Patents by Inventor Timothy Fleming
Timothy Fleming has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11751338Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: March 28, 2022Date of Patent: September 5, 2023Assignee: Vicor CorporationInventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 10791645Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: February 14, 2020Date of Patent: September 29, 2020Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 10757816Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area.Type: GrantFiled: June 17, 2016Date of Patent: August 25, 2020Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20200253060Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area.Type: ApplicationFiled: April 22, 2020Publication date: August 6, 2020Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D`Amico
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Patent number: 10701828Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: May 10, 2016Date of Patent: June 30, 2020Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 9516761Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: March 2, 2015Date of Patent: December 6, 2016Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20160302312Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area.Type: ApplicationFiled: June 17, 2016Publication date: October 13, 2016Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 9439297Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: March 2, 2015Date of Patent: September 6, 2016Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 9402319Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.Type: GrantFiled: May 11, 2012Date of Patent: July 26, 2016Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20150181727Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: ApplicationFiled: March 2, 2015Publication date: June 25, 2015Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20150181719Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: ApplicationFiled: March 2, 2015Publication date: June 25, 2015Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 8966747Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: GrantFiled: May 11, 2011Date of Patent: March 3, 2015Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. Lafleur, Sean Timothy Fleming, Rudolph Mutter, Andrew T. D'Amico
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Publication number: 20140355218Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.Type: ApplicationFiled: May 11, 2012Publication date: December 4, 2014Applicant: VLT, INC.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Publication number: 20120287582Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.Type: ApplicationFiled: May 11, 2011Publication date: November 15, 2012Inventors: Patrizio Vinciarelli, Michael B. Lafleur, Andrew T. D'Amico, Rudolph Mutter, Sean Timothy Fleming
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Publication number: 20060207492Abstract: Accessories for boats, and in particular folding inflatable boats, are described. The accessories may be installed and removed from the boats rapidly and easily, hence not impeding folding of the boats for transport or storage.Type: ApplicationFiled: December 9, 2005Publication date: September 21, 2006Inventor: Timothy Fleming
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Publication number: 20060159881Abstract: A new and improved contamination-control mat assembly which has a plurality of adhesive-coated sheets disposed upon the upper surface portion of the contamination-control mat assembly, and a new and improved polystyrene frame member, having an acrylic-rubber anti-slip backing member applied thereto, disposed upon the undersurface portion of the contamination-control mat assembly, wherein the polystyrene frame member and the acrylic-rubber anti-slip backing member are integrally affixed together by means of a coextrusion process.Type: ApplicationFiled: January 18, 2005Publication date: July 20, 2006Inventors: Timothy Fleming, Richard Schulze
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Publication number: 20050076820Abstract: Boats adapted for multiple purposes are detailed. Versions of the boats may have performance characteristics and equipment necessary to qualify as rescue boats while normally maintaining appearances appropriate for placement on, for example, yachts as tenders or similar boats. Covers or other transformative materials may be used to modify the appearances of the boats when needed as rescue craft.Type: ApplicationFiled: September 30, 2004Publication date: April 14, 2005Inventor: Timothy Fleming
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Patent number: 6860220Abstract: Watercraft flooring including both inflatable and non-inflatable elements is detailed. Such flooring may be designed to support substantial loads while maintaining its lightweight nature and contributing to its longitudinal and lateral rigidity. Some versions of the flooring have an inflatable core with slats positioned both above the upper surface of the core and below the lower surface of the core at regular intervals along its length. The slats extend laterally across substantially the width of the core, effectively sandwiching portions of the core between them.Type: GrantFiled: August 13, 2002Date of Patent: March 1, 2005Assignee: Zodiac Hurricane Technologies, Inc.Inventor: Timothy Fleming
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Publication number: 20050011429Abstract: Accessories for boats, and in particular folding inflatable boats, are described. The accessories may be installed and removed from the boats rapidly and easily, hence not impeding folding of the boats for transport or storage.Type: ApplicationFiled: July 14, 2003Publication date: January 20, 2005Inventor: Timothy Fleming
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Patent number: D977660Type: GrantFiled: May 11, 2021Date of Patent: February 7, 2023Inventors: Jenelle Zingg, Timothy Fleming