Patents by Inventor Ting Lu

Ting Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990351
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh, Chen-Hsuan Tsai
  • Patent number: 11990291
    Abstract: A multiple function button for an information handling system includes an outer shell and an inner button. The outer shell includes multiple channels having first, second, third and fourth channels. The inner button is inserted within the outer shell. The inner button includes a tab and a contact component. The tab moves within the multiple channels. When the tab is within the first channel, the inner button is in a first position and contact component is positioned over a first contact of the information handling system. When the tab is within the third channel, the inner button is in a second position and the contact component is positioned over a second contact of the information handling system.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: May 21, 2024
    Assignee: Dell Products L.P.
    Inventors: Jer-Yo Lee, Chun-Ting Lu, Cheng-Hsiang Chuang
  • Patent number: 11991752
    Abstract: A system and method for allocating network resources are disclosed herein. In one embodiment, the system and method are configured to perform: broadcasting at least one message indicating first and second formats. The first format is used by a plurality of wireless communication devices to send respective first random access preambles and the second format is used by the plurality of wireless communication devices to send respective second random access preambles. The first and second formats respectively correspond to first and second cell coverage ranges of a wireless communication node, wherein the second cell coverage range is greater than the first cell coverage range.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: May 21, 2024
    Assignee: ZTE CORPORATION
    Inventors: Xiubin Sha, Bo Dai, Ting Lu, Xu Liu
  • Publication number: 20240159752
    Abstract: Disclosed herein is a method for determining whether a subject has or is at risk of developing colorectal cancer with an ex vivo biological sample isolated from the subject. The method comprises: determining the levels of at least two target proteins with the aid of mass spectrometry, in which the at least two target proteins are selected from the group consisting of ADAM10, CD59, and TSPAN9; and assessing whether the subject has or is at risk of developing the colorectal cancer based on the levels of the at least two target proteins. The present method may serve as a potential means for diagnosing and predicting the incidence of colorectal cancer, and the subject in need thereof could receive a suitable therapeutic regimen in time in accordance with the diagnostic results produced by the present method.
    Type: Application
    Filed: February 20, 2023
    Publication date: May 16, 2024
    Applicant: Chang Gung University
    Inventors: Jau-Song YU, Srinivas DASH, Chia-Chun WU, Sheng-Fu CHIANG, Yu-Ting LU
  • Publication number: 20240154469
    Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment includes a magnetic attraction member and a connecting structure. The magnetic attraction member is independent from the lid and adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. At least a portion of the connecting structure is fixed to the container.
    Type: Application
    Filed: May 17, 2023
    Publication date: May 9, 2024
    Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
  • Publication number: 20240151346
    Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment is configured to be disposed on the lid or the body portion and includes a magnetic attraction member and a connecting structure. The magnetic attraction member is adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. The connecting structure includes a fastening member, and the fastening member is adapted to be detachably fastened to the body portion or the lid.
    Type: Application
    Filed: June 9, 2023
    Publication date: May 9, 2024
    Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
  • Publication number: 20240145094
    Abstract: A method for assessing occurrence of heart failure includes the following steps. A heart failure assessment program established is provided. A target ECG signal data of the subject is provided, wherein the target ECG signal data includes a plurality of target heartbeat waveform data and a plurality of target heart rate data. A data pre-processing step is performed, wherein the target ECG signal data is pre-processed by the data processing module so as to obtain a processed target ECG signal data. An analyzing step is performed, wherein the processed target ECG signal data is analyzed by the heart failure assessment program so as to obtain a heart failure occurrence assessing result, and the heart failure occurrence assessing result presents a heart failure occurring condition and the severity of the heart failure of the subject.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 2, 2024
    Applicant: China Medical University
    Inventors: Chin-Chi Kuo, Sheng-Ya Lu, Hsiu-Yin Chiang, Yu-Ting Lin
  • Publication number: 20240145412
    Abstract: A semiconductor device includes a logic circuit region having at least one core device and at least one input/output (I/O) device. The at least one core device has a first accumulative antenna ratio, and the at least one I/O device has a second accumulative antenna ratio. The first accumulative antenna ratio is greater than the second accumulative antenna ratio.
    Type: Application
    Filed: November 27, 2022
    Publication date: May 2, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Shih-Che Huang, Chao-Ting Chen, Jui-Fa Lu, Chi-Heng Lin
  • Publication number: 20240141295
    Abstract: This disclosure features novel cell lines and related methods for producing human natural killer (NK) cells, compositions of the NK cells produced by these methods, and uses thereof.
    Type: Application
    Filed: August 31, 2021
    Publication date: May 2, 2024
    Inventors: Jianhua Yu, Michael A. Caligiuri, Ting Lu
  • Publication number: 20240145494
    Abstract: An image sensor structure including a substrate, a first pixel structure, a second pixel structure, a dielectric layer, and a conductive layer stack is provided. The first pixel structure includes a first light sensing device. The second pixel structure includes a second light sensing device. The conductive layer stack includes conductive layers. The conductive layer stack has a first opening and a second opening. The first opening is located directly above the first light sensing device and passes through the conductive layers. The second opening is located directly above the second light sensing device and passes through the conductive layers. The second minimum width of the second opening is smaller than the first minimum width of the first opening. The luminous flux of the second pixel structure is different from the luminous flux of the first pixel structure.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 2, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Ju-Sheng Lu, Yi-Ting Wang, Ming-Chan Liu
  • Publication number: 20240136117
    Abstract: A multi-phase coupled inductor includes a first iron core, a second iron core, and a plurality of coil windings. The first iron core includes a first body and a plurality of first core posts. The plurality of first core posts are connected to the first body. The second iron core is opposite to the first iron core. The second iron core and the first body are spaced apart from each other by a gap. The plurality of coil windings wrap around the plurality of first core posts, respectively. Each of the coil windings has at least two coils.
    Type: Application
    Filed: October 1, 2023
    Publication date: April 25, 2024
    Inventors: HUNG-CHIH LIANG, PIN-YU CHEN, HANG-CHUN LU, YA-WEN YANG, YU-TING HSU, WEI-ZHI HUANG
  • Publication number: 20240124848
    Abstract: Provided are a stable lentivirus packaging cell line and a preparation method therefor. The stable lentivirus packaging cell line contains a packaging plasmid group consisting of a pPuro.coTetR plasmid, a pVSVG plasmid, and a pGagPol-RRE-NES-cINT plasmid, wherein the pPuro.coTetR plasmid contains a CoTetR gene, the pVSVG plasnid contains a VSVG gene, and the pGagPol-RRE-NES-cINT plasmid contains GagPol and Rev genes. The stable lentivirus packaging cell line is relatively stable in terms of passage, virus production, and a genetic gene copy number, and the lentivirus produced by using the stable lentivirus packaging cell line has a high titer and a low impurity content.
    Type: Application
    Filed: November 16, 2021
    Publication date: April 18, 2024
    Inventors: Feifei Qi, Xin'An Lu, Ting He, Cuiyun Deng
  • Patent number: 11945282
    Abstract: A gas detection and cleaning system for a vehicle is disclosed and includes an external modular base, a gas detection module and a cleaning device. The gas detection module is connected to a first external connection port of the external modular base to detect a gas in the vehicle and output the information datum. The information datum is transmitted through the first external connection port to a driving and controlling module of the external modular base, processed and converted into an actuation information datum for being externally outputted through a second external connection port of the external modular base. The cleaning device is connected with the second external connection port through an external port to receive the actuation information datum outputted from the second external connection port to actuate or close the cleaning device.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: April 2, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh, Tsung-I Lin, Yang Ku, Yi-Ting Lu
  • Patent number: 11948896
    Abstract: A package structure is provided. The package structure includes a through substrate via structure, a first stacked die package structure, an underfill layer, and a package layer. The through substrate via structure is formed over a substrate. The first stacked die package structure is over the through substrate via structure, wherein the first stacked die package structure comprises a plurality of memory dies. The underfill layer is over the first stacked die package structure. the package layer is over the underfill layer, wherein the package layer has a protruding portion that extends below a top surface of the through substrate via structure.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu
  • Patent number: 11950408
    Abstract: A method of manufacturing a semiconductor structure is provided. A conductive layer is formed on a precursor memory structure. A target layer is formed on the conductive layer. A first photoresist with a first opening is formed on the target layer. A spacer is formed on sidewalls of the first opening. A second photoresist with a second opening is formed on the target layer and the spacer. The target layer is patterned by the second photoresist and the spacer to form a first patterned target layer. A third photoresist with a third opening is formed on the first patterned target layer. The first patterned target layer is patterned by the third photoresist to form a second patterned target layer. The conductive layer is patterned by the second patterned target layer to form a patterned conductive layer including a ring structure aligned with a source/drain region.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: April 2, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Chiang-Lin Shih, Hsueh-Han Lu, Yu-Ting Lin
  • Patent number: 11949612
    Abstract: Methods, apparatus and systems for wireless communication nodes to discover each other are disclosed. In one embodiment, a method performed by a first wireless communication node is disclosed. The method comprises: transmitting, to each of a plurality of second wireless communication nodes, respective configuration information that is utilized by the second wireless communication node to transmit a discovery signal in order to be discovered by at least one other second wireless communication node. At least two of the plurality of second wireless communication nodes transmit their discovery signals at different time domain positions based on their respective configuration information.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: April 2, 2024
    Assignee: ZTE Corporation
    Inventors: Ting Miao, Feng Bi, Wenhao Liu, Youxiong Lu, Weimin Xing
  • Publication number: 20240093208
    Abstract: Provided herein are systems that provide a genetic program to control bacterial life cycle and function execution, thereby conferring programmable microbial transition between planktonic and biofilm states and facilitating the development of cellular functions across physiological domains.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 21, 2024
    Applicant: The Board of Trustees of the University of Illinois
    Inventors: Ting Lu, Wentao Kong
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240096986
    Abstract: A method includes forming a first gate spacer and a second gate spacer on a sidewall of a first gate structure. The first gate spacer is between the second gate spacer and the first gate structure. A first interlayer dielectric (ILD) layer is formed to surround the first gate spacer, the second gate spacer, and the first gate structure. A portion of the second gate spacer and a portion of the first ILD layer are removed simultaneously. A top surface of the second gate spacer is lower than a top surface of the first ILD layer.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Ting LI, Jen-Hsiang LU, Chih-Hao CHANG
  • Publication number: 20240098842
    Abstract: Service-related parameters may be communicated for a survival time measurement. Those parameters can be wirelessly communicated on the Radio Access Network (“RAN”) side. A measurement of the survival time and implementation of a survival time timer is based on those parameters and/or a timer for a packet delay budget.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Applicant: ZTE Corporation
    Inventors: Jie Tan, Xiubin Sha, Bo Dai, Ting Lu