Abstract: A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.

Abstract: A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.

Abstract: A vacuum chuck apparatus may include chuck plate having a substantially flat chucking surface, one or more lift pins, and a lifting mechanism. The lift pins are configured to clamp a substrate at three or more locations. The lifting mechanism lifts the heads of the pins above the level of the chucking surface subsequently lowers the pins to pull the substrate to substantially conform to the chucking surface. A warped substrate may be secured to the chuck surface by raising the lift pins above the surface of chuck, securing a backside of the substrate with the lift pins at three or more locations, and lowering the lift pins to draw the substrate against the surface of the chuck so that the substrate substantially conforms to the surface of the chuck.