Patents by Inventor Ting Fang Lim

Ting Fang Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via-less thin film resistor with a dielectric cap
    Patent number: 8400257
    Abstract: The present disclosure is directed to a thin film resistor structure that includes a resistive element electrically connecting first conductor layers of adjacent interconnect structures. The resistive element is covered by a dielectric cap layer that acts as a stabilizer and heat sink for the resistive element. Each interconnect includes a second conductor layer over the first conductive layer. The thin film resistor includes a chromium silicon resistive element covered by a silicon nitride cap layer.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: March 19, 2013
    Assignees: STMicroelectronics PTE Ltd, STMicroelectronics, Inc.
    Inventors: Ting Fang Lim, Chengyu Niu, Olivier Le Neel, Calvin Leung
  • VIA-LESS THIN FILM RESISTOR WITH A DIELECTRIC CAP
    Publication number: 20120049997
    Abstract: The present disclosure is directed to a thin film resistor structure that includes a resistive element electrically connecting first conductor layers of adjacent interconnect structures. The resistive element is covered by a dielectric cap layer that acts as a stabilizer and heat sink for the resistive element. Each interconnect includes a second conductor layer over the first conductive layer. The thin film resistor includes a chromium silicon resistive element covered by a silicon nitride cap layer.
    Type: Application
    Filed: August 24, 2010
    Publication date: March 1, 2012
    Applicants: STMICROELECTRONICS, INC., STMICROELECTRONICS ASIA PACIFIC PTE LTD.
    Inventors: Ting Fang Lim, Chengyu Niu, Olivier Le Neel, Calvin Leung