Abstract: A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be provided by formation on an inside surface of the top wall portion of the closure of the package. After formation of the assembly, it is contemplated that a sealing liner be positioned within the closure so that the microelectronics assembly is positioned between the top wall portion and the sealing liner.

Abstract: A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be provided, and positioned on an associated substrate for positioning adjacent an inside surface of the top wall portion of the closure of the package. In one embodiment, the mounting substrate is provided in the form of a disc-shaped sealing liner for the closure. In an alternate embodiment, the mounting substrate is laminated to an associated sealing liner, with the substrate, and microelectronics assembly positioned thereon, inserted together with the sealing liner into the associated molded closure.

Abstract: A fluid pump with an improved manifold including a pump housing; an inlet manifold flow connected to the pump housing, the inlet manifold including an inlet manifold body, having a first end, a second end and an inlet manifold flow opening between the ends; and a discharge manifold flow connected to the pump housing at a location away from the inlet manifold, the discharge manifold including a discharge manifold body having a first end and a second end and a discharge manifold flow opening located between the ends, the discharge and inlet manifold flow openings each including a threaded portion and a flange for making either a threaded connection or flange connection with a flow conduit.