Abstract: A method for forming an electronic device provides a carrier formed from a composite material comprising a plastic binder and an embedded material. A substrate material is attached to the carrier. The substrate is processed to form the electronic device thereon. The substrate is then detached from the carrier to yield the resultant electronic device.

Abstract: A method for forming an electronic circuit disposes a plurality of magnets onto a flux plate to form a magnetic platen. A substrate package is formed using the magnetic platen and, stacked against the magnetic platen, a non-magnetic carrier and a substrate layer, with a bonding material sandwiched between the carrier and the substrate layer, and with the carrier layer disposed nearest the magnetic platen. A fused wafer stack is formed by heating the substrate package to adhere the substrate layer to the carrier. The fused wafer stack is removed from the magnetic platen and the circuit fabricated on the substrate layer.

Abstract: A method for forming an electronic circuit disposes a plurality of magnets onto a flux plate to form a magnetic platen. A substrate package is formed using the magnetic platen and, stacked against the magnetic platen, a non-magnetic carrier and a substrate layer, with a bonding material sandwiched between the carrier and the substrate layer, and with the carrier layer disposed nearest the magnetic platen. A fused wafer stack is formed by heating the substrate package to adhere the substrate layer to the carrier. The fused wafer stack is removed from the magnetic platen and the circuit fabricated on the substrate layer.

Abstract: A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface.

Abstract: A method for forming an electronic device provides a casting master having a casting surface, and deposits a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface. The flexible substrate sheet is released from the master and secured against a carrier, with the circuit-side surface facing outward. An electronic device is then formed on the circuit-side surface.

Abstract: A method for forming an electronic device on a flexible substrate conditions the surface of a carrier to form a holding area for retaining the flexible substrate. A contact surface of the flexible substrate is applied against the carrier with an intermediate binding material applied between at least the holding area of the carrier and the corresponding area of the contact surface. Entrapped gas between the flexible substrate and the carrier is removed and the substrate processed to form the electronic device thereon. The substrate can then be removed from the holding area to yield the resultant electronic device.

Abstract: A method for forming an electronic device provides a metallic carrier having a retaining surface and secures a contact surface of a metallic substrate material against the retaining surface of the metallic carrier. The substrate is processed to form the electronic device thereon; and the metallic substrate material released from the metallic carrier, to yield the completed electronic device.

Abstract: A method for forming an electronic device provides a carrier formed from a composite material comprising a plastic binder and an embedded material. A substrate material is attached to the carrier. The substrate is processed to form the electronic device thereon. The substrate is then detached from the carrier to yield the resultant electronic device.

Abstract: A radiographic imaging device has a first scintillating phosphor screen having a first thickness and a second scintillating phosphor screen having a second thickness. A transparent substrate is disposed between the first and second screens. An imaging array formed on a side of the substrate includes multiple photosensors and an array of readout elements.

Abstract: A radiographic imaging device has a first scintillating phosphor screen having a first thickness and a second scintillating phosphor screen having a second thickness. A transparent substrate is disposed between the first and second screens. An imaging array formed on a side of the substrate includes multiple photosensors and an array of readout elements.