Abstract: The invention relates to compounds of formula (I): or a salt thereof, wherein R1, G, L1, L2, L3, and Y are as described herein. Compounds of formula (I) and pharmaceutical compositions thereof are inhibitors of one, or both of, ?v?1 integrin and ?v?6 integrin that are useful for treating fibrosis such as in nonalcoholic steatohepatitis (NASH), idiopathic pulmonary fibrosis (IPF) and nonspecific interstitial pneumonia (NSIP).

Abstract: The facility comprises a plurality of processing stations (14A, 14B, 14C, 16, 18, 20, 20, 22, 24) for producing containers from a thermoplastic substrate. The facility comprises a plurality of basic conveyors (30) that cooperate with a travel track (32), for the purpose of conveying the sheets to the processing stations, the respective movements of the basic conveyors being controlled according to respective movement control commands generated by a control unit (ECU).

Abstract: The containers are thermoformed at a thermoforming station from blanks cut out from a sheet of thermoplastic material. Before thermoforming the containers, at least some blank zones in the sheet are heated, the hot blanks are cut out from the heated zones and the hot blanks are conveyed to the thermoforming station.

Abstract: The containers are thermoformed at a thermoforming station from blanks cut out from a sheet of thermoplastic material. Before thermoforming the containers, at least some blank zones in the sheet are heated, the hot blanks are cut out from the heated zones and the hot blanks are conveyed to the thermoforming station.

Abstract: The device for thermoforming an object presenting an undercut portion. The device may include a thermoforming mold having a base portion and at least two undercut-forming portions in the vicinity of an end; a countermold; and a moving thermoforming piston. The device further may include holding means suitable for holding the rim of the object relative to the countermold, and, in order to unmold the object, said portions of the mold and the holding means are suitable for being controlled in a sequence in which the undercut-forming portions are moved apart, the holding means are active and hold the object against the countermold, and at least the base portion of the mold is spaced apart from the countermold while the holding means are active.

Abstract: The installation for manufacturing objects such as receptacles by thermoforming pellets of thermoplastic material includes conveyor means for conveying the pellets through the various stations in the installation, said stations including a heating station and a thermoforming station. The conveyor means comprise conveyor elements (46) defining cells (48) which are open upwards and downwards, and each of which is suitable for containing one pellet (12) while the entire top and bottom faces of the pellet remain unobstructed, means for depositing the pellets in the cells, drive means for driving the conveyor elements through the heating station, and transfer means (20) for transferring the heated pellets to the thermoforming station. The heating station includes bottom heater means (52) that co-operate with a support for the pellets while said conveyor elements are being driven through the heating station.

Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

Abstract: The installation for manufacturing objects such as receptacles by thermoforming pellets of thermoplastic material includes conveyor means for conveying the pellets through the various stations in the installation, said stations including a heating station and a thermoforming station. The conveyor means comprise conveyor elements (46) defining cells (48) which are open upwards and downwards, and each of which is suitable for containing one pellet (12) while the entire top and bottom faces of the pellet remain unobstructed, means for depositing the pellets in the cells, drive means for driving the conveyor elements through the heating station, and transfer means (20) for transferring the heated pellets to the thermoforming station. The heating station includes bottom heater means (52) that co-operate with a support for the pellets while said conveyor elements are being driven through the heating station.

Abstract: The device for thermoforming an object (10) presenting an undercut portion (10B) comprises: a thermoforming mold (12) having a base portion (13) and at least two undercut-forming portions (12A, 12B) in the vicinity of an end (12?); a countermold (18); and a moving thermoforming piston (20). The device further comprises holding means (23A, 23B) suitable for holding the rim (10A) of the object (10) relative to the countermold (18), and, in order to unmold the object, said portions (12A, 12B, 13) of the mold (12) and the holding means (23A, 23B) are suitable for being controlled in a sequence in which the undercut-forming portions (12A, 12B) are moved apart, the holding means (23A, 23B) are active and hold the object (10) against the countermold (18), and at least the base portion (13) of the mold (12) is spaced apart from the countermold while the holding means are active. Translation of the title and the abstract as they were when originally filed by the Applicant.

Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

Abstract: A semiconductor wafer is cut to singulate integrated circuit dice formed on the wafer. A die pick machine then positions and orients the singulated dice on a carrier base such that signal, power and ground pads formed on the surface of each die reside at predetermined positions relative to landmarks on the carrier base the die pick machine optically identifies. With the dice temporarily held in place on the carrier base, they are subjected to a series of testing and other processing steps. Since each die's signal pads reside in predetermined locations, they can be accessed by appropriately arranged probes providing test equipment with signal access to the pads during tests. After each test, a die pick machine may replace any die that fails the test with another die, thereby improving efficiency of subsequent testing and other processing resources.

Abstract: A succinylated zooglan polysaccharide is prepared by fermentation of the microorganism Zoogloea ramigera 115 (ATCC No. 25935). The polysaccharide has valuable properties as a thickening, suspending, stabilizing and lubricating agent in aqueous systems. The presence of succinate in the polysaccharide enables the polysaccharide to exhibit superior thickening and metal chelating properties in commercial applications.