Abstract: Systems and methods for expanding an operating speed range of a high speed flight vehicle include providing an engine with an inlet air duct, and positioning a heat exchanger in the inlet air duct to cool at least a portion of duct air flow associated with an engine core. Additionally or alternatively, a nozzle assembly includes a cowl fluidly communicating with the engine and having a cowl internal surface defining a cowl orifice, and a plug defines a primary thrust surface. The plug is supported relative to the cowl so that a portion of the primary thrust surface is disposed within the cowl orifice to define a throat therebetween. An actuator is coupled to at least one of the cowl or the plug, and is configured to generate relative movement between the cowl and the plug, thereby to modify the throat.

Abstract: A nozzle wall for an air-breathing engine, the nozzle wall including a first wall surface subject to engine exhaust flow, a nozzle cooling system including at least one heat exchange fluid passage disposed adjacent the first wall surface so as to increase a temperature of a cooling fluid flowing from a fluid reservoir to at least a power extraction device, and the cooling fluid is ejected from the nozzle cooling system downstream from the power extraction device.

Abstract: A nozzle wall for an air-breathing engine, the nozzle wall including a first wall surface subject to engine exhaust flow, a nozzle cooling system including at least one heat exchange fluid passage disposed adjacent the first wall surface so as to increase a temperature of a cooling fluid flowing from a fluid reservoir to at least a power extraction device, and the cooling fluid is ejected from the nozzle cooling system downstream from the power extraction device.

Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells.