Patents by Inventor Tim Oliver Stadelmann

Tim Oliver Stadelmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for inspecting a semiconductor chip prior to bonding
    Patent number: 9515045
    Abstract: A chip handling apparatus, unit and method is presented. The chip handling apparatus comprises a chip supply station; a chip mounting station; and one or more chip handling units configured to pick a chip from the supply station, transport the chip to the mounting station, and place the chip at a mounting location; wherein each chip handling unit is configured to temporarily retain the chip in a defined position relative to the chip handling unit. The chip handling apparatus further comprises means for inducing sonic vibrations in the chip when retained by one of the chip handling units; and means for measuring the vibrations induced in the chip.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: December 6, 2016
    Assignee: Kulicke and Soffa Die Bonding GmbH
    Inventors: Andreas Marte, Tim Oliver Stadelmann
  • METHOD AND APPARATUS FOR INSPECTING A SEMICONDUCTOR CHIP PRIOR TO BONDING
    Publication number: 20130025791
    Abstract: A chip handling apparatus, unit and method is presented. The chip handling apparatus comprises a chip supply station; a chip mounting station; and one or more chip handling units configured to pick a chip from the supply station, transport the chip to the mounting station, and place the chip at a mounting location; wherein each chip handling unit is configured to temporarily retain the chip in a defined position relative to the chip handling unit. The chip handling apparatus further comprises means for inducing sonic vibrations in the chip when retained by one of the chip handling units; and means for measuring the vibrations induced in the chip.
    Type: Application
    Filed: July 26, 2012
    Publication date: January 31, 2013
    Applicant: KULICKE & SOFFA DIE BONDING GMBH
    Inventors: Andreas Marte, Tim Oliver Stadelmann