Abstract: Embodiments relate to detector imaging arrays with highly robust mounting of scintillators (e.g., scintillating phosphor screens) to imaging arrays. For example, the detector arrays comprise spacers to define a space between or separate the scintillator from the imaging array. Embodiments according to present teachings can provide projection radiographic imaging apparatuses, including a scintillator, an imaging array including a plurality of pixels formed over a substrate, and a plurality of spacers disposed between an active surface of the imaging array and the scintillator. The spacers can reduce or prevent contact between a surface of the scintillator and the active surface of the imaging array, strengthen or control attachment therebetween, or adjust light transmittance therebetween.

Abstract: Embodiments relate to detector imaging arrays with scintillators (e.g., scintillating phosphor screens) mounted to imaging arrays. For example, the detector arrays comprise spacers to define a space between or separate the scintillator from the imaging array and a component of the imaging array is formed over the spacers. Embodiments according to present teachings can provide projection radiographic imaging apparatuses and methods including increased fill factors. Embodiments according to present teachings can provide projection radiographic imaging apparatuses, including a scintillator, an imaging array including a plurality of pixels formed over a substrate, and a plurality of spacers disposed between an active surface of the imaging array and the scintillator, where a component of the imaging array is over at least one of the spacers. The spacers can adjust light transmittance between the imaging array and the scintillator.

Abstract: An imaging array has a plurality of pixel sites (22), each having a photosensing element (24) providing a variable signal in response to incident radiation. A first frame storage circuit (46a) is electrically coupled to the photosensing element and has a first charge storage element for storing a first photosensing element signal and a first switching element (26) to switch the photosensing element to the first frame storage circuit. A second switching element (26) switches the first charge storage element (32) for reading the signal stored. A second frame storage circuit (46b) is electrically coupled to the photosensing element and has a second charge storage element for storing a second signal. A third switching element (26) switches the photosensing element to the second frame storage circuit. A fourth switching element (26) switches the second charge storage element for reading the signal stored.

Abstract: There is described a method of manufacturing a digital radiography panel. The method includes providing a scintillator screen and spray coating an acrylic adhesive composition on the scintillator screen. A flat panel detector and the scintillator screen with acrylic adhesive composition are compressed together at a force of about 5 psi to about 15 psi, at an atmospheric pressure of about 0.3 Torr to about 100.0 Torr for a time sufficient to affix the flat panel detector to the scintillator screen to form the digital radiography panel.

Abstract: Embodiments relate to detector imaging arrays with scintillators (e.g., scintillating phosphor screens) mounted to imaging arrays or radiographic detectors using the same. For example, the detector imaging arrays can include a scintillator, an imaging array comprising imaging pixels, where each imaging pixel comprises at least one readout element and one photosensor; and a first dielectric layer formed between the scintillator and the imaging layer, wherein the dielectric constant of the insulating layer is very low. Embodiments according to the application can include a second dielectric layer formed over at least a portion of the non-photosensitive regions of the array and/or a first dielectric layer, each with a dielectric constant.

Abstract: Described is a scintillator screen that includes a supporting layer having a phosphor dispersed in a polymeric binder disposed on the supporting layer and a barrier layer disposed on the polymeric binder. The barrier layer includes a non-moisture absorbing polymer selected from the group consisting of polyethylene terephthalate, cellulose diacetate, ethylene vinyl acetate and polyvinyl butyraldehyde. The barrier layer has a thickness of less than 1 micron. An antistatic layer is disposed on the barrier layer. The antistatic layer includes poly(3,4-ethylenedixythiophene)-poly(styrene sulfonate) (PEDOT/PSS) dispersed in a polymer selected from the group consisting of a polyester and a polyurethane. The antistatic layer has a transparency of greater than 95 percent at a wavelength of from about 400 nm to 600 nm.

Abstract: Embodiments of methods/apparatus can transition a DR detector imaging array to low power photosensor mode where a first voltage is applied across the photosensors. Embodiments of methods/apparatus can provide an area radiographic imaging array including a plurality of pixels arranged in a matrix at the imaging array where each pixel can include at least one electrically chargeable photosensor and at least one transistor, row address circuits, signal sensing circuits, and photosensor power control circuitry to maintain a first voltage across photosensors of the portion of the imaging array when the detector is between imaging operations. In one embodiment, photosensor power control circuitry can maintain the first voltage across the photosensors when a power consumption of the signal sensing circuits is less than 1% of the power consumption of the signal sensing circuits during readout of a signal from the portion of the imaging array.

Abstract: Embodiments of radiographic imaging systems; digital radiography detectors and methods for using the same can include radiographic imaging pixel unit cells that can include a plurality of N pixel elements that each include a photoelectric thin-film conversion element connected in-series to a conversion thin-film switching element, a conductor connected to the plurality of N pixel elements and an output switching element connected between the conductor and an imaging array output. Scan lines or row lines can extend in a first direction coupled to more than one pixel unit cell and data lines or column lines can extend in a second direction coupled to more than one pixel unit cell.

Abstract: A method embodiment for forming an imaging array includes providing a glass substrate having a top surface, forming a patterned conductive layer on the top surface of the glass substrate, and forming an insulating layer on the patterned conductive layer on a side of the patterned conductive layer opposite the glass substrate. The method can include providing a single crystal silicon substrate having an internal separation layer proximate a first surface of the single crystal silicon substrate. The single crystal silicon substrate is secured to the glass substrate such that the first surface of the single crystal silicon substrate corresponds to the insulating layer. The single crystal silicon substrate is separated at the internal separation layer to create an exposed surface opposite the first surface of the single crystal silicon substrate and an array including one or more photosensitive elements and/or readout elements is formed thereon.

Abstract: Exemplary embodiments provide a radiographic array, flat detector panel and/or X-ray imaging apparatus including the same and/or methods for using the same or calibrating the same. Exemplary embodiments can reduce or address noise occurring in the optically sensitive pixels that is temporally not related to image data detected by the optically sensitive pixels or dark reference frames detected by the optically sensitive pixels. Exemplary embodiments can include a capacitive element in a calibration pixel coupled between a row conductive line and a column conductive line in an imaging array.

Abstract: Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and scalably embedding or seating IC elements onto/into a receiving substrate, such as a chip substrate. Preparing of the chip substrate can be performed by depositing or patterning an activatable thermal barrier material on a surface of the substrate. The IC chips are secured on the prepared substrate by activating the thermal barrier material between the chip substrate and IC chips. Securing can include softening of the chip substrate with the activated thermal barrier material to an amount suitable for embedding the IC chips. Securing can also include adhesively bonding the IC chips to the substrate with the activated thermal barrier material in the case of a non-pliable substrate.

Abstract: Embodiments of radiographic imaging systems; digital radiography detectors and methods for using the same can monitor and/or control trap occupancy levels in photosensors of radiographic sensors (e.g., DR FPDs). In exemplary radiographic imaging apparatus embodiments, monitoring of trap occupancy or change in trap occupancy of the photosensor can determine whether an imaging array or detector panel has reached a stable operating point. In another embodiment, trap occupancy information can be used (a) to enable a generator (e.g., x-ray source) for a radiographic exposure and/or (b) to adjust to or to maintain a change in trap occupancy level at pre-determined set-point or to adjust to or maintain a change in trap occupancy level within a prescribed range (e.g., using clock signals and bias voltages applied to the photosensor).

Abstract: A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material and has a metallic coating on one surface. A portion of the metallic coating is etched to form a patterned metallic coating. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).

Abstract: A vertically-integrated image sensor is proposed with the performance characteristics of single crystal silicon but with the area coverage and cost of arrays fabricated on glass. The image sensor can include a backplane array having readout elements implemented in silicon-on-glass, a frontplane array of photosensitive elements vertically integrated above the backplane, and an interconnect layer disposed between the backplane array and the image sensing array. Since large area silicon-on-glass backplanes are formed by tiling thin single-crystal silicon layers cleaved from a thick silicon wafer side-by-side on large area glass gaps between the tiled silicon backplane would normally result in gaps in the image captured by the array. Therefore, embodiments further propose that the pixel pitch in both horizontal and vertical directions of the frontplane be larger than the pixel pitch of the backplane, with the pixel pitch difference being sufficient that the frontplane bridges the gap between backplane tiles.

Abstract: Embodiments of methods/apparatus according to the application can include radiographic imaging device comprising an imaging array of pixels or a plurality of photosensors including a first side to receive light from a scintillator and a second side to pass second light responsive to impingement of the scintillator light and a reflective layer configured to reflect third light responsive to impingement of the second light. Exemplary photosensors can absorb a prescribed amount of the scintillator light received through a first transparent side and the third light received through a second transparent side. Exemplary reflective arrangements can be selected based upon scintillotor emission characteristics and/or photosensor absorption characteristics. Embodiments of radiographic detector arrays and methods can reduce photosensor thickness to reduce noise, reduce image lag and/or increase charge capacity. Embodiments can maintain the quantum efficiency of a reduced thickness photosensor.

Abstract: Embodiments relate to detector imaging arrays with scintillators (e.g., scintillating phosphor screens) mounted to imaging arrays. For example, the detector arrays comprise spacers to define a space between or separate the scintillator from the imaging array and a component of the imaging array is formed over the spacers. Embodiments according to present teachings can provide projection radiographic imaging apparatuses and methods including increased fill factors. Embodiments according to present teachings can provide projection radiographic imaging apparatuses, including a scintillator, an imaging array including a plurality of pixels formed over a substrate, and a plurality of spacers disposed between an active surface of the imaging array and the scintillator, where a component of the imaging array is over at least one of the spacers. The spacers can adjust light transmittance between the imaging array and the scintillator.

Abstract: Embodiments of methods and apparatus are disclosed for obtaining an imaging array or a digital radiographic system including a plurality of pixels where at least one pixel can include a scan line, a bias line, a switching element including a first terminal, a second terminal, and a control electrode where the control electrode is electrically coupled to the scan line; and a photoelectric conversion element including a first terminal electrically coupled to the bias line and a second terminal electrically coupled to the first terminal of the switching element, and a signal storage element formed in the same layers as the scan line, bias line, the data line, the switching element and the photoelectric conversion element. An area of one terminal of the signal storage element can be larger than a surface area of the pixel.

Abstract: Embodiments relate to detector imaging arrays with highly robust mounting of scintillators (e.g., scintillating phosphor screens) to imaging arrays. For example, the detector arrays comprise spacers to define a space between or separate the scintillator from the imaging array. Embodiments according to present teachings can provide projection radiographic imaging apparatuses, including a scintillator, an imaging array including a plurality of pixels formed over a substrate, and a plurality of spacers disposed between an active surface of the imaging array and the scintillator. The spacers can reduce or prevent contact between a surface of the scintillator and the active surface of the imaging array, strengthen or control attachment therebetween, or adjust light transmittance therebetween.

Abstract: A vertically-integrated image sensor is proposed with the performance characteristics of single crystal silicon but with the area coverage and cost of arrays fabricated on glass. The image sensor can include a backplane array having readout elements implemented in silicon-on-glass, a frontplane array of photosensitive elements vertically integrated above the backplane, and an interconnect layer disposed between the backplane array and the image sensing array. Since large area silicon-on-glass backplanes are formed by tiling thin single-crystal silicon layers cleaved from a thick silicon wafer side-by-side on large area glass gaps between the tiled silicon backplane would normally result in gaps in the image captured by the array. Therefore, embodiments further propose that the pixel pitch in both horizontal and vertical directions of the frontplane be larger than the pixel pitch of the backplane, with the pixel pitch difference being sufficient that the frontplane bridges the gap between backplane tiles.

Abstract: A method of forming an electronic device on a metal substrate deposits a first seed layer of a first metal on at least one master surface with a roughness less than 400 nm. A supporting metal layer is bonded to the first seed layer to form the metal substrate 10. The metal substrate is removed from the master surface, and at least one electronic device is formed on the seed layer of the metal substrate.