Patents by Inventor Timo Bergman

Timo Bergman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11988455
    Abstract: The invention relates to a thermal energy storage with at least one thermal energy storage volume. The thermal energy storage comprises at least one primary borehole extending from ground level to a first predetermined depth in a rock body; at least one set of secondary boreholes located around the at least one primary borehole; and at least an upper and a lower fracture plane extending in a radial and/or oblique plane from the at least one primary borehole towards adjacent secondary boreholes. At least one fracture plane permits a hydraulic flow between at least one of the secondary boreholes and the primary borehole. Each thermal energy storage volume is defined by one set of secondary boreholes and its upper and lower fracture planes. The set of secondary boreholes diverge away from the at least one primary borehole at each fractured plane level, without intersecting the at least one primary borehole.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 21, 2024
    Assignee: Hydroc Energy Storage AB
    Inventors: Sven-Åke Larsson, Bo Bergman, Nils Olofsson, Timo Pohjanvouri
  • Patent number: 10501866
    Abstract: A gas distribution system is disclosed in order to obtain better film uniformity on a wafer. The better film uniformity may be achieved by utilizing an expansion plenum and a plurality of, for example, proportioning valves to ensure an equalized pressure or flow along each gas line disposed above the wafer.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: December 10, 2019
    Assignee: ASM IP Holding B.V.
    Inventors: Stephen Dale Coomer, Robert Vyne, Timo Bergman, Lee Bode, Wentao Wang
  • Publication number: 20170260649
    Abstract: A gas distribution system is disclosed in order to obtain better film uniformity on a wafer. The better film uniformity may be achieved by utilizing an expansion plenum and a plurality of, for example, proportioning valves to ensure an equalized pressure or flow along each gas line disposed above the wafer.
    Type: Application
    Filed: January 19, 2017
    Publication date: September 14, 2017
    Inventors: Stephen Dale Coomer, Robert Vyne, Timo Bergman, Lee Bode, Wentao Wang