Patents by Inventor Ting-Hsi LI

Ting-Hsi LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150129295
    Abstract: A double-shot injection molding formed LED lead frame structure includes an inner base having an inner bottom portion and an inner surrounding wall surrounding on top of the inner bottom portion, the inner surrounding wall forming a central hollow portion on top of the inner bottom portion, and the inner bottom portion having an inner surface facing toward the central hollow portion; a plurality of conductive pins with each one thereof constructed by a soldering section, a securement section and an extension section respectively; and an outer base comprising an outer bottom portion attached to a bottom of the inner bottom portion and an outer surrounding wall surrounding on top of the outer bottom portion and enclosing an outer of the inner surrounding wall; wherein each one of the securement sections of the conductive pins extends to arch between the inner bottom portion and the inner surrounding wall.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 14, 2015
    Applicant: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventors: Ting-Hsi LI, Yu-Jen LIN
  • Publication number: 20140075751
    Abstract: The invention relates to a method for manufacturing LED lead frame. The method comprises steps of: (a) forming a metal base with a plurality of lead areas by injection molding; (b) electroplating the metal base; and (c) forming an insulating casing on each of the lead areas.
    Type: Application
    Filed: January 2, 2013
    Publication date: March 20, 2014
    Applicant: I-CHIUN PRECISION INDUSTRY CO., LTD.
    Inventors: Ting-Hsi LI, Yu-Jen LIN