Patents by Inventor Tim Corbett

Tim Corbett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for testing using a universal wafer carrier for wafer level die burn-in
    Publication number: 20050237077
    Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
    Type: Application
    Filed: June 30, 2005
    Publication date: October 27, 2005
    Inventors: Alan Wood, Tim Corbett
  • Method for testing using a universal wafer carrier for wafer level die burn-in
    Publication number: 20050237075
    Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
    Type: Application
    Filed: June 30, 2005
    Publication date: October 27, 2005
    Inventors: Alan Wood, Tim Corbett
  • Method for testing using a universal wafer carrier for wafer level die burn-in
    Publication number: 20050237076
    Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
    Type: Application
    Filed: June 30, 2005
    Publication date: October 27, 2005
    Inventors: Alan Wood, Tim Corbett