Abstract: One embodiment provides an electronic device, including: a device component; a pressure sensor integrated into a surface lining of the device component; and at least one adaptive gap-filling component situated between the surface lining of the device component and a wall of the electronic device that at least partially surrounds the device component. Other aspects are described and claimed.

Abstract: A system can include a housing; a hinge assembly operatively coupled to the housing for rotation of the housing about a hinge axis, where the hinge assembly includes permanent magnets that generate a first magnetic field and a second magnetic field orientable with respect to each other via rotation of the housing, where the first magnetic field and the second magnetic field include an aligned orientation, generate a clockwise restoring torque responsive to rotation of the housing in a first rotational direction from the aligned orientation, and generate a counterclockwise restoring torque responsive to rotation of the housing in a second, opposite rotational direction from the aligned orientation; and an electromagnetic mover operatively coupled to the housing for rotation of the housing about the hinge axis.

Abstract: A system can include a first housing that includes a processor and memory accessible to the processor; a second housing that includes a display operatively coupled to the processor; a hinge assembly that rotatably couples the first housing and the second housing, where the hinge assembly includes permanent magnets that generate a first magnetic field and a second magnetic field orientable with respect to each other via rotation of the second housing with respect to the first housing, where the first magnetic field and the second magnetic field include an aligned orientation, generate a clockwise restoring torque responsive to rotation in a first rotational direction from the aligned orientation, and generate a counterclockwise restoring torque responsive to rotation in a second, opposite rotational direction from the aligned orientation.

Abstract: Apparatuses, systems, devices, and methods for power management during system startup at low temperatures are disclosed. An apparatus includes a battery for an electronic device. The battery includes one or more cells. The apparatus includes a thermal insulation element configured to insulate heat that the battery. The thermal insulation element is coupled to the battery to prevent at least a portion of the heat that the battery generates from being dissipated from the battery during startup of the electronic device.

Abstract: Apparatuses, systems, devices, and methods for variable temperature heat exchange switch are disclosed. An apparatus includes a heat exchanger coupled to an electronic component to dissipate heat from the electronic component. The apparatus includes a heat pipe connected to the heat exchanger and configured to dissipate heat. An apparatus includes a thermal-activated switch located at the connection between the heat exchanger and the heat pipe. The thermal-activated switch may be configured to allow heat transfer from the heat exchanger to the heat pipe in response to a temperature satisfying a threshold temperature.

Abstract: One embodiment provides a method, including: receiving, at an information handling device, an indication to transmit an electrical pulse to an electropermanent magnet; transmitting, responsive to the receiving and using a pulse transmitter, the electrical pulse to the electropermanent magnet; and affecting a movement of a keyboard of the information handling device based on the received electrical pulse. Other aspects are described and claimed.

Abstract: One embodiment provides an electronic device, including: a device component; a pressure sensor integrated into a surface lining of the device component; and at least one adaptive gap-filling component situated between the surface lining of the device component and a wall of the electronic device that at least partially surrounds the device component. Other aspects are described and claimed.

Abstract: A substrate is capable of effectively reinforcing a connecting portion between an electronic component and the substrate. The substrate is a substrate on which a first electronic component having a plurality of bumps is to be mounted, and includes a base portion including an insulator and having, on the upper face thereof, at least one groove portion configured to store a tip portion of at least one of the bumps, and includes an electrode formed on at least the bottom face of the groove portion.

Abstract: One embodiment provides an electronic device, including: a battery pack stack comprising at least two battery packs; wherein the battery pack stack comprises at least one cumulative heat reducing component positioned between the at least two battery packs. Other aspects are described and claimed.

Abstract: A method can include powering circuitry via a lithium ion battery; during the powering, determining a discharge rate of the lithium ion battery; and, based at least in part on the determined discharge rate, adjusting a cut-off voltage for the lithium ion battery.

Abstract: One embodiment provides a device, including: a display device disposed in a device housing; a main battery disposed in the device housing; a supplemental battery disposed proximate to the display device; and a processor operatively coupled to the display device. Other aspects are described and claimed.

Abstract: One embodiment provides an information handling device, including: an electronic component; and a tape strip comprising: a top surface; and a bottom surface; wherein each of the top surface and the bottom surface comprise alternating sections of adhesive areas and non-adhesive areas; wherein the electronic component is adhered to the top surface of the tape strip via an adhesive connection between the adhesive areas located on the top surface of the tape strip and a bottom surface of the electronic component and wherein the tape strip is adhered to the information handling device via another adhesive connection between the adhesive areas. Other aspects are described and claimed.

Abstract: In one aspect, a battery includes at least one anode, at least one cathode, and electrolyte between the at least one anode and at least one cathode. The at least one cathode comprises at least a first charging material and at least a second charging material different from the first material.

Abstract: One embodiment provides a device, including: a device housing; a display device disposed in the device housing; a main battery disposed in the device housing; a supplemental battery operatively coupled to the main battery in a parasitic arrangement, wherein the main battery draws power from the supplemental battery; and a processor operatively coupled to the display device. Other aspects are described and claimed.

Abstract: Apparatuses, methods, and systems are disclosed for attaching structures. One system includes: a device having a first structure attached to a second structure; a first polymer coupled to the first structure, wherein the first polymer has a first temperature profile and a first shape; and a second polymer coupled to the second structure. The second polymer has a second temperature profile and a second shape. The second shape interlocks the first shape. The first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range. The first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.

Abstract: A device can include a processor; memory accessible by the processor; a battery bay that includes a first surface; a battery package disposed in the battery bay and operatively coupled to the processor, where the battery package includes a second surface; and materials disposed between the first surface and the second surface, where the materials include an adhesive and a thermoplastic.

Abstract: One embodiment provides a device, including: a battery; and a tape strip comprising: a top surface; a bottom surface; and at least one elevatable section, wherein the at least one elevatable section comprises an area, situated in the top surface, containing an adhesive; wherein the top surface is composed of a non-adhesive substance on all portions of the top surface not associated with the area and wherein the bottom surface is composed of the adhesive on all portions of the bottom surface not associated with the at least one elevatable section; wherein the battery is adhered to the top surface of the tape strip via an adhesive connection between the area containing the adhesive and a bottom surface of the battery, wherein the tape strip is adhered to the device via another adhesive connection between the bottom surface of the tape strip and an inner portion of the device.

Abstract: A substrate is capable of effectively reinforcing a connecting portion between an electronic component and the substrate. The substrate is a substrate on which a first electronic component having a plurality of bumps is to be mounted, and includes a base portion including an insulator and having, on the upper face thereof, at least one groove portion configured to store a tip portion of at least one of the bumps, and includes an electrode formed on at least the bottom face of the groove portion.

Abstract: An interposer is capable of efficiently reinforcing the connecting portion between an electronic component and a substrate. The interposer is used for mounting a first electronic component on a substrate and includes a sheet-shaped spacer having at least one through-hole and including a material that does not flow during reflow soldering and a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, and the through-hole is configured to store a bump of the first electronic component.

Abstract: An interposer is capable of efficiently reinforcing the connecting portion between an electronic component and a substrate. The interposer is used for mounting a first electronic component on a substrate and includes a sheet-shaped spacer having at least one through-hole and including a material that does not flow during reflow soldering and a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, and the through-hole is configured to store a bump of the first electronic component.