Patents by Inventor Tim H. Huynh

Tim H. Huynh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6875085
    Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: April 5, 2005
    Assignee: Mosel Vitelic, Inc.
    Inventors: David E. Weldon, Shu-Hsin Kao, Tim H. Huynh
  • Publication number: 20030017787
    Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.
    Type: Application
    Filed: September 23, 2002
    Publication date: January 23, 2003
    Inventors: David E. Weldon, Shu-Hsin Kao, Tim H. Huynh
  • Patent number: 6454641
    Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: September 24, 2002
    Inventors: David E. Weldon, Shu-Hsin Kao, Tim H. Huynh
  • Patent number: 6244945
    Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect of the invention provides a hydrostatic bearing with spiral or partial cardiod drain grooves. This bearing has a non-uniform support pressure profile but provides a uniform average pressure to a wafer that is rotated relative to the center of the bearing.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: June 12, 2001
    Assignee: Mosel Vitelic, Inc.
    Inventors: David E. Weldon, Shu-Hsin Kao, Tim H. Huynh
  • Patent number: 6126512
    Abstract: An automated tracking and control system measures the lateral displacement of a moving belt, using non-contact sensing. The displacement signal is provided to an algorithm that adjusts the tilts of the belt pulleys and steers the belt laterally. Non-contact sensors include inductive proximity sensors, which respond to the metal belt but are immune to airborne slurry and other non-metallic debris in a hostile environment typical of wafer polishing. Other non-contact sensors include shielded optical sensors. Dual sensor configurations cancel response to non-lateral displacements. Instrumentation, such as tension sensors, cylinder pressure sensors, load transducers, and limit switches, provides input to the algorithm. Independent tension signals for each belt edge verify proper functioning of, e.g., pad conditioners. User-specified belt displacements, e.g.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: October 3, 2000
    Assignee: Aplex Inc.
    Inventors: Mike Chao, Tim H. Huynh, Chi Guo, Huey M. Tzeng
  • Patent number: 6086456
    Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: July 11, 2000
    Assignee: Aplex, Inc.
    Inventors: David E. Weldon, Shu-Hsin Kao, Tim H. Huynh
  • Patent number: 6062959
    Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: May 16, 2000
    Assignee: Aplex Group
    Inventors: David E. Weldon, Shu-Hsin Kao, Tim H. Huynh