Patents by Inventor Tilman Zehender
Tilman Zehender has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11145797Abstract: Embodiments relate to forming an elastomeric interface layer (elayer) with a flap over multiple light emitting diode (LED) dies by forming materials across multiple LED dies and removing the materials between the LED dies. The formed flap of the elayer provides a large surface area for adhesion between each LED and a pick-up surface. For example, the flap may have a surface area that is larger than the light emitting surface of the LED die, or larger than the surface area of an elastomeric interface layer without the flap. As such, the elayer allows each LED to be picked up by a pick-up surface and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (?LED) dies.Type: GrantFiled: January 31, 2019Date of Patent: October 12, 2021Assignee: Facebook Technologies, LLCInventors: Oscar Torrents Abad, Tilman Zehender, Pooya Saketi, Karsten Moh
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Patent number: 10763135Abstract: Embodiments relate to an integrated process for forming an elastomeric layer over an epitaxial structure of multiple light emitting diode (LED) dies, and then etching the elastomeric layer into individual elastomeric interface layers (elayers) on each of the LED dies and etching the epitaxial structure to singulate the LED dies. The elayer allows each LED die to be picked up by a pick-up head (or pick and place head (PPH)), and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (uLED) dies.Type: GrantFiled: January 30, 2018Date of Patent: September 1, 2020Assignee: Facebook Technologies, LLCInventors: Pooya Saketi, Karsten Moh, Tilman Zehender
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Patent number: 10741717Abstract: Embodiments relate to a micro light-emitting-diode (?LED) fabricated using a self-aligned process. To fabricate the ?LED, a metal layer is deposited on a p-type semiconductor. The p-type semiconductor is on an n-type semiconductor and the n-type semiconductor is on a top side of a substrate. The metal layer is patterned to define a p-metal. The p-type semiconductor is etched using the p-metal as an etch mask. Similarly, the n-type semiconductor is etched using the p-metal and the p-type semiconductor as an etch mask. A negative photoresist layer is deposited over the patterned p-metal and the p-type semiconductor. The negative photoresist is then exposed from the back side of the substrate, thus exposing the regions of the negative photoresist that are not masked by the p-metal. The negative photoresist is then developed to expose the p-metal.Type: GrantFiled: March 18, 2019Date of Patent: August 11, 2020Assignee: Facebook Technologies, LLCInventors: Celine Claire Oyer, David Massoubre, Tilman Zehender
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Patent number: 10720468Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.Type: GrantFiled: October 11, 2018Date of Patent: July 21, 2020Assignee: Facebook Technologies, LLCInventors: Patrick Joseph Hughes, Vincent Brennan, Joseph O'Keeffe, Christopher Percival, William Padraic Henry, Tilman Zehender
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Publication number: 20190237347Abstract: Embodiments relate to an integrated process for forming an elastomeric layer over an epitaxial structure of multiple light emitting diode (LED) dies, and then etching the elastomeric layer into individual elastomeric interface layers (elayers) on each of the LED dies and etching the epitaxial structure to singulate the LED dies. The elayer allows each LED die to be picked up by a pick-up head (or pick and place head (PPH)), and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (uLED) dies.Type: ApplicationFiled: January 30, 2018Publication date: August 1, 2019Inventors: Pooya Saketi, Karsten Moh, Tilman Zehender
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Patent number: 10326040Abstract: Embodiments relate to forming a conformable interface layers (clayers) on small semiconductor devices, such as light emitting diodes (LEDs) to facilitate adhesion with a pick-up head for operations during the manufacturing of an electronic display. A conformable material is formed in regions between LED dies on a carrier substrate and over the LED dies. A mask is applied over the conformable material to selectively cover the conformable material. Portions of the conformable material are exposed to light to selectively cure or not cure the portions of the conformable material. The conformable material between the LED dies is removed to form a conformable interface layer over each of the LED dies.Type: GrantFiled: February 22, 2018Date of Patent: June 18, 2019Assignee: Facebook Technologies, LLCInventors: Oscar Torrents Abad, Tilman Zehender, Pooya Saketi, Karsten Moh
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Publication number: 20190043917Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.Type: ApplicationFiled: October 11, 2018Publication date: February 7, 2019Inventors: Patrick Joseph Hughes, Vincent Brennan, Joseph O'Keeffe, Christopher Percival, William Padraic Henry, Tilman Zehender
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Patent number: 10177196Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.Type: GrantFiled: November 14, 2016Date of Patent: January 8, 2019Assignee: Facebook Technologies, LLCInventors: Patrick Joseph Hughes, Vincent Brennan, Joseph O'Keeffe, Christopher Percival, William Padraic Henry, Tilman Zehender
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Publication number: 20170141155Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.Type: ApplicationFiled: November 14, 2016Publication date: May 18, 2017Inventors: Patrick Joseph Hughes, Vincent Brennan, Joseph O'Keeffe, Christopher Percival, William Padraic Henry, Tilman Zehender