Patents by Inventor Ting Liao

Ting Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996332
    Abstract: A semiconductor device includes a semiconductor substrate, a first semiconductor stack, a second semiconductor stack, a first gate structure, and a second gate structure. The semiconductor substrate comprising a first device region and a second device region. The first semiconductor stack is located on the semiconductor substrate over the first device region, and has first channels. The second semiconductor stack is located on the semiconductor substrate over the second device region, and has second channels. A total number of the first channels is greater than a total number of the second channels. The first gate structure encloses the first semiconductor stack. The second gate structure encloses the second semiconductor stack.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Ting Pan, Chih-Hao Wang, Kuo-Cheng Chiang, Yi-Bo Liao, Yi-Ruei Jhan
  • Publication number: 20240171199
    Abstract: A wireless device control circuit with modularized internal circuit architecture and associated wireless communications device are provided. The wireless device control circuit may include a first digital processing circuit and a second digital processing circuit. The first digital processing circuit is arranged to perform first digital processing corresponding to a first predetermined radio frequency band for the wireless communications device, the first digital processing including common processing and a first additional processing. The second digital processing circuit is arranged to perform second digital processing corresponding to a second predetermined radio frequency band for the wireless communications device, the second digital processing including the common processing and a second additional processing.
    Type: Application
    Filed: November 9, 2023
    Publication date: May 23, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ping-Hung Kao, Yung-Ting Tsai, Ming-Fu Sun, Hsiao-Kai Liao
  • Publication number: 20240168326
    Abstract: The present disclosure provides a display panel and a manufacturing method therefor, and a display apparatus, which relate to the technical field of displaying. The display panel includes a first base plate and a second base plate which are aligned with each other; the first base plate includes a first substrate and a thin film transistor; the thin film transistor includes an active layer; an optical adjustment layer is disposed on the second base plate; an orthographic projection of the optical adjustment layer on the first substrate overlaps with an orthographic projection of the active layer on the first substrate. That is, the optical adjustment layer corresponds to the active layer. In a laminating direction of the display panel, the existence of the optical adjustment layer with a certain height enables a reflecting surface of the second base plate to be closer to the first base plate.
    Type: Application
    Filed: September 17, 2021
    Publication date: May 23, 2024
    Applicants: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yingying Qu, Lingdan Bo, Ting Dong, Jianhua Huang, Qiujie Su, Dongchuan Chen, Yanping Liao, Seungmin Lee, Jiantao Liu, Yue Yang
  • Publication number: 20240166788
    Abstract: A modified dicyclopentadiene-based resin is provided. The modified dicyclopentadiene-based resin is formed from a dicyclopentadiene-based resin having an amino group, a phenol and a polyoxymethylene by a cyclization reaction. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: March 6, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Yu-Ting Liu
  • Publication number: 20240166874
    Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: April 13, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240166817
    Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: April 11, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240166781
    Abstract: A modified dicyclopentadiene-based resin and a preparation method thereof are provided. The preparation method of the modified dicyclopentadiene-based resin includes sequentially performing nitration reaction and hydrogenation reaction of a dicyclopentadiene phenolic resin to form a modified dicyclopentadiene-based resin for which the structure has at least two amino groups. The hydrogenation reaction is performed in a solvent at a temperature of 50° C. to 120° C.
    Type: Application
    Filed: December 16, 2022
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang
  • Patent number: 11987677
    Abstract: A mechanically and piezoelectrically anisotropic polymer thin film is formed from a crystallizable polymer and an additive configured to interact with the polymer to facilitate chain alignment and, in some examples, create a higher crystalline content within the polymer thin film. The polymer thin film and its method of manufacture may be characterized by a bimodal molecular weight distribution where the molecular weight of the additive may be less than approximately 5% of the molecular weight of the crystallizable polymer. Example polymers may include vinylidene fluoride, trifluoroethylene, chlorotrifluoroethylene, hexafluoropropylene, and vinyl fluoride. Example additives may occupy up to approximately 60 wt. % of the polymer thin film. The polymer thin film may be characterized by a piezoelectric coefficient (d31) of at least approximately 5 pC/N or an electromechanical coupling factor (k31) of at least approximately 0.1.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: May 21, 2024
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Sheng Ye, Hao Mei, Cody Wayne Weyhrich, Arman Boromand, Andrew John Ouderkirk, Christopher Yuan Ting Liao, Emma Rae Mullen, Christopher Stipe, Nagi Hosni Elabbasi, Rui Jian
  • Publication number: 20240162088
    Abstract: An integrated circuit device includes an interconnect layer, a memory structure, a third conductive feature, and a fourth conductive feature. The interconnect layer includes a first conductive feature and a second conductive feature. The memory structure is over and in contact with the first conductive feature. The memory structure includes at least a resistance switching element over the first conductive feature. The third conductive feature, including a first conductive line, is over and in contact with the second conductive feature. The fourth conductive feature is over and in contact with the memory structure. The fourth conductive feature includes a second conductive line, a top surface of the first conductive line is substantially level with a top surface of the second conductive line, and a bottom surface of the first conductive line is lower than a bottommost portion of a bottom surface of the second conductive line.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 16, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsia-Wei CHEN, Fu-Ting SUNG, Yu-Wen LIAO, Wen-Ting CHU, Fa-Shen JIANG, Tzu-Hsuan YEH
  • Publication number: 20240157496
    Abstract: A method for facilitating analysis of causes of machining defects is provided. The method is carried out by a computer system. The method includes the step of obtaining motion data and vibration acceleration data about the tip of a cutter mounted on a machine tool. The method further includes the step of obtaining time-frequency information about the vibration acceleration data by performing a time-frequency analysis on the vibration acceleration data. The method further includes the step of obtaining vibration-displacement data by normalizing the time-frequency information. The method further includes the step of obtaining amplitude-distribution data about the tip by synchronizing the motion data and the vibration-displacement data.
    Type: Application
    Filed: December 19, 2022
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Ting CHEN, Jheng-Jie LIN, Chien-Chih LIAO, Jen-Ji WANG
  • Publication number: 20240161293
    Abstract: A multi-label classification method for generating labels annotated on medical images. An initial dataset including medical images and partial input labels is obtained. The partial input labels annotate a labeled part of abnormal features on the medical images. A first multi-label classification model is trained with the initial dataset. Difficulty levels of the medical images in the initial dataset are estimated based on predictions generated by the first multi-label classification model. The initial dataset is divided based on the difficulty levels of the medical images into different subsets. A second multi-label classification model is trained based on subsets with gradually increasing difficulty levels during different curriculum learning rounds. Predicted labels annotated on the medical images are generated about each of the abnormal features based on the second multi-label classification model.
    Type: Application
    Filed: November 16, 2023
    Publication date: May 16, 2024
    Inventors: Zhe-Ting LIAO, Yu-Shao PENG
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240153154
    Abstract: A coordinate generation system, a coordinate generation method, a computer readable recording medium with stored program, and a non-transitory computer program product are provided. The coordinate generation system includes processing units and a neural network module. The processing units are configured to obtain four vertex coordinates of an image. The vertex coordinates include first components and second components. The processing unit is configured to perform the following steps: obtaining first vector based on the first components of the four vertex coordinates and repeatedly concatenating the first vector so as to obtain a first input; obtaining second vector based on the second components of the four vertex coordinates and repeatedly concatenating the second vector so as to obtain a second input; and obtaining first output coordinate components and second output coordinate components of output coordinates based on the first input, the second input, and parameters of the neural network module.
    Type: Application
    Filed: January 17, 2023
    Publication date: May 9, 2024
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu-Hsuan Hung, Chun-Fu Liao, Kai-Ting Shr
  • Patent number: 11979977
    Abstract: A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.
    Type: Grant
    Filed: August 31, 2019
    Date of Patent: May 7, 2024
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Hsiao-Ting Hsu, Tao-Ming Liao, Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen
  • Patent number: 11980041
    Abstract: Various embodiments of the present application are directed towards an integrated chip comprising memory cells separated by a void-free dielectric structure. In some embodiments, a pair of memory cell structures is formed on a via dielectric layer, where the memory cell structures are separated by an inter-cell area. An inter-cell filler layer is formed covering the memory cell structures and the via dielectric layer, and further filling the inter-cell area. The inter-cell filler layer is recessed until a top surface of the inter-cell filler layer is below a top surface of the pair of memory cell structures and the inter-cell area is partially cleared. An interconnect dielectric layer is formed covering the memory cell structures and the inter-cell filler layer, and further filling a cleared portion of the inter-cell area.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsia-Wei Chen, Wen-Ting Chu, Yu-Wen Liao
  • Publication number: 20240145867
    Abstract: A separator for a lithium battery and a method for manufacturing the same are provided. The separator includes a substrate layer and a coating layer. The substrate layer is a polyolefin porous film and has a substrate thickness ranging from 10 to 30 micrometers. The coating layer is coated on the substrate layer, and has a coating layer thickness ranging from 1 to 5 micrometers. The coating layer includes a heat-resistant resin material and a plurality of inorganic ceramic particles glued in the heat-resistant resin material. The heat-resistant resin material has a melting point (Tm) or a glass transition temperature (Tg) of not less than 150° C. An average particle size of the inorganic ceramic particles is 10% to 40% of the coating layer thickness of the coating layer. The inorganic ceramic particles are stacked in the coating layer with a height of at least three layers.
    Type: Application
    Filed: January 17, 2023
    Publication date: May 2, 2024
    Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, CHENG-HUNG CHEN, LI-TING WANG
  • Publication number: 20240142687
    Abstract: A lighting assembly may include a light source and a reflective polarizer overlapping the light source. A portion of light that is incident on the reflective polarizer may not pass through the reflective polarizer and may be reflected back to the light source. The light source may include at least one of a light emitting diode (LED), a micro-LED, an organic light emitting diode (OLED), a micro-OLED, a liquid crystal on silicon (LCoS), or an fLCoS light source. The reflective polarizer may include a polymer birefringent multilayer structure of alternating first layers and second layers. The first layers may each include an isotropic polymer thin film the second layers each include an anisotropic polymer thin film. Various other devices, systems, and methods are also disclosed.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Inventors: Liliana Ruiz Diaz, Sheng Ye, Zhaoyu Nie, Tanya Malhotra, Christopher Yuan Ting Liao, Ehsan Vadiee, Andrew John Ouderkirk
  • Publication number: 20240141922
    Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Chun-Chieh Wang, Shu-Hao Kuo
  • Publication number: 20240138364
    Abstract: Disclosed is an air microorganism enrichment device in farms, and relates to the technical field of air microorganism collection.
    Type: Application
    Filed: January 11, 2023
    Publication date: May 2, 2024
    Inventors: Shaolun ZHAI, Chunling LI, Yan LI, Xia ZHOU, Ming LIAO, Mingfei SUN, Jianfeng ZHANG, Huahua KANG, Wenkang WEI, Ting YU
  • Patent number: 11972895
    Abstract: A high-voltage optical transformer may include (1) an array of light-emitting devices that are connected in parallel with one another and are electrically coupled to an electrical input, (2) a transfer medium, and (3) an array of photovoltaic cells that (A) are optically coupled to the array of light-emitting devices via the transfer medium, (B) are connected in series with one another, and (C) produce an electrical output whose voltage is higher than the electrical input. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: April 30, 2024
    Assignee: Meta Platforms Technologies, LLC
    Inventors: John Goward, Maik Andre Scheller, Anurag Tyagi, Jonathan Robert Peterson, Christopher Yuan Ting Liao