Patents by Inventor Tim McIntosh

Tim McIntosh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer backside grinding with stress relief
    Patent number: 8222118
    Abstract: A method of relieving stress in a semiconductor wafer and providing a wafer backside surface finish capable of hiding cosmetic imperfections. Embodiments of the invention include creating a wafer backside surface which can be used for all dies on the semiconductor wafer intended for different product applications and be deposited with backside metallization (BSM) material. The method provides a rough texture on the wafer backside followed by isotropic etching of the wafer backside to recover the wafer strength as well as to preserve the rough texture of the wafer backside. After wafer backside metallization, the rough texture of the wafer backside hides cosmetic imperfections introduced by subsequent processes.
    Type: Grant
    Filed: December 15, 2008
    Date of Patent: July 17, 2012
    Assignee: Intel Corporation
    Inventors: Mark Dydyk, Arturo Urquiza, Charles Singleton, Tim McIntosh
  • Personal workout management system
    Patent number: 8038577
    Abstract: The invention relates to an interactive exercise management system. The system may be used for improving a workout environment for a specific user or group of users, tracking exercise information, and providing future workout information. The system, and method of using the system, allows for a specific user or group of users to control their workout environmental conditions. The conditions that may be controlled include, but are not limited to, sight, sound, smell and climate.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: October 18, 2011
    Inventor: Tim McIntosh
  • Wafer Backside Grinding with Stress Relief
    Publication number: 20100151678
    Abstract: A method of relieving stress in a semiconductor wafer and providing a wafer backside surface finish capable of hiding cosmetic imperfections. Embodiments of the invention include creating a wafer backside surface which can be used for all dies on the semiconductor wafer intended for different product applications and be deposited with backside metallization (BSM) material. The method provides a rough texture on the wafer backside followed by isotropic etching of the wafer backside to recover the wafer strength as well as to preserve the rough texture of the wafer backside. After wafer backside metallization, the rough texture of the wafer backside hides cosmetic imperfections introduced by subsequent processes.
    Type: Application
    Filed: December 15, 2008
    Publication date: June 17, 2010
    Inventors: Mark Dydyk, Arturo Urquiza, Charles Singleton, Tim McIntosh
  • Personal workout management system
    Publication number: 20090253554
    Abstract: The invention relates to an interactive exercise management system. The system may be used for improving a workout environment for a specific user or group of users, tracking exercise information, and providing future workout information. The system, and method of using the system, allows for a specific user or group of users to control their workout environmental conditions. The conditions that may be controlled include, but are not limited to, sight, sound, smell and climate.
    Type: Application
    Filed: April 6, 2009
    Publication date: October 8, 2009
    Inventor: Tim McIntosh