layer correspondingly deposited and parallel to each other, and a plurality of anchors coupled to the MEMS wafer layer and fixing the MEMS wafer layer onto the substrate. The MEMS wafer layer includes at least two drive-sensing structures, a third driving ring and two pendulum masses. Each of the drive-sensing structures includes a driving ring, a plurality of driving comb pair structures and a plurality of sensing proof masses respectively coupled to the corresponding driving ring. A third driving ring is coupled to and deposited between the two driving rings of the two drive-sensing structures. In a driving mode, those driving comb pair structures drive the corresponding driving rings to perform periodical rotation motions, and the two driving rings in periodical rotation motions further actuate the third driving ring to perform periodical rotation motion together.

Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.

Abstract: A manufacturing method of microelectromechanical system (MEMS) device includes providing a first, a second and a third substrates, wherein the first substrate includes a first and a second circuit, the second substrate includes second and third connection areas, and the third substrate includes first connection areas. Second grooves and a dividing groove are formed on the fourth surface of the third substrate. The second and third substrates are bonded to make the first and the second connection areas correspondingly connect with each other. The second substrate is divided to form electrically isolating first and second movable elements. The first movable element is spatial separated from the third substrate and corresponding to the second groove. The second movable element is connected to the third substrate. The first and the second substrates are bonded to make the fourth and the third connection areas connect correspondingly.

Abstract: A force sensor includes a package substrate, a MEMS-based device, a package body and a force touching member. The MEMS-based device is disposed on the package substrate and electrically connected with the package substrate. The package body encapsulates the MEMS-based device. The force touching member including a rod is disposed on the package body and corresponding to the MEMS-based device. The force sensor allows a greater assembly tolerance.

Abstract: A three-axis accelerometer measures acceleration in three axes by a single movable mass block, so that a more compact design of the three-axis accelerometer can be achieved. In addition, a plurality of detection capacitors, which forms differential capacitor pairs, are arranged in symmetric configuration with respect to a rotation axis of the movable mass block for sensing functions. Therefore, during sensing motion of a target axis direction, the all other unwanted capacitance changes in other axis direction may be cancelled.

Abstract: A three-axis accelerometer measures acceleration in three axes by a single movable mass element, so that a more compact design of the three-axis accelerometer can be achieved. In addition, a plurality of detection capacitors, which forms differential capacitor pairs, are arranged in symmetric configuration with respect to a rotation axis of the movable mass element. Therefore, when the movable mass element rotates, the differential capacitance value is zero, and the detection error caused by rotation of the movable mass element can be avoided.

Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.

Abstract: A manufacturing method of microelectromechanical system (MEMS) device includes providing a first, a second and a third substrates, wherein the first substrate includes a first and a second circuit, the second substrate includes second and third connection areas, and the third substrate includes first connection areas. Second grooves and a dividing groove are formed on the fourth surface of the third substrate. The second and third substrates are bonded to make the first and the second connection areas correspondingly connect with each other. The second substrate is divided to form electrically isolating first and second movable elements. The first movable element is spatial separated from the third substrate and corresponding to the second groove. The second movable element is connected to the third substrate. The first and the second substrates are bonded to make the fourth and the third connection areas connect correspondingly.

Abstract: This disclosure discloses a pollution-free electroplating solution for electroplating and its preparation method. The process of the preparation method includes: mixing choline chloride with nitrogenous compounds in molar ratio of 1:2, heating to 80° C. to form uniform ionic liquid, adding metal chloride into ionic liquid with molar concentration between 0.005M to 0.5 M, adding 7˜11 wt % of bio bacteria and 0.7M˜2M of inorganic acid agent into the mixed liquid. After been mixed thoroughly, this pollution-free electroplating solution is ready for the application in electroplating.

Abstract: A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.

Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.

Abstract: A force sensor includes a package substrate, a MEMS-based device, a package body and a protruding element. The MEMS-based device is disposed on the package substrate and electrically connected with the package substrate. The package body encapsulates the MEMS-based device. The protruding element includes a bump, disposed on the package body and corresponding to the MEMS-based device. The force sensor allows a greater assembly tolerance.

Abstract: A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.

Abstract: A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.

Abstract: A method for manufacturing a MEMS device includes disposing at least one bonding portion having a smaller bonding area in a region where an airtight chamber will be formed, and disposing a metal getter on a bonding surface of the bonding portion. According to this structure, when substrates are bonded to define the airtight chamber, the metal getter is squeezed out of the bonding position due to the larger bonding pressure of the bonding portion with a smaller bonding area. Then, the metal getter is activated to absorb the moisture in the airtight chamber. According to the above process, no additional procedure is needed to remove the moisture in the airtight chamber. A MEMS device manufactured by the above manufacturing method is also disclosed.

Abstract: A pressure sensor includes a bearing region and a frame which is spatially separated from the bearing region, wherein a sensing element of the pressure sensor is produced on the bearing region. When the aforementioned pressure sensor is mounted on a package substrate, the stress from the package substrate or a circuit board can be isolated by a space between the bearing region and the frame to avoid unexpected deformation on the sensing element.

Abstract: A microelectromechanical system (MEMS) device includes a processing die, a MEMS die and a plurality of wires. The MEMS die includes a substrate and a MEMS element. The substrate has a first surface, and the first surface includes a circuit and a plurality of first conductive contacts electrically connected with the circuit. The MEMS element has a second surface, a third surface and at least one second conductive contact, wherein the MEMS element is disposed on the first surface of the substrate with the second surface facing the substrate, and the at least one second conductive contact is disposed on the third surface of the MEMS element. The wires electrically connect the substrate and the MEMS element of the MEMS die to the processing die through the first conductive contacts and the second conductive contact respectively.

Abstract: This disclosure discloses a pollution-free electroplating solution for electroplating and its preparation method. The process of the preparation method includes: mixing choline chloride with nitrogenous compounds in molar ratio of 1:2, heating to 80° C. to form uniform ionic liquid, adding metal chloride into ionic liquid with molar concentration between 0.005M to 0.5 M, adding 7˜11 wt % of bio bacteria and 0.7M˜2M of inorganic acid agent into the mixed liquid. After been mixed thoroughly, this pollution-free electroplating solution is ready for the application in electroplating.