Patents by Inventor Timothy Singler

Timothy Singler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless copper plating polydopamine nanoparticles
    Patent number: 10760162
    Abstract: Aqueous dispersions of artificially synthesized, mussel-inspired polydopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 ?m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: September 1, 2020
    Assignee: The Research Foundation for The State University of New York
    Inventors: Siyuan Ma, Liang Liu, Vadim Bromberg, Timothy Singler
  • ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES
    Publication number: 20200157684
    Abstract: Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 ?m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.
    Type: Application
    Filed: May 16, 2019
    Publication date: May 21, 2020
    Inventors: Siyuan Ma, Liang Liu, Vadim Bromberg, Timothy Singler
  • Electroless copper plating polydopamine nanoparticles
    Patent number: 10294567
    Abstract: Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 ?m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: May 21, 2019
    Assignee: The Research Foundation for the State University of New York
    Inventors: Siyuan Ma, Liang Liu, Vadim Bromberg, Timothy Singler
  • ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES
    Publication number: 20160168715
    Abstract: Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 ?m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.
    Type: Application
    Filed: December 10, 2015
    Publication date: June 16, 2016
    Inventors: Siyuan Ma, Liang Liu, Vadim Bromberg, Timothy Singler