Abstract: A ruggedized computer assembly that includes a liquids proof case made of thermally conductive material and having an exterior surface and an interior surface. Also, an electrically-powered cooling assembly is supported on the exterior surface and draws heat from the exterior surface. Moreover, a plurality of computers is housed in the case, and supported by and thermally connected to the interior surface of the case, so that heat is transferred from the computer assembly, through the liquids proof case, to the cooling assembly.

Abstract: A ruggedized computer, having a thermally conductive metal case having an interior surface and a thermal mass made of thermally conductive metal, suspended from the interior surface of the metal case. Also, a slide plate is supported within the metal case and is in thermal contact to the thermal mass; and a delicate, heat-producing integrated circuit, having a planar surface, is supported in the computer, with the planar surface being in thermal contact to the slide plate. Finally, the slide plate is held in place by a resilient system that permits, but gently resists, movement perpendicular to the integrated circuit, which is thereby not damaged due to force applied from the thermal mass through the slide plate to the integrated circuit, but whereby the thermal mass enhances thermal stability of the integrated circuit.

Abstract: A computer assembly includes a processor integrated circuit; a hard disk drive electrically connected to the processor integrated circuit and a power supply assembly, powering the processor integrated circuit and hard disk drive; a liquid-tight case, entirely containing and physically isolating and protecting the processor integrated circuit, hard disk drive and power supply assembly, the liquid-tight case defining fluid channels; electrical connectors to permit connection of the computer to outside devices; and a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitating the movement of heat through the computer assembly.

Abstract: A computer assembly includes a processor integrated circuit; a hard disk drive electrically connected to the processor integrated circuit and a power supply assembly, powering the processor integrated circuit and hard disk drive; a liquid-tight case, entirely containing and physically isolating and protecting the processor integrated circuit, hard disk drive and power supply assembly, the liquid-tight case defining fluid channels; electrical connectors to permit connection of the computer to outside devices; and a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitating the movement of heat through the computer assembly.

Abstract: A mechanical and thermal assembly adapted to absorb heat from a delicate, heat-producing structure having a planar surface includes a slide plate in thermal contact to said planar surface, and being held in place by a resilient system that permits, but gently resists, movement perpendicular to said planar surface and a thermal mass, suspended over said slide plate, but in thermal contact to said slide plate, so that said delicate, heat-producing structure is not damaged due to force applied from said thermal mass through said slide plate to said structure.

Abstract: A mechanical and thermal assembly adapted to absorb heat from a delicate, heat-producing structure having a planar surface includes a slide plate in thermal contact to said planar surface, and being held in place by a resilient system that permits, but gently resists, movement perpendicular to said planar surface and a thermal mass, suspended over said slide plate, but in thermal contact to said slide plate, so that said delicate, heat-producing structure is not damaged due to force applied from said thermal mass through said slide plate to said structure.

Abstract: A computer assembly having a processor integrated circuit, a hard disk drive electrically connected to the processor units and a power supply assembly, powering the processor integrated circuit and hard disk drive. These components are sealed in an liquid-tight case defining fluid channels. Electrical connectors permit connection of the processor to outside devices. Finally, a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitates the movement of heat through the computer assembly and creates a monolithic thermal structure. In one embodiment, the computer assembly is powered by a raw DC power supply input and self manages this power input source to provide consistent and reliable power to the computer assembly without burdening the raw DC power supply during transient conditions.