Patents by Inventor Ting-Chia Huang

Ting-Chia Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230197478
    Abstract: A system for transfer of a plurality of die from a die source to a receive substrate is provided. The system includes a die source including a plurality of die, the plurality of die being coupled to a carrier. The system also includes a receive substrate to receive the plurality of die from the die source. The receive substrate includes a die catch material for receiving the plurality of die from the die source, the die catch material being reusable. The system also includes a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate.
    Type: Application
    Filed: February 22, 2023
    Publication date: June 22, 2023
    Inventors: Thomas Colosimo, Tao-Hua Lee, Ting-Chia Huang
  • Patent number: 11615972
    Abstract: A system for transfer of a plurality of die from a die source to a receive substrate is provided. The system includes a die source including a plurality of die, the plurality of die being coupled to a carrier. The system also includes a receive substrate to receive the plurality of die from the die source. The receive substrate includes a die catch material for receiving the plurality of die from the die source, the die catch material being reusable. The system also includes a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: March 28, 2023
    Inventors: Thomas Colosimo, Tao-Hua Lee, Ting-Chia Huang
  • Publication number: 20220093423
    Abstract: A system for transfer of a plurality of die from a die source to a receive substrate is provided. The system includes a die source including a plurality of die, the plurality of die being coupled to a carrier. The system also includes a receive substrate to receive the plurality of die from the die source. The receive substrate includes a die catch material for receiving the plurality of die from the die source, the die catch material being reusable. The system also includes a laser source for providing energy to interact with a die release material to transfer the plurality of die from the die source to the receive substrate.
    Type: Application
    Filed: September 22, 2021
    Publication date: March 24, 2022
    Inventors: Thomas Colosimo, Tao-Hua Lee, Ting-Chia Huang