Abstract: A method and system for identifying and reducing costs of information technology actions in real time. Initiation of an information technology (IT) action by a user is detected. An actual cost to perform the IT action is determined in real time prior to a completion of the IT action. A target cost (e.g., average cost) to perform the IT action is obtained. The actual cost is determined to be greater than the target cost. Recommended actions for reducing the actual cost are obtained. A notification is presented to the user in real time and prior to the completion of the IT action. The notification includes a description or a link to a description of the recommended actions.

Abstract: A method and system for identifying and reducing costs of information technology actions in real time. Initiation of an information technology (IT) action by a user is detected. An actual cost to perform the IT action is determined in real time prior to a completion of the IT action. A target cost (e.g., average cost) to perform the IT action is obtained. The actual cost is determined to be greater than the target cost. Recommended actions for reducing the actual cost are obtained. A notification is presented to the user in real time and prior to the completion of the IT action. The notification includes a description or a link to a description of the recommended actions.

Abstract: In accordance with a preferred embodiment of the present invention, an orientation independent evaporator includes a wicking member which also operates as a manifold which possesses a number of surface accessible channels preferably via grooves cut in either side of a slab of wicking material at right angles to one another. The evaporator is, because of the structure of this wicking member, able to be operated in any orientation with respect to a gravitational field. The invention provides an improved evaporator for use in thermosyphons, and in particular, provides an improved mechanism for cooling electronic components.

Abstract: A heat sink is provided for use with stacks of integrated circuit chips. The heat sink comprises a thermally conductive body having a recess in which the chip stack is disposed. The heat sink also includes fins which extend away from the recess. In one embodiment, fins are provided inside the recess for improved cooling of higher power chips such as a microprocessor which is surrounded by less thermally demanding memory chips.

Abstract: A parallel plate heat sink, used in conjunction with an air moving device which provides an annular flow of air against the heat sink, is further provided with enhanced flow deflector means which selectively block potential exhaust paths so as to redirect the flow of air to the region under a central hub of the fan. This transforms otherwise stagnant air volume in the center of the heat sink into a primary cooling region thus lowering conduction losses and electronic component junction temperatures. Redirection of air flow includes passages within end fins which enhance capacity by improving the exiting flow.