Patents by Inventor Timothy A. Figge

Timothy A. Figge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5424918
    Abstract: A universal system for mounting hybrid circuits to printed circuit boards is presented. This universal hybrid mounting system comprises a bottom plate, a frame, a top plate, a heat sink and mounting hardware including a spring. A hybrid circuit package is securely attached to one side of the frame using the top and bottom plates and mounting hardware. The other side of the frame is brought into contact with a printed circuit board (PCB). The PCB comprises a plurality of landing pads which may be gold-plated. The frame comprises a plurality of compliant pins that electrically connect the hybrid to the landing pads of the PCB. The heat sink, in conjunction with the spring, are provided to accommodate high power hybrid packages.
    Type: Grant
    Filed: March 31, 1994
    Date of Patent: June 13, 1995
    Assignee: Hewlett-Packard Company
    Inventors: Jimmie D. Felps, Frank P. Leri, Donald E. Schott, Timothy A. Figge
  • Patent number: 5314342
    Abstract: The invention provides an adapter for electrically connecting an electronic probe to an electronic device. A pair of jaws are slidably mounted on rails. Teeth protrude from the jaws in a position to engage the gaps between the leads of a fine pitch integrated circuit chip. A flex circuit has traces connecting exposed contacts on one end, which exposed contacts are located between the teeth. The contacts have the same pitch as the chip leads. A wire-filled elastomer is located over the exposed contacts. A screw passing through threaded bores in the jaws, draws the jaws toward each other, urging the teeth into the gaps to self-align the adapter, and compressing the elastomer, so that the wires in it connect each chip lead to one of the exposed contacts. A probe may be connected to a selected lead by connecting it to the appropriate through-hole.
    Type: Grant
    Filed: September 9, 1992
    Date of Patent: May 24, 1994
    Assignee: Hewlett-Packard Company
    Inventor: Timothy A. Figge