Patents by Inventor Timothy P Johns
Timothy P Johns has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10016762Abstract: A bowl mill for producing coarse ground particles has a substantially closed body, a bowl assembly, a plurality of grinding rolls, and a coarse particle transport enabling area. The substantially closed body has an interior area. The bowl assembly includes a rotatable grinding table mounted for rotation in a direction of rotation in the interior area. The grinding table has a grinding surface thereon. The plurality of grinding rolls are positioned proximate the grinding surface. The grinding rolls and the grinding surface define a grinding area therebetween. The coarse particle transport enabling area is located radially outward from the grinding area. The coarse particle transport enabling area is configured to allow the coarse particles to freely exit the grinding area and to mitigate the coarse particles from being circulated back into the grinding area.Type: GrantFiled: June 16, 2015Date of Patent: July 10, 2018Assignee: Arvos Raymond Bartlett Snow LLCInventors: Michael M. Chen, Jianrong Chen, Timothy P. Johns
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Publication number: 20160367997Abstract: A bowl mill for producing coarse ground particles has a substantially closed body, a bowl assembly, a plurality of grinding rolls, and a coarse particle transport enabling area. The substantially closed body has an interior area. The bowl assembly includes a rotatable grinding table mounted for rotation in a direction of rotation in the interior area. The grinding table has a grinding surface thereon. The plurality of grinding rolls are positioned proximate the grinding surface. The grinding rolls and the grinding surface define a grinding area therebetween. The coarse particle transport enabling area is located radially outward from the grinding area. The coarse particle transport enabling area is configured to allow the coarse particles to freely exit the grinding area and to mitigate the coarse particles from being circulated back into the grinding area.Type: ApplicationFiled: June 16, 2015Publication date: December 22, 2016Applicant: ARVOS Inc.Inventors: Michael M. Chen, Jianrong Chen, Timothy P. Johns
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Patent number: 8741009Abstract: The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system.Type: GrantFiled: July 29, 2009Date of Patent: June 3, 2014Assignee: Cabot Microelectronics CorporationInventors: Jeffrey M. Dysard, Paul M. Feeney, Sriram P. Anjur, Timothy P. Johns, Yun-Biao Xin, Li Wang
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Patent number: 8486169Abstract: A chemical-mechanical polishing system comprising: (a) ceria abrasive having an average particle size of about 180 nm or less and a positive zeta potential, (b) a polishing additive bearing a functional group with a pKa of about 3 to about 9, wherein the polishing additive is selected from the group consisting of arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, aminocarboxylic acids, cyclic monocarboxylic acids, unsaturated monocarboxylic acids, substituted phenols, sulfonamides, thiols, salts thereof, and combinations thereof, and (c) a liquid carrier, wherein the chemical-mechanical polishing system has a pH of about 4 to about 6.Type: GrantFiled: September 26, 2008Date of Patent: July 16, 2013Assignee: Cabot Microelectronics CorporationInventors: Phillip W. Carter, Timothy P. Johns
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Patent number: 8138091Abstract: The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, an inorganic halide salt, and an aqueous carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition exhibits selectivity for removal of silicon nitride over removal of silicon oxide and polysilicon.Type: GrantFiled: April 2, 2009Date of Patent: March 20, 2012Assignee: Cabot Microelectronics CorporationInventors: Jeffrey M. Dysard, Timothy P. Johns
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Patent number: 7677956Abstract: The invention is directed to a chemical-mechanical polishing composition comprising (a) an abrasive consisting essentially of aggregated silica, (b) an acid, and (c) a liquid carrier, wherein the polishing composition has a pH of about 5 or less. The invention is also directed to a method of polishing a substrate comprising a dielectric layer using the polishing composition.Type: GrantFiled: May 10, 2002Date of Patent: March 16, 2010Assignee: Cabot Microelectronics CorporationInventors: Phillip Carter, Gregory H Bogush, Farhana Khan, Timothy P Johns, Robert Vacassy
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Publication number: 20090289033Abstract: The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system.Type: ApplicationFiled: July 29, 2009Publication date: November 26, 2009Inventors: Jeffrey M. Dysard, Paul M. Feeney, Sriram P. Anjur, Timothy P. Johns, Yun-Biao Xin, Li Wang
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Patent number: 7585340Abstract: The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, and a polyether amine. The inventive method comprises chemically-mechanically polishing a substrate with the aforementioned polishing system.Type: GrantFiled: April 27, 2006Date of Patent: September 8, 2009Assignee: Cabot Microelectronics CorporationInventors: Jeffrey M. Dysard, Paul M. Feeney, Sriram P. Anjur, Timothy P. Johns, Yun-Biao Xin, Li Wang
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Publication number: 20090215271Abstract: The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, an inorganic halide salt, and an aqueous carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition exhibits selectivity for removal of silicon nitride over removal of silicon oxide and polysilicon.Type: ApplicationFiled: April 2, 2009Publication date: August 27, 2009Inventors: Jeffrey M. Dysard, Timothy P. Johns
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Publication number: 20090137124Abstract: The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, a carboxylic acid, and water. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition exhibits selectivity for removal of silicon nitride over removal of silicon oxide.Type: ApplicationFiled: February 2, 2009Publication date: May 28, 2009Applicant: Cabot Microelectronics CorporationInventors: Phillip W. Carter, Timothy P. Johns
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Patent number: 7531105Abstract: The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, an inorganic halide salt, and an aqueous carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition exhibits selectivity for removal of silicon nitride over removal of silicon oxide and polysilicon.Type: GrantFiled: December 6, 2005Date of Patent: May 12, 2009Assignee: Cabot Microelectronics CorporationInventors: Jeffrey M. Dysard, Timothy P. Johns
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Patent number: 7504044Abstract: The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, a carboxylic acid, and water. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition exhibits selectivity for removal of silicon nitride over removal of silicon oxide.Type: GrantFiled: November 5, 2004Date of Patent: March 17, 2009Assignee: Cabot Microelectronics CorporationInventors: Phillip W. Carter, Timothy P. Johns
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Publication number: 20090029633Abstract: A chemical-mechanical polishing system comprising: (a) ceria abrasive having an average particle size of about 180 nm or less and a positive zeta potential, (b) a polishing additive bearing a functional group with a pKa of about 3 to about 9, wherein the polishing additive is selected from the group consisting of arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, aminocarboxylic acids, cyclic monocarboxylic acids, unsaturated monocarboxylic acids, substituted phenols, sulfonamides, thiols, salts thereof, and combinations thereof, and (c) a liquid carrier, wherein the chemical-mechanical polishing system has a pH of about 4 to about 6.Type: ApplicationFiled: September 26, 2008Publication date: January 29, 2009Applicant: Cabot Microelectronics CorporationInventors: Phillip W. Carter, Timothy P. Johns
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Patent number: 7442645Abstract: The inventive method of polishing a silicon-containing dielectric layer involves the use of a chemical-mechanical polishing system comprising (a) an inorganic abrasive, (b) a polishing additive, and (c) a liquid carrier, wherein the polishing composition has a pH of about 4 to about 6. The inventive chemical-mechanical polishing system comprises (a) ceria, (b) a polishing additive, and (c) a liquid carrier, wherein the polishing system has a pH of about 4 to about 6.Type: GrantFiled: February 2, 2004Date of Patent: October 28, 2008Assignee: Cabot Microelectronics CorporationInventors: Phillip W. Carter, Timothy P. Johns
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Patent number: 7071105Abstract: The invention is directed to a method of polishing a silicon-containing dielectric layer involving the use of a chemical-mechanical polishing system comprising (a) an inorganic abrasive, (b) a polishing additive, and (c) a liquid carrier, wherein the polishing composition has a pH of about 4 to about 6. The polishing additive comprises a functional group having a pKa of about 4 to about 9 and is selected from the group consisting of arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, aminocarboxylic acids, cyclic monocarboxylic acids, unsaturated monocarboxylic acids, substituted phenols, sulfonamides, thiols, salts thereof, and combinations thereof. The invention is further directed to the chemical-mechanical polishing system, wherein the inorganic abrasive is ceria.Type: GrantFiled: February 3, 2003Date of Patent: July 4, 2006Assignee: Cabot Microelectronics CorporationInventors: Phillip W Carter, Timothy P Johns
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Publication number: 20040152309Abstract: The invention is directed to a method of polishing a silicon-containing dielectric layer involving the use of a chemical-mechanical polishing system comprising (a) an inorganic abrasive, (b) a polishing additive, and (c) a liquid carrier, wherein the polishing composition has a pH of about 4 to about 6. The polishing additive comprises a functional group having a pKa of about 4 to about 9 and is selected from the group consisting of arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, aminocarboxylic acids, cyclic monocarboxylic acids, unsaturated monocarboxylic acids, substituted phenols, sulfonamides, thiols, salts thereof, and combinations thereof. The invention is further directed to the chemical-mechanical polishing system, wherein the inorganic abrasive is ceria.Type: ApplicationFiled: February 3, 2003Publication date: August 5, 2004Applicant: Cabot Microelectronics CorporationInventors: Phillip W. Carter, Timothy P. Johns
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Publication number: 20030211815Abstract: The invention is directed to a chemical-mechanical polishing composition comprising (a) an abrasive consisting essentially of aggregated silica, (b) an acid, and (c) a liquid carrier, wherein the polishing composition has a pH of about 5 or less. The invention is also directed to a method of polishing a substrate comprising a dielectric layer using the polishing composition.Type: ApplicationFiled: May 10, 2002Publication date: November 13, 2003Applicant: Cabot Microelectronics CorporationInventors: Phillip Carter, Gregory H. Bogush, Farhana Khan, Timothy P. Johns, Robert Vacassy