Abstract: A power supply is disposed adjacent a first end of a chassis. The chassis comprises a z axis from the first end to a second end of the chassis and an x axis orthogonal to the z axis. A bay is disposed adjacent the first end of the chassis along the x axis from the power supply. The bay comprises at least one storage device. A chamber is disposed adjacent the first end of the chassis adjacent the bay along the x axis between the bay and the power supply. A first baffle is disposed offset from the power supply, the bay, and the chamber along the z axis toward the second end. The first baffle forms a first section and isolates a first airflow in the first section from a second airflow.

Abstract: An apparatus, system, and method are disclosed for routing a power cable assembly. A motherboard is disposed in a chassis. A power cable assembly is routed parallel to a plane of the motherboard and comprises a plurality of power cables. Each power cable is in physical and electrical communication with a power supply. The power cable assembly is organized in a 1×n array, wherein n is a positive integer greater than five and the power cable assembly is in electrical communication with the motherboard.

Abstract: An apparatus includes a lever arm that couples to a pivot point on one end and a display on the other end. The lever arm rotates around the pivot point through a lever arm range of motion, and the weight of the display produces a display torque around the pivot point that varies as the lever arm rotates through the lever arm range of motion. The apparatus also includes a spring that couples to the lever arm using a cable. The spring produces, through the lever arm, a spring torque around the pivot point that is equally opposite of the display torque throughout the lever arm range of motion.

Abstract: The problems of prior compressor structures relying upon conventional check valves are obviated by using, instead, flow control passages which operate to control flow while avoiding mechanical moving elements which may become problematical.

Abstract: An assisted heat pipe comprises an evaporator section, a condenser section, and a blower. The evaporator section converts a fluid from a liquid form to a vapor form, and the condenser section converts the fluid from a vapor form to back to a liquid form. The blower is encapsulated within the assisted heat pipe and resides between the evaporator section and the condenser section. The blower rotates and assists the vapor to travel from the evaporator section to the condenser section.

Abstract: Option cards—one or more as may be installed in a particular computer system—are retained in position against possibly dislodgement due to handling by a frame and cooperating cross bar and depending member elements which may be variously positioned relative to the frame.

Abstract: A self contained cooling system which is amenable to miniaturization so as to accommodate space and connectivity restrictions implicit in computer and other electronics apparatus while enhancing heat transfer. In use, the cooling systems of this invention use compression/expansion cycles of a refrigerant material to move thermal energy from one location to another. The compressor, condenser, and evaporator are all contained within a volume consistent with mounting directly on a semiconductor device such as a processor.

Abstract: Apparatus, methods, and systems are disclosed for a power supply adapted to receive power from an outlet, the power input having a property, such as amperage, frequency or voltage. An indicator is provided on the connector to the power cord to indicate a value for the property to the power supply, wherein the power supply adapts to the value for the property. By providing an indication of the property the system is capable of reducing functionality to meet the capabilities of the power supply. A power cord may be provided with a male plug at one end capable of being inserted into a socket with a minimum value for a property, and the other end of the power cord may have a connector with an indicator to identify the minimum value for the power cord.

Abstract: Option cards—one or more as may be installed in a particular computer system—are retained in position against possibly dislodgement due to handling by a frame and cooperating cross bar and depending member elements which may be variously positioned relative to the frame.

Abstract: An apparatus, system, and method are disclosed for efficient heat dissipation. The apparatus for efficient heat dissipation is provided with a compliant heat pipe configured to conform to adjacent surfaces under a compressive load, a compression member configured to apply the compressive load to the compliant heat pipe, and wherein the compliant heat pipe conforms to the surface of the compression member and the surface of a heat source under the compressive load. Beneficially, such an apparatus, system, and method would provide efficient heat dissipation through effective thermo-coupling between the heat source and the heat pipe. Additionally, the apparatus, system, and method would facilitate the application of a load to thermal grease for further improvements on thermo-coupling between the heat source and the heat pipe.

Abstract: A self contained cooling system which is amenable to miniaturization so as to accommodate space and connectivity restrictions implicit in computer and other electronic apparatus while enhancing heat transfer. In use, the cooling systems of this invention use compression/expansion cycles of a refrigerant material to move thermal energy from one location to another. The compressor, condenser, and evaporator are all contained within a volume consistent with mounting directly on a semiconductor device such as a processor.

Abstract: A new type of device, useful as a fan among other applications, in which fluid flow is induced by providing within the device a chamber of constantly increasing volume and a chamber of constantly decreasing volume. Fluid moves through these chambers impelled by the rotation of a pair of members linked together for rotation about skewed axes. The members move within a chamber having a spherical surface, into which open ports for inward and outward fluid flow. The device may be used to assist in cooling components of an electronic system such as a computer system.

Abstract: A method is disclosed for thermal conduction interfacing. The method for thermal conduction interfacing includes providing with a first layer formed substantially of a pliable thermally conductive material. The method includes coupling a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the method includes inserting a plurality of thermally conductive particles within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such a method would provide effective thermal coupling between a heat generating device and a heat dissipating device.

Abstract: A system is disclosed for thermal conduction interfacing. The system for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The system includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the system includes a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such a system would provide effective thermal coupling between a heat generating device and a heat dissipating device. Additionally, the system would be modular, reusable, and easy to install or replace without a significant mess.

Abstract: The problems of prior compressor structures relying upon conventional check valves are obviated by using, instead, flow control passages which operate to control flow while avoiding mechanical moving elements which may become problematical.

Abstract: A new type of device, useful as a fan among other applications, in which fluid flow is induced by providing within the device a chamber of constantly increasing volume and a chamber of constantly decreasing volume. Fluid moves through these chambers impelled by the rotation of a pair of members linked together for rotation about skewed axes. The members move within a chamber having a spherical surface, into which open ports for inward and outward fluid flow.

Abstract: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.

Abstract: A thin metallic sheet having an array of alternating domes, directed away from opposite sides of the sheet, to bridge a gap between a top surface of a processor package and a bottom surface of a heat sink. The sheet is positioned between the processor package and heat sink before securing the heat sink to the processor package. By pressing the processor package and heat sink together, the tops of the domes flatten out to maximize surface contact between a first side of the sheet and the top of the processor package, and between a second side of the sheet and the top of the heat sink.

Abstract: A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.

Abstract: A heat removal system for a computer has a heat sink and a spool rotatably disposed in the heat sink. The spool includes fluid inlets and outlets, and water circulates in a closed loop from the inlets, through the spool, through the outlets, past the computer component to be cooled, and between the heat sink and the spool to transfer heat to the heat sink, then back to the inlets. A thermally conductive can is between the heat sink and spool such that the working fluid flows between the can and spool.