Patents by Inventor Timothy D. Sullivan
Timothy D. Sullivan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10794948Abstract: An EM testing method includes forcing electrical current through EM monitor wiring arranged in close proximity to the perimeter of the TSV and measuring an electrical resistance drop across the EM monitor wiring. The method may further include determining if an electrical short exists between the EM monitor wiring and the TSV from the measured electrical resistance. The method may further include determining if an early electrical open or resistance increase exists within the EM monitoring wiring due to TSV induced proximity effect.Type: GrantFiled: November 7, 2017Date of Patent: October 6, 2020Assignee: International Business Machines CorporationInventors: Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan, Ping-Chuan Wang, Lijuan Zhang
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Patent number: 10677833Abstract: A structure, such as a wafer, semiconductor chip, integrated circuit, or the like, includes a through silicon via (TSV) and an electromigration (EM) monitor. The TSV) includes at least one perimeter sidewall. The EM monitor includes a first EM wire separated from the perimeter sidewall of the TSV by a dielectric.Type: GrantFiled: November 7, 2017Date of Patent: June 9, 2020Assignee: International Business Machines CorporationInventors: Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan, Ping-Chuan Wang, Lijuan Zhang
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Patent number: 10571490Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: GrantFiled: October 26, 2017Date of Patent: February 25, 2020Assignee: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Patent number: 10245667Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.Type: GrantFiled: July 19, 2017Date of Patent: April 2, 2019Assignee: GLOBALFOUNDRIES Inc.Inventors: Stephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan
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Patent number: 10224225Abstract: An apparatus and an associated method. The apparatus includes a chuck, an array of three or more ultrasonic sensors, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.Type: GrantFiled: April 19, 2018Date of Patent: March 5, 2019Assignee: International Business Machines CorporationInventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
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Publication number: 20180240694Abstract: An apparatus and an associated method. The apparatus includes a chuck, an array of three or more ultrasonic sensors, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.Type: ApplicationFiled: April 19, 2018Publication date: August 23, 2018Inventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
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Patent number: 10049897Abstract: Various embodiments include methods of forming interconnect structures, and the structures formed by such methods. In one embodiment, an interconnect structure can include: a photosensitive polyimide (PSPI) layer including a pedestal portion; a controlled collapse chip connection (C4) bump overlying the pedestal portion of the PSPI layer; a solder overlying the C4 bump and contacting a side of the C4 bump; and an underfill layer abutting the pedestal portion of the PSPI and the C4 bump, wherein the underfill layer and the solder form a first interface separated from the PSPI pedestal.Type: GrantFiled: February 1, 2017Date of Patent: August 14, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan
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Patent number: 9997385Abstract: An apparatus and an associated method. The apparatus includes a chuck in a process chamber, an array of three or more ultrasonic sensors in the process chamber, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.Type: GrantFiled: April 18, 2017Date of Patent: June 12, 2018Assignee: International Business Machines CorporationInventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
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Publication number: 20180074111Abstract: A structure, such as a wafer, semiconductor chip, integrated circuit, or the like, includes a through silicon via (TSV) and an electromigration (EM) monitor. The TSV) incldues at least one perimeter sidewall.Type: ApplicationFiled: November 7, 2017Publication date: March 15, 2018Inventors: Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan, Ping-Chuan Wang, Lijuan Zhang
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Publication number: 20180074110Abstract: An EM testing method includes forcing electrical current through EM monitor wiring arranged in close proximity to the perimeter of the TSV and measuring an electrical resistance drop across the EM monitor wiring. The method may further include determining if an electrical short exists between the EM monitor wiring and the TSV from the measured electrical resistance. The method may further include determining if an early electrical open or resistance increase exists within the EM monitoring wiring due to TSV induced proximity effect.Type: ApplicationFiled: November 7, 2017Publication date: March 15, 2018Inventors: Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan, Ping-Chuan Wang, Lijuan Zhang
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Publication number: 20180059141Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: ApplicationFiled: October 26, 2017Publication date: March 1, 2018Inventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Patent number: 9891261Abstract: A structure, such as a wafer, chip, IC, design structure, etc., includes a through silicon via (TSV) and an electromigration (EM) monitor. The TSV extends completely through a semiconductor chip and the EM monitor includes a plurality of EM wires proximately arranged about the TSV perimeter. An EM testing method includes forcing electrical current through EM monitor wiring arranged in close proximity to the perimeter of the TSV, measuring an electrical resistance drop across the EM monitor wiring, determining if an electrical short exists between the EM monitor wiring and the TSV from the measured electrical resistance, and/or determining if an early electrical open or resistance increase exists within the EM monitoring wiring due to TSV induced proximity effect.Type: GrantFiled: June 30, 2014Date of Patent: February 13, 2018Assignee: International Business Machines CorporationInventors: Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan, Ping-Chuan Wang, Lijuan Zhang
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Patent number: 9835653Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: GrantFiled: May 13, 2014Date of Patent: December 5, 2017Assignee: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Publication number: 20170312841Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.Type: ApplicationFiled: July 19, 2017Publication date: November 2, 2017Inventors: Stephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan
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Patent number: 9776270Abstract: Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.Type: GrantFiled: October 1, 2013Date of Patent: October 3, 2017Assignee: GLOBALFOUNDRIES Inc.Inventors: Stephen P. Ayotte, Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan
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Patent number: 9773726Abstract: Wiring structures, methods for providing a wiring structure, and methods for distributing currents with a wiring structure from one or more through-substrate vias to multiple bumps. A first current is directed from a first through-substrate via of a first electrical resistance through a first connection line to a first bump and directing a second current from the first through-substrate via through a second connection line of a second electrical resistance to a second bump. The first connection line has a first length relative to a first position of the first bump and a first cross-sectional area, the second connection line has a second length relative to a first position of the second bump and a second cross-sectional area, the second length is different from the first length, and the second cross-sectional area is different from the first cross-sectional area.Type: GrantFiled: November 3, 2016Date of Patent: September 26, 2017Assignee: International Business Machines CorporationInventors: Timothy D. Sullivan, Thomas A. Wassick
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Publication number: 20170221742Abstract: An apparatus and an associated method. The apparatus includes a chuck in a process chamber, an array of three or more ultrasonic sensors in the process chary a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.Type: ApplicationFiled: April 18, 2017Publication date: August 3, 2017Inventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
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Patent number: 9716010Abstract: A handle wafer which prevents edge cracking during a thinning process and method of using the handle wafer for grinding processes are disclosed. The handle wafer includes a body portion with a bottom surface. A square edge portion is provided about a circumference of the bottom surface.Type: GrantFiled: November 12, 2013Date of Patent: July 25, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Jeffrey P. Gambino, Kenneth F. McAvey, Jr., Charles F. Musante, Bruce W. Porth, Anthony K. Stamper, Timothy D. Sullivan
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Patent number: 9685362Abstract: An apparatus and method for centering substrates determining on a chuck. The apparatus includes a chuck in a process chamber, the chuck configured to removeably hold a substrate for processing; an array of two or more ultrasonic sensors arranged in the process chamber, each ultrasonic sensor arranged relative to the chuck so as to send a respective ultrasonic sound wave to a respective preselected region of the substrate and receive a respective return ultrasonic sound wave from the preselected region of the substrate; and a controller connected to each ultrasonic sensor and configured to compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave from each ultrasonic sensor.Type: GrantFiled: February 19, 2014Date of Patent: June 20, 2017Assignee: International Business Machines CorporationInventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
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Publication number: 20170148754Abstract: Various embodiments include methods of forming interconnect structures, and the structures formed by such methods. In one embodiment, an interconnect structure can include: a photosensitive polyimide (PSPI) layer including a pedestal portion; a controlled collapse chip connection (C4) bump overlying the pedestal portion of the PSPI layer; a solder overlying the C4 bump and contacting a side of the C4 bump; and an underfill layer abutting the pedestal portion of the PSPI and the C4 bump, wherein the underfill layer and the solder form a first interface separated from the PSPI pedestal.Type: ApplicationFiled: February 1, 2017Publication date: May 25, 2017Applicants: GLOBALFOUNDRIES INC., GLOBALFOUNDRIES INC.Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan