Patents by Inventor Timothy Y. Wang

Timothy Y. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Robot blade for semiconductor processing equipment
    Patent number: 6709218
    Abstract: The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: March 23, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Frederik W. Freerks, Tetsuya Ishikawa, Timothy Y. Wang, Jeffrey C. Hudgens, James R. Ciulik, Mohsen Salek, Tim Leong, Al DiFrancesco