Abstract: A wafer processing apparatus used for the testing of electronic devices comprises first and second clampers movably mounted on a shaft, each clamper being configured for holding a wafer carrier on which a wafer is mounted. Clamping fingers on each of the first and second clampers are operative to clamp onto the wafer carrier to hold the wafer carriers, and the clampers are operative to move the wafer carriers reciprocally between a loading position and a wafer processing location for processing the wafers.

Abstract: A device handler for testing and sorting electronic devices has a testing station operative to test the electronic devices and to classify them according to different binning characteristics. A buffer assembly receives electronic devices which have been classified at the testing station, and the buffer assembly further comprises a first loading region having a plurality of receptacles and a second loading region having a plurality of receptacles. An output station is operative to unload electronic devices according to their different binning characteristics from either one of the first or second loading region of the buffer assembly for storage while electronic devices are being loaded onto the other loading region.

Abstract: A device handler for testing and sorting electronic devices has a testing station operative to test the electronic devices and to classify them according to different binning characteristics. A buffer assembly receives electronic devices which have been classified at the testing station, and the buffer assembly further comprises a first loading region having a plurality of receptacles and a second loading region having a plurality of receptacles. An output station is operative to unload electronic devices according to their different binning characteristics from either one of the first or second loading region of the buffer assembly for storage while electronic devices are being loaded onto the other loading region.