Abstract: An electrical test probe card is presented including a removable probe head assembly with alignment features, as well as a method for aligning the probe head assembly to the probe card. The probe head assembly is used to provide an electrical interface between an interface circuit and a semiconductor device under test. The probe head assembly includes a probe head body having a pair of opposed surfaces. A set of probe holes and a set of alignment holes extend between the opposed surfaces. Each probe hole is adapted to receive an electrically conductive probe, and each alignment hole is adapted to pass optical illumination used to align the probe head body with the interface circuit. The probe holes are arranged according to a first pattern defined by a set of electrical contacts on a surface of the device under test. A surface of the interface circuit includes a set of electrical contacts arranged according to the first pattern, and a set of alignment marks defining a second pattern.