Abstract: Methods, apparatus, and products for dynamically configuring current sharing and fault monitoring in redundant power supply modules for components of an electrically powered system, including summing, by a master service processor, during powered operation of the system, the present power requirements of components presently installed in the electrically powered system and setting, by the master service processor for each redundant power supply module in dependence upon the sum of the present power requirements, a current sharing tolerance and a fault reporting tolerance.

Abstract: Methods, apparatus, and products for dynamically configuring current sharing and fault monitoring in redundant power supply modules for components of an electrically powered system, including summing, by a master service processor, during powered operation of the system, the present power requirements of components presently installed in the electrically powered system and setting, by the master service processor for each redundant power supply module in dependence upon the sum of the present power requirements, a current sharing tolerance and a fault reporting tolerance.

Abstract: Methods, apparatus, and products for dynamically configuring current sharing and fault monitoring in redundant power supply modules for components of an electrically powered system, including summing, by a master service processor, during powered operation of the system, the present power requirements of components presently installed in the electrically powered system and setting, by the master service processor for each redundant power supply module in dependence upon the sum of the present power requirements, a current sharing tolerance and a fault reporting tolerance.

Abstract: Methods, apparatus, and products for dynamically configuring current sharing and fault monitoring in redundant power supply modules for components of an electrically powered system, including summing, by a master service processor, during powered operation of the system, the present power requirements of components presently installed in the electrically powered system and setting, by the master service processor for each redundant power supply module in dependence upon the sum of the present power requirements, a current sharing tolerance and a fault reporting tolerance.

Abstract: Exemplary embodiments include An active impedance current-sharing circuit including: a power supply in electrical communication with a current sense resistor; a differential amplifier in electrical communication with the current sense resistor; a gate adjust amplifier in electrical communication with the differential amplifier; an ORing MOSFET in electrical communication with the gate adjust amplifier and the current sense resistor; a current share resistor in electrical communication with a current share bus and the gate adjust amplifier; and a current share output in electrical communication with the ORing MOSFET, wherein the circuit allows two or more power supplies that are not designed for current share to be connected in parallel and current share by actively modulating the ORing MOSFET between its linear and fully enhanced regions.

Abstract: A power supply includes a rectifier which receives alternating current as an input, and which provides an output of direct current pulses at a positive polarity output line thereof with respect to a negative polarity output line thereof. A back-up circuit is coupled between the positive and negative polarity output lines of the rectifier. The back-up circuit includes the series connection of a switching device, a current blocking device, at least one electrical energy source device, and a current measuring device. A circuit protection device may also be provided in the series connection. The back-up circuit can be tested while the rectifier is providing the direct current output pulses by closing the switching device and detecting at least one pulse of a test current flowing through the back-up circuit and/or a terminal voltage of the at least one electrical energy source device during the testing.

Abstract: Disclosed is a circuit board and a process for the manufacture thereof providing a circuit board comprising a metal core having parallel first and second major faces and exhibiting high thermal and electrical conductivity. The circuit board includes electrical insulating layers of thermally conductive, dielectric material applied to the first and second major faces of the metal core. Protecting the dielectric layer and copper conductors is a solder mask layer applied to the dielectric layers and forming outward facing major surfaces. A plurality of insulated and grounded vias having electrically conductive interior rings connecting the major surfaces are provided through the board. Conductive sleeves within the vias are either electrically insulated from the metal core by dielectric material or in electrical contact to the metal core for grounding.