Patents by Inventor Timothy G. Stolt

Timothy G. Stolt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor
    Patent number: 11697888
    Abstract: Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: July 11, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Eric J. Bergman, Stuart Crane, Tricia A. Youngbull, Timothy G. Stolt
  • METHODS OF REDUCING OR ELIMINATING DEPOSITS AFTER ELECTROCHEMICAL PLATING IN AN ELECTROPLATING PROCESSOR
    Publication number: 20220282394
    Abstract: Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Eric J. Bergman, Stuart Crane, Tricia A. Youngbull, Timothy G. Stolt
  • Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor
    Patent number: 11371159
    Abstract: Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.
    Type: Grant
    Filed: June 22, 2019
    Date of Patent: June 28, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Eric J Bergman, Stuart Crane, Tricia A Youngbull, Timothy G Stolt
  • Cleaning components and methods in a plating system
    Patent number: 11241718
    Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: February 8, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Joseph Antony Jonathan, Kyle M. Hanson, Jason A. Rye, James E. Brown, Gregory J. Wilson, Eric J. Bergman, Tricia A. Youngbull, Timothy G. Stolt
  • METHODS OF REDUCING OR ELIMINATING DEPOSITS AFTER ELECTROCHEMICAL PLATING IN AN ELECTROPLATING PROCESSOR
    Publication number: 20200399779
    Abstract: Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.
    Type: Application
    Filed: June 22, 2019
    Publication date: December 24, 2020
    Inventors: Eric J. Bergman, Stuart Hunt Crane, Tricia A. Youngbull, Timothy G. Stolt