Abstract: Apparatus and systems for applying filling compound, such as water blocking compound, and water absorbing powder to a core wire or wires of a stranded conductor or to subsequent layers of a stranded conductor, which are particularly suitable for use with a tubular strander, include a rotatable head, which may be positioned downstream of a wire strander. The core is drawn through a core passage where the filling compound is applied to the core and powder is applied to the filling compound. Strand through passages are provided through the rotatable head, for drawing the strand wires therethrough, without being coated. The strand wires are stranded about the core in a closing die. Preferably, the powder circulation circuit is a closed circuit, enabling recycling of the powder. The powder is preferably fluidized prior to its delivery to the applicator, and is withdrawn from the applicator under a slight vacuum.