Patents by Inventor Timothy J. Fink
Timothy J. Fink has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11824336Abstract: An outdoor busway system includes one or more conductor sections and one or more electrical connectors such that a conductor section of the outdoor busway system comprises a housing assembly and a conductor set. The housing assembly includes an upper housing section and a lower housing section such that the upper housing section and the lower housing section each having opposing counterposed features to oppose a first separation force of the housing assembly. The conductor set includes a plurality of viscoelastic structural sheets stacked alternatively between a plurality of conductor bars to oppose a second separation force between conductor bars of the plurality of conductor bars.Type: GrantFiled: October 21, 2021Date of Patent: November 21, 2023Assignee: SIEMENS INDUSTRY, INC.Inventors: Steven E. Pever, Timothy J. Fink
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Publication number: 20230125946Abstract: An outdoor busway system includes one or more conductor sections and one or more electrical connectors such that a conductor section of the outdoor busway system comprises a housing assembly and a conductor set. The housing assembly includes an upper housing section and a lower housing section such that the upper housing section and the lower housing section each having opposing counterposed features to oppose a first separation force of the housing assembly. The conductor set includes a plurality of viscoelastic structural sheets stacked alternatively between a plurality of conductor bars to oppose a second separation force between conductor bars of the plurality of conductor bars.Type: ApplicationFiled: October 21, 2021Publication date: April 27, 2023Inventors: Steven E. Pever, Timothy J. Fink
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Patent number: 10714921Abstract: A busway tap off system is provided for connecting an electrical supply to a distribution device. The busway tap off system comprises a joint mounted tap box configured for making an electrical connection between an electrical busway and a power distribution system including a downstream panel. The joint mounted tap box is a dynamically mounted electrical equipment and the downstream panel is a rigidly mounted electrical equipment. The busway tap off system further comprises electrical cables that connect the two equipments. The busway tap off system further comprises a nipple accessory that provides a flexible mechanical and electrical connection between the dynamically mounted electrical equipment and the rigidly mounted electrical equipment. The nipple accessory is configured as a rigidly-constructed flexible fitting that includes two axial slides that enable the nipple accessory to move with the dynamically mounted electrical equipment yet remains fixed to the rigidly mounted electrical equipment.Type: GrantFiled: August 1, 2019Date of Patent: July 14, 2020Assignee: SIEMENS INDUSTRY, INC.Inventors: Steven E. Pever, Timothy J. Fink
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Patent number: 10290986Abstract: A multi-bolt joint stack for use in an electrical power distribution system. The joint stack includes (1) a plurality of conductive plate sets, each plate set including a first conductive plate and a second conductive plate separated by a first spacer and a second spacer; (2) a first clamping bolt extending through the plurality of conductive plate sets and the first spacer of each conductive plate set; and (3) a second clamping bolt extending through the plurality of conductive plate sets and the second spacer of each conductive plate set. The first and second clamping bolts are separated from each other to define a plurality of pockets within the joint stack, each pocket being formed by the first and second conductive plates and first and second spacers of the plurality of conductive plate sets. The pockets are configured to receive electrical stabs. Numerous other aspects are provided.Type: GrantFiled: September 29, 2017Date of Patent: May 14, 2019Assignee: SIEMENS INDUSTRY, INC.Inventors: Steven E. Pever, Timothy J. Fink
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Publication number: 20190103717Abstract: A multi-bolt joint stack for use in an electrical power distribution system. The joint stack includes (1) a plurality of conductive plate sets, each plate set including a first conductive plate and a second conductive plate separated by a first spacer and a second spacer; (2) a first clamping bolt extending through the plurality of conductive plate sets and the first spacer of each conductive plate set; and (3) a second clamping bolt extending through the plurality of conductive plate sets and the second spacer of each conductive plate set. The first and second clamping bolts are separated from each other to define a plurality of pockets within the joint stack, each pocket being formed by the first and second conductive plates and first and second spacers of the plurality of conductive plate sets. The pockets are configured to receive electrical stabs. Numerous other aspects are provided.Type: ApplicationFiled: September 29, 2017Publication date: April 4, 2019Inventors: Steven E. Pever, Timothy J. Fink
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Patent number: 9548546Abstract: A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.Type: GrantFiled: May 21, 2015Date of Patent: January 17, 2017Assignee: SIEMENS INDUSTRY, INC.Inventors: Steven Pever, Timothy J. Fink, Karthik Chandran Krishnamurthy, Raymond Jadin
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Publication number: 20150255887Abstract: A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.Type: ApplicationFiled: May 21, 2015Publication date: September 10, 2015Inventors: Steven Pever, Timothy J. Fink, Karthik Chandran Krishnamurthy, Raymond Jadin
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Patent number: 9042084Abstract: A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.Type: GrantFiled: December 7, 2012Date of Patent: May 26, 2015Assignee: Siemens Industry, Inc.Inventors: Steven E. Pever, Timothy J. Fink, Karthik Chandran Krishnamurthy, Raymond Jadin
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Publication number: 20140160638Abstract: A system is provided for a power distribution enclosure that includes an electronic circuit component. The system includes a conductive adapter having a head, and a circuit breaker base adapted for mounting to the power distribution enclosure. The circuit breaker base has an aperture adapted to receive the head of the conductive adapter. The head of the conductive adapter has a shape that substantially prevents rotation of the conductive adapter when the conductive adapter is inserted into the aperture. The conductive adapter is configured to draw away or absorb heat from the electronic circuit component and move the absorbed heat out of the power distribution enclosure. The circuit breaker base is adapted to substantially prevent heat from escaping from the conductive adapter into the power distribution enclosure. Numerous other aspects are provided.Type: ApplicationFiled: December 7, 2012Publication date: June 12, 2014Inventors: Steven E. Pever, Timothy J. Fink, Karthik Chandran Krishnamurthy, Raymond Jadin
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Patent number: 6467398Abstract: A method and apparatus for making bowl-shaped snack food products, e.g. tortilla chips. The method features placing chip preforms in open bowl-shaped cavities and partially frying the chip preforms by filling them with hot oil from above. Additionally, the preforms are partially fried from below by immersing the lower portions of the preforms in a vat of hot oil and transporting them through the hot oil. After cooking the preforms to a desired moisture content, at which point the preforms retain their bowl shapes outside of or independent of the mold cavities, the preforms are removed from the mold cavities and subsequently cooked to completion in a secondary frying operation. The invention also features an apparatus to carry out the method.Type: GrantFiled: September 10, 2001Date of Patent: October 22, 2002Assignee: Recot, Inc.Inventors: Timothy J. Fink, Ernest Marshall, Peris W. Njenga, James L. Sanford, James W. Stalder, Kevin Trick
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Publication number: 20020108501Abstract: A method and apparatus for making bowl-shaped snack food products, e.g. tortilla chips. The method features placing chip preforms in open bowl-shaped cavities and partially frying the chip preforms by filling them with hot oil from above. Additionally, the preforms are partially fried from below by immersing the lower portions of the preforms in a vat of hot oil and transporting them through the hot oil. After cooking the preforms to a desired moisture content, at which point the preforms retain their bowl shapes outside of or independent of the mold cavities, the preforms are removed from the mold cavities and subsequently cooked to completion in a secondary frying operation. The invention also features an apparatus to carry out the method.Type: ApplicationFiled: September 10, 2001Publication date: August 15, 2002Inventors: Timothy J. Fink, Ernest Marshall, Peris W. Njenga, James L. Sanford, James W. Stalder, Kevin Trick
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Patent number: 6129939Abstract: A method for making bowl-shaped snack food products, e.g. tortilla chips. The method features placing chip preforms in open bowl-shaped cavities and partially frying the chip preforms by filling them with hot oil from above. Additionally, the preforms are partially fried from below by immersing the lower portions of the preforms in a vat of hot oil and transporting them through the hot oil. After cooking the preforms to a desired moisture content, at which point the preforms retain their bowl shapes outside of or independent of the mold cavities, the preforms are removed from the mold cavities and subsequently cooked to completion in a secondary frying operation.Type: GrantFiled: August 17, 1998Date of Patent: October 10, 2000Assignee: Recot, Inc.Inventors: Timothy J. Fink, Ernest Marshall, Peris W. Njenga, James L. Sanford