Abstract: A ducted test socket for thermally testing a device under test (DUT) is provided that can accommodate a large DUT and will improve the thermal transfer efficiency between a precision temperature forcing system (PTFS) and the DUT. The ducted test socket comprises a carrier and a base with opposing, mated cavities and holes. These cavities and holes channel airflow around the entire DUT body and out outlet ports.

Abstract: A thermal head adapter for testing a device under test is provided that can accommodate a large device and will improve the airflow through the thermal head to the device under test and out into the shroud. The thermal head adapter comprises a first section with a first perimeter and a second section with a second perimeter. The shroud is sealed onto an upper surface of first section, and the base of the second section attaches to a printed board. The perimeter of the first section is greater than the perimeter of the second section. The upper surface of the first section may comprise ridges that effectively form a moat-like structure to capture fallen condensation from the shroud walls. A drain may take the liquid within the boundary of the ridges to a desired location outside of the thermal head adapter.

Abstract: A ducted test socket for thermally testing a device under test (DUT) is provided that can accommodate a large DUT and will improve the thermal transfer efficiency between a precision temperature forcing system (PTFS) and the DUT. The ducted test socket comprises a carrier and a base with opposing, mated cavities and holes. These cavities and holes channel airflow around the entire DUT body and out outlet ports.